JPS625642U - - Google Patents
Info
- Publication number
- JPS625642U JPS625642U JP9792885U JP9792885U JPS625642U JP S625642 U JPS625642 U JP S625642U JP 9792885 U JP9792885 U JP 9792885U JP 9792885 U JP9792885 U JP 9792885U JP S625642 U JPS625642 U JP S625642U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor package
- edge
- back surface
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の半導体デバイスの底面図、
第２図は同じく要部を示す部分断面図、第３図ａ
，ｂは半導体デバイスの底面図および要部部分断
面図である。
１０……半導体デバイス、１２……半導体パツ
ケージ、１４……リードピン、１６……凹部。
Figure 1 is a bottom view of the semiconductor device of this invention.
Figure 2 is a partial sectional view showing the main parts, Figure 3a
, b are a bottom view and a sectional view of a main part of the semiconductor device. DESCRIPTION OF SYMBOLS 10... Semiconductor device, 12... Semiconductor package, 14... Lead pin, 16... Recessed part.
補正 昭６０．７．２４
実用新案登録請求の範囲を次のように補正する
。Amendment July 24, 1980 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
半導体パツケージから延出するリードピンを該
半導体パツケージの裏面内方向に折曲した半導体
デバイスにおいて、
前記半導体パツケージ裏面の縁部を平らに形成
するとともに、この縁部にリードピンの先端部分
を各別に入れる凹部を形成したことを特徴とする
半導体デバイス。[Scope of claim for utility model registration] Lead pins extending from a semiconductor package are covered.
A semiconductor device that is bent inward on the back surface of a semiconductor package, characterized in that the edge of the back surface of the semiconductor package is formed flat, and recesses are formed in this edge to accommodate the tips of the lead pins individually. device.
Claims (1)
半導体パツケージの裏面内方向に折曲した半導体
デバイスにおいて、 前記半導体パツケージ裏面の縁部を平らに形成
するとともに、この縁部にリードピンの先端部分
を各別に入れる凹部を形成したことを特徴とする
半導体デバイス。[Claims for Utility Model Registration] In a semiconductor device in which lead pins extending from a semiconductor package are bent inward on the back surface of the outer semiconductor package, an edge of the back surface of the semiconductor package is formed flat, and a lead pin is attached to this edge. What is claimed is: 1. A semiconductor device characterized by forming recesses into which respective tip portions of the semiconductor device are inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9792885U JPS625642U (en) | 1985-06-27 | 1985-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9792885U JPS625642U (en) | 1985-06-27 | 1985-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625642U true JPS625642U (en) | 1987-01-14 |
Family
ID=30965385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9792885U Pending JPS625642U (en) | 1985-06-27 | 1985-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625642U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634535A (en) * | 1992-07-14 | 1994-02-08 | Hiroo Tarumi | Method for measuring dew formation and meter for dew formation |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169948A (en) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | Resin-sealed type semiconductor device |
| JPS6053066A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Semiconductor device |
-
1985
- 1985-06-27 JP JP9792885U patent/JPS625642U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169948A (en) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | Resin-sealed type semiconductor device |
| JPS6053066A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634535A (en) * | 1992-07-14 | 1994-02-08 | Hiroo Tarumi | Method for measuring dew formation and meter for dew formation |