JPH0412630U - - Google Patents
Info
- Publication number
- JPH0412630U JPH0412630U JP5401590U JP5401590U JPH0412630U JP H0412630 U JPH0412630 U JP H0412630U JP 5401590 U JP5401590 U JP 5401590U JP 5401590 U JP5401590 U JP 5401590U JP H0412630 U JPH0412630 U JP H0412630U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- hot plate
- wafer
- baking
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図ａ，ｂはこの考案の一実施例を示すベー
ク装置の断面図、および上面図、第２図はこの考
案によるウエハの湿度変化を示す図、第３図およ
び第５図は従来のベーク装置の断面図であり、第
４図および第６図はそれぞれ第３図および第５図
のベーク装置で、ベークを行つた場合のウエハの
温度変化を示す図である。
図において、１はホツトプレート、２は半導体
ウエハ、３はウエハ吸着用穴、４は薄膜テープで
ある。なお、各図中の同一符号は同一または相当
部分を示す。
Figures 1a and b are cross-sectional views and top views of a baking device showing one embodiment of this invention, Figure 2 is a diagram showing changes in humidity of a wafer according to this invention, and Figures 3 and 5 are views of a conventional baking device. FIG. 4 is a cross-sectional view of the baking apparatus, and FIGS. 4 and 6 are diagrams showing changes in temperature of a wafer when baking is performed using the baking apparatus of FIGS. 3 and 5, respectively. In the figure, 1 is a hot plate, 2 is a semiconductor wafer, 3 is a wafer suction hole, and 4 is a thin film tape. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
要数のウエハ吸着用穴を介して前記ホツトプレー
トに吸着し、前記半導体ウエハのベークを行うベ
ーク装置において、前記半導体ウエハとホツトプ
レートとの間に、前記ウエハ吸着用穴をそれぞれ
取り囲むように前記半導体ウエハとホツトプレー
トとの緩衝材となる薄膜板を装着したことを特徴
とする半導体ウエハのベーク装置。 In a baking device that sucks a semiconductor wafer onto the hot plate through a required number of wafer suction holes formed in the hot plate and bakes the semiconductor wafer, the wafer is placed between the semiconductor wafer and the hot plate. A semiconductor wafer baking apparatus characterized in that a thin film plate serving as a buffer between the semiconductor wafer and the hot plate is attached so as to surround each suction hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5401590U JPH0412630U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5401590U JPH0412630U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412630U true JPH0412630U (en) | 1992-01-31 |
Family
ID=31575703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5401590U Pending JPH0412630U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412630U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48113900U (en) * | 1972-03-29 | 1973-12-26 |
-
1990
- 1990-05-22 JP JP5401590U patent/JPH0412630U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48113900U (en) * | 1972-03-29 | 1973-12-26 |