JPH03122533U - - Google Patents
Info
- Publication number
- JPH03122533U JPH03122533U JP3217590U JP3217590U JPH03122533U JP H03122533 U JPH03122533 U JP H03122533U JP 3217590 U JP3217590 U JP 3217590U JP 3217590 U JP3217590 U JP 3217590U JP H03122533 U JPH03122533 U JP H03122533U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- tray
- dry etching
- placement part
- wafer tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Description
第１図ａおよびｂは本考案一実施例のドライエ
ツチ用ウエハートレーの組立図とトレー断面図で
あり、第２図ａおよびｂは本考案の他の実施例の
ウエハートレーの組立図とトレー断面図を示すも
のである。第３図ａおよびｂは従来のウエハート
レーの組立図と断面図である。
１…枠体、２…テフロンシート、３…止めリン
グ、４，１４…ウエハー、５…テフロンシート（
片面粘着）、１１…金属板。
Figures 1a and b are an assembled view and a cross-sectional view of a wafer tray for dry etching according to one embodiment of the present invention, and Figures 2a and b are an assembled view and a cross-sectional view of a wafer tray according to another embodiment of the present invention. The figure is shown below. Figures 3a and 3b are an assembled view and a sectional view of a conventional wafer tray. 1... Frame body, 2... Teflon sheet, 3... Stop ring, 4, 14... Wafer, 5... Teflon sheet (
one-sided adhesive), 11...metal plate.
Claims (1)
た薄膜をドライエツチングする装置に用いるウエ
ハートレーに於いて、ウエハー載置部がテフロン
シートまたはポリイミドシートで構成され、かつ
前記ウエハー載置部の底面がトレーの最下面にな
つている事を特徴とするドライエツチング用ウエ
ハートレー。 In a wafer tray used in an apparatus for dry etching a thin film formed on a semiconductor wafer using plasma, the wafer placement part is made of a Teflon sheet or a polyimide sheet, and the bottom surface of the wafer placement part is made of a tray. A wafer tray for dry etching characterized by a bottom surface of the wafer tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3217590U JPH03122533U (en) | 1990-03-28 | 1990-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3217590U JPH03122533U (en) | 1990-03-28 | 1990-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03122533U true JPH03122533U (en) | 1991-12-13 |
Family
ID=31535094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3217590U Pending JPH03122533U (en) | 1990-03-28 | 1990-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03122533U (en) |
-
1990
- 1990-03-28 JP JP3217590U patent/JPH03122533U/ja active Pending