JPH0350049U

JPH0350049U -

Info

Publication number: JPH0350049U
Application number: JP11060489U
Authority: JP
Priority date: 1989-09-21
Filing date: 1989-09-21
Publication date: 1991-05-15

Description

[Brief explanation of drawings]

第１図は本考案の一実施例による成膜装置の要
部を示す断面図、第２図は本考案の他の実施例に
よる成膜装置の要部を示す断面図、第３図はスパ
ツタリング装置の構成例を示す模式側面図、第４
図は基板電極にウエーハを保持せしめる従来の主
要構造の詳細を示す断面図、第５図は第４図に示
すウエーハ保持構造を主要構成に分解した斜視図
、である。図中において、５……基板電極（成膜用基板）
、８……ターゲツト、１１……ウエーハ、１２，
３２……ウエーハホルダ、１３……リング形状の
ばね、１４……リング形状ばねの突片、２１……
トレー、２２……透孔、２３……スカート、を示
す。 FIG. 1 is a cross-sectional view showing the main parts of a film forming apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the main parts of a film forming apparatus according to another embodiment of the present invention, and FIG. 3 is a sputtering Schematic side view showing an example of the configuration of the device, No. 4
The figure is a sectional view showing details of a conventional main structure for holding a wafer on a substrate electrode, and FIG. 5 is a perspective view of the wafer holding structure shown in FIG. 4 exploded into its main components. In the figure, 5...substrate electrode (substrate for film formation)
, 8...Target, 11...Wafer, 12,
32...Wafer holder, 13...Ring-shaped spring, 14...Protruding piece of ring-shaped spring, 21...
A tray, 22...through hole, 23...skirt are shown.

Claims

[Claims for Utility Model Registration] Ring-shaped wafer holders 12 and 32 into which the peripheral edge of the wafer 11 fits, and the wafer holder 1
2 and 32, the wafer 11 is attached to the film forming substrate 5.
a ring-shaped spring 13 that presses against the spring 13;
A tray 21 for holding the wafer 11, a target 8 facing the wafer 11, and a through hole 22 through which the film forming area of the wafer 11 is exposed.
A skirt 2 covering the spring 13 and the wafer holders 12 and 32 is placed in the tray 21 with the opening.
3 is provided at the inner edge of the through hole 22.