JPH01168551U - - Google Patents
Info
- Publication number
- JPH01168551U JPH01168551U JP6330988U JP6330988U JPH01168551U JP H01168551 U JPH01168551 U JP H01168551U JP 6330988 U JP6330988 U JP 6330988U JP 6330988 U JP6330988 U JP 6330988U JP H01168551 U JPH01168551 U JP H01168551U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sputtering
- film
- target material
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 239000013077 target material Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Description
第１図〜第４図はこの考案の一実施例を示した
もので、第１図はスパツタ装置の断面図、第２図
は基板ホルダの斜視図、第３図は基板を固定して
考えたときの基板面の一点に向かうスパツタ粒子
の飛来方向の変化を模式的に示す図、第４図は被
膜を形成された基板の拡大断面図である。第５図
は従来のスパツタ装置の断面図、第６図は従来の
スパツタ装置により被膜を形成された基板の拡大
断面図である。
１……真空槽、７……ターゲツト材、１０……
基板ホルダ、１１……ユニバーサルジヨイント、
１２……ホルダ揺動シリンダ、Ａ……基板、ａ…
…被膜。
Figures 1 to 4 show an embodiment of this invention. Figure 1 is a cross-sectional view of the sputtering device, Figure 2 is a perspective view of the substrate holder, and Figure 3 is an illustration of a fixed substrate. FIG. 4 is an enlarged cross-sectional view of the substrate on which the coating is formed. FIG. 5 is a sectional view of a conventional sputtering device, and FIG. 6 is an enlarged sectional view of a substrate on which a film is formed by the conventional sputtering device. 1... Vacuum chamber, 7... Target material, 10...
Board holder, 11...universal joint,
12... Holder swing cylinder, A... Board, a...
...film.
Claims (1)
るスパツタ装置において、前記基板を保持する基
板ホルダを、ターゲツト材面と平行な面に対して
揺動可能に設けたことを特徴とするスパツタ装置
。 A sputtering apparatus for depositing a film on a substrate surface by sputtering, characterized in that a substrate holder for holding the substrate is provided so as to be swingable relative to a plane parallel to a target material surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6330988U JPH01168551U (en) | 1988-05-16 | 1988-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6330988U JPH01168551U (en) | 1988-05-16 | 1988-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01168551U true JPH01168551U (en) | 1989-11-28 |
Family
ID=31288817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6330988U Pending JPH01168551U (en) | 1988-05-16 | 1988-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01168551U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007111097A1 (en) * | 2006-03-27 | 2007-10-04 | Shinmaywa Industries, Ltd. | Substrate holding apparatus |
| WO2008108018A1 (en) * | 2007-03-07 | 2008-09-12 | Shinmaywa Industries, Ltd. | Substrate holding device, target holding device, and vacuum film-forming apparatus |
| JP2008307197A (en) * | 2007-06-14 | 2008-12-25 | Nippon Pachinko Buhin Kk | Game machine |
-
1988
- 1988-05-16 JP JP6330988U patent/JPH01168551U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007111097A1 (en) * | 2006-03-27 | 2007-10-04 | Shinmaywa Industries, Ltd. | Substrate holding apparatus |
| JP2007262445A (en) * | 2006-03-27 | 2007-10-11 | Shin Meiwa Ind Co Ltd | Base material holding device |
| WO2008108018A1 (en) * | 2007-03-07 | 2008-09-12 | Shinmaywa Industries, Ltd. | Substrate holding device, target holding device, and vacuum film-forming apparatus |
| JP2008307197A (en) * | 2007-06-14 | 2008-12-25 | Nippon Pachinko Buhin Kk | Game machine |