JPH03120555U - - Google Patents

Info

Publication number
JPH03120555U
JPH03120555U JP2883790U JP2883790U JPH03120555U JP H03120555 U JPH03120555 U JP H03120555U JP 2883790 U JP2883790 U JP 2883790U JP 2883790 U JP2883790 U JP 2883790U JP H03120555 U JPH03120555 U JP H03120555U
Authority
JP
Japan
Prior art keywords
substrate holder
target
around
attached
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2883790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2883790U priority Critical patent/JPH03120555U/ja
Publication of JPH03120555U publication Critical patent/JPH03120555U/ja
Pending legal-status Critical Current

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Landscapes

  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係わる両面スパツタリング装
置の基板ホルダ部の一実施例を示す部分構成図、
第2図は従来例の断面構成図である。 31……基板ホルダ、31a……歯部、32…
…基板ホルダに垂直な軸、33〜35,37〜3
9……歯車、36……ターゲツトに水平な軸。
FIG. 1 is a partial configuration diagram showing an embodiment of the substrate holder part of the double-sided sputtering apparatus according to the present invention;
FIG. 2 is a cross-sectional configuration diagram of a conventional example. 31... Substrate holder, 31a... Teeth, 32...
...Axes perpendicular to the substrate holder, 33-35, 37-3
9...Gear, 36...Axle horizontal to the target.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 平板状のターゲツトを取り付けたスパツタリン
グ電極と、前記ターゲツトに垂直な軸を中心にタ
ーゲツトの回りを公転しながらターゲツト面に水
平な回転軸の回りを自転することが可能な基板ホ
ルダと、この基板ホルダに垂直な軸を中心に基板
ホルダを回転できる手段を設け、前記基板ホルダ
に取り付けた平板状の基板の両面に均一膜厚の薄
膜を形成することを特徴とする両面スパツタリン
グ装置。
A sputtering electrode to which a flat target is attached; a substrate holder capable of rotating around a rotational axis horizontal to the target surface while revolving around the target around an axis perpendicular to the target; and this substrate holder. 1. A double-sided sputtering apparatus characterized in that a means for rotating a substrate holder around an axis perpendicular to the substrate holder is provided, and a thin film having a uniform thickness is formed on both sides of a flat substrate attached to the substrate holder.
JP2883790U 1990-03-20 1990-03-20 Pending JPH03120555U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2883790U JPH03120555U (en) 1990-03-20 1990-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2883790U JPH03120555U (en) 1990-03-20 1990-03-20

Publications (1)

Publication Number Publication Date
JPH03120555U true JPH03120555U (en) 1991-12-11

Family

ID=31531625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2883790U Pending JPH03120555U (en) 1990-03-20 1990-03-20

Country Status (1)

Country Link
JP (1) JPH03120555U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101532629B1 (en) * 2015-05-11 2015-06-30 이공우 Contour reducing and massage device for face having movable pressure plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101532629B1 (en) * 2015-05-11 2015-06-30 이공우 Contour reducing and massage device for face having movable pressure plate

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