JPS6042729U - Film forming equipment - Google Patents
Film forming equipmentInfo
- Publication number
- JPS6042729U JPS6042729U JP13480883U JP13480883U JPS6042729U JP S6042729 U JPS6042729 U JP S6042729U JP 13480883 U JP13480883 U JP 13480883U JP 13480883 U JP13480883 U JP 13480883U JP S6042729 U JPS6042729 U JP S6042729U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- film forming
- forming equipment
- rotating bowl
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示す概略断面図である。第2図〜第4
図は本考案の一実施例を示し、第2図は概略断面図、第
3図は要部を示す一部切欠した拡大図、第4図はホルダ
駆動機構の構成を示す概略説明図である。
2・・・材料放出源(蒸発源)、12・・・回転椀、1
3・・・ウェハホルダ、16・・・ホルダ駆動機構。FIG. 1 is a schematic sectional view showing a conventional example. Figures 2 to 4
The figures show one embodiment of the present invention, FIG. 2 is a schematic sectional view, FIG. 3 is a partially cutaway enlarged view showing the main part, and FIG. 4 is a schematic explanatory view showing the configuration of the holder drive mechanism. . 2... Material release source (evaporation source), 12... Rotating bowl, 1
3... Wafer holder, 16... Holder drive mechanism.
Claims (1)
非軸心部分に複数のウェハホルダを設け、このウェハホ
ルダに支持させたウェハの表面に前記材料放出源側から
供給される材料を膜状に被着させ得るように構成した成
膜装置において、前記ウェハホルダを前記回転椀に対し
て自転可能に設けるとともに、前記回転椀の運動時に該
ウェハホルダを自転させるホルダ駆動機構を設けたこと
を特徴とする成膜装置。A plurality of wafer holders are provided on the off-axis portion of the rotating bowl that revolves around itself while facing the material ejection source, and the material supplied from the material ejection source side is applied in the form of a film onto the surface of the wafer supported by the wafer holders. In the film forming apparatus configured to be able to deposit the wafer on the wafer, the wafer holder is provided so as to be able to rotate relative to the rotating bowl, and a holder drive mechanism is provided that rotates the wafer holder when the rotating bowl moves. Film forming equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13480883U JPS6042729U (en) | 1983-08-31 | 1983-08-31 | Film forming equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13480883U JPS6042729U (en) | 1983-08-31 | 1983-08-31 | Film forming equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6042729U true JPS6042729U (en) | 1985-03-26 |
Family
ID=30303645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13480883U Pending JPS6042729U (en) | 1983-08-31 | 1983-08-31 | Film forming equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6042729U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03191059A (en) * | 1989-12-20 | 1991-08-21 | Matsushita Electric Ind Co Ltd | Sputtering device |
JP2007100123A (en) * | 2005-09-30 | 2007-04-19 | Kyocera Kinseki Corp | Vacuum vapor deposition apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5458690A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Vapor deposition apparatus |
-
1983
- 1983-08-31 JP JP13480883U patent/JPS6042729U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5458690A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Vapor deposition apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03191059A (en) * | 1989-12-20 | 1991-08-21 | Matsushita Electric Ind Co Ltd | Sputtering device |
JP2007100123A (en) * | 2005-09-30 | 2007-04-19 | Kyocera Kinseki Corp | Vacuum vapor deposition apparatus |
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