JPS6453754U - - Google Patents

Info

Publication number
JPS6453754U
JPS6453754U JP15060287U JP15060287U JPS6453754U JP S6453754 U JPS6453754 U JP S6453754U JP 15060287 U JP15060287 U JP 15060287U JP 15060287 U JP15060287 U JP 15060287U JP S6453754 U JPS6453754 U JP S6453754U
Authority
JP
Japan
Prior art keywords
substrate
holding mechanism
circular opening
sputtering apparatus
annular holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15060287U
Other languages
Japanese (ja)
Other versions
JPH0343233Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987150602U priority Critical patent/JPH0343233Y2/ja
Publication of JPS6453754U publication Critical patent/JPS6453754U/ja
Application granted granted Critical
Publication of JPH0343233Y2 publication Critical patent/JPH0343233Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の基板保持機構を備えたスパツ
タリング装置の概略図で、第２図は第１図におけ
る基板保持機構の詳細拡大断面図で、第３図は第
２図の変形である。 ３〜パレツト回転装置、４〜パレツト、６〜円
形開口部、７〜保持機構、８〜環状ホルダー、９
〜円環状ホルダー本体、１０〜保持板、１１〜保
持部材、Ｗ〜基板。 1 is a schematic diagram of a sputtering apparatus equipped with a substrate holding mechanism of the present invention, FIG. 2 is a detailed enlarged sectional view of the substrate holding mechanism in FIG. 1, and FIG. 3 is a modification of FIG. 2. 3-pallet rotation device, 4-pallet, 6-circular opening, 7-holding mechanism, 8-annular holder, 9
- Annular holder main body, 10 - holding plate, 11 - holding member, W - substrate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 垂直状態の回転パレツトに設けた円形開口部に
基板を保持し、この基板を自転・公転させながら
処理するスパツタリング装置における基板保持機
構において、前記基板保持機構を、前記円形開口
部に回転自在な遊嵌状態で設けた環状ホルダーと
、該環状ホルダーに取り付けられ前記基板を着脱
可能に保持する保持部材とで構成したことを特徴
とするスパツタリング装置における基板保持機構
。 In a substrate holding mechanism in a sputtering apparatus that holds a substrate in a circular opening provided in a rotating pallet in a vertical state and processes the substrate while rotating and revolving, the substrate holding mechanism is attached to a rotatable idler in the circular opening. 1. A substrate holding mechanism in a sputtering apparatus, comprising: an annular holder provided in a fitted state; and a holding member attached to the annular holder and detachably holding the substrate.
JP1987150602U 1987-09-30 1987-09-30 Expired JPH0343233Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987150602U JPH0343233Y2 (en) 1987-09-30 1987-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987150602U JPH0343233Y2 (en) 1987-09-30 1987-09-30

Publications (2)

Publication Number Publication Date
JPS6453754U true JPS6453754U (en) 1989-04-03
JPH0343233Y2 JPH0343233Y2 (en) 1991-09-10

Family

ID=31423894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987150602U Expired JPH0343233Y2 (en) 1987-09-30 1987-09-30

Country Status (1)

Country Link
JP (1) JPH0343233Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191059A (en) * 1989-12-20 1991-08-21 Matsushita Electric Ind Co Ltd Sputtering device
JPH0452275A (en) * 1990-06-20 1992-02-20 Hitachi Ltd Sputtering device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56598U (en) * 1979-06-16 1981-01-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56598U (en) * 1979-06-16 1981-01-06

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191059A (en) * 1989-12-20 1991-08-21 Matsushita Electric Ind Co Ltd Sputtering device
JPH0452275A (en) * 1990-06-20 1992-02-20 Hitachi Ltd Sputtering device

Also Published As

Publication number Publication date
JPH0343233Y2 (en) 1991-09-10

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