JPH0343233Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to a substrate holding mechanism in a sputtering apparatus that processes a substrate while giving it rotation and revolution.

(Prior Art and its Problems) As a method for forming a thin film on the surface of a substrate such as a magnetic disk or an optical disk by sputtering, there is a method in which the substrate is rotated and revolved during the sputtering process.

That is, by forming an annular groove on the inner circumferential surface of each of the plurality of circular openings provided in the pallet, positioning a disc-shaped substrate within the annular groove, and rotating the pallet while holding it vertically. The sputtering process is performed while rotating and revolving the substrate.

By the way, as mentioned above, when the substrate is held through the annular groove of the circular opening of the pallet, the thin film formed on the outer peripheral edge of the substrate or the thin film formed on the inner wall of the groove is removed during the sputtering process. There is a problem in that due to friction between the substrate and the annular groove, the substrate peels off, becomes dust, and adheres to the substrate, resulting in defects in the thin film. Furthermore, since the substrate is held directly through the annular groove, there is a limit to the rotation speed of the substrate itself, and there is a problem in that the necessary rotation speed cannot be secured.

Therefore, the present invention provides an autorotation/revolution type sputtering device that can solve the above-mentioned conventional problems by mounting the substrate in the circular opening of the pallet through a holding mechanism with a simple structure. The purpose is to provide a substrate holding mechanism.

(Means to Solve the Problems) In order to achieve the above object, the present invention provides a method for attaching a substrate holding mechanism in a sputtering apparatus to an annular holder loosely fitted into a circular opening of a pallet, and to the annular holder. and a holding member that removably holds the board.

(Example) Next, an example of the present invention will be described with reference to the accompanying drawings.

Fig. 1 shows an outline of a rotating/revolving type magnetron sputtering device, in which 1 is a processing chamber, and both side walls 2 of this processing chamber 1 are provided with pallet rotating devices 3. A pallet 4 holding a large number of substrates W by a holding mechanism 7 described below is supported at its shaft portion 5 by the pallet rotating device 3 so as to be able to approach and separate from it, and is also rotatable.

Further, a plurality of sputtering electrodes 13 are arranged radially on both side walls 2 so as to face the substrate W.

The holding mechanism 7 consists of an annular holder 8 installed in the circular opening 6 of the pallet 4 and a holding member 11 for the substrate W, as shown in FIG.

The annular holder 8 has an annular holder main body 9 whose outer diameter is smaller than the diameter of the opening 6, and is attached to both sides of the annular holder main body 9, and has a free space with the peripheral part of the opening 6. The holding member 11 is made up of a spring-type clip that fits and holds the outer circumferential portion of the substrate W, and the holding member 11 is made of a spring-type clip that fits and holds the outer peripheral portion of the substrate W.
They are attached at three equally spaced locations.

In the above configuration, in order to sputter the substrate W while it rotates and revolves, first, the outer circumference of the circular substrate W is fitted into the recess 12 of the holding member 11, and the substrate W is placed in the opening 6 of the pallet 4.
fixing device.

Then, the pallet 4 is rotated by the pallet rotating device 3.
The shaft portion 5 of the shaft 5 is held and rotated.

In this case, since the substrate W is fixedly held via the rotatable annular holder 8 while being loosely fitted into the opening 6 of the pallet 4, the annular holder 8 rotates in the opposite direction as the pallet 4 rotates. As a result, the substrate W is sputtered while rotating and revolving, and the surrounding area of the opening 6 is not sputtered due to the shielding effect of the holding plate 10.

In the above embodiment, the holding plate 10 is attached to the annular holder main body 9, but the holding plate 10 may be attached to the pallet 4 as shown in FIG. Further, the holding member 11 is not limited to a spring type clip, but may be a magnetic chuck or a twist lock type.

(Effects of the invention) As is clear from the above explanation, according to the invention, the substrate is fixedly supported by the holding member, and the annular holder with the holding member attached is loosely fitted into the circular opening of the pallet. Since it is rotatably mounted, the thin film on the outer peripheral edge of the substrate does not peel off and scatter as dust during sputtering. Furthermore, the rotation speed of the substrate can be easily changed by selecting an annular holder with a suitable outer diameter.

In addition, as a means of attaching the board to the holder,
If spring-type clips are used as in the embodiment, the board can be attached and detached very easily.

[Brief explanation of drawings]

1 is a schematic diagram of a sputtering apparatus equipped with a substrate holding mechanism of the present invention, FIG. 2 is a detailed enlarged sectional view of the substrate holding mechanism in FIG. 1, and FIG. 3 is a modification of FIG. 2. 3-pallet rotation device, 4-pallet, 6-circular opening, 7-holding mechanism, 8-annular holder, 9
- Annular holder main body, 10 - holding plate, 11 - holding member, W - substrate.

Claims (1)

[Scope of utility model registration request] In a substrate holding mechanism in a sputtering apparatus that holds a substrate in a circular opening provided in a rotating pallet in a vertical state and processes the substrate while rotating and revolving, the substrate holding mechanism is attached to a rotatable idler in the circular opening. 1. A substrate holding mechanism in a sputtering apparatus, comprising: an annular holder provided in a fitted state; and a holding member attached to the annular holder and detachably holding the substrate.