JPH0826455B2 - Sputtering device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering device, and more particularly to a mechanical system of a sputtering device for forming a thin film on the surface of a substrate mounted on a substrate holder while revolving around the substrate. Regarding

[Conventional technology]

The sputtering device is widely used as a means for forming a thin film on a substrate. There are many types of sputtering methods, but in order to ensure the uniformity of film formation, a method of forming a film while rotating the substrate facing the target is revolved.

There is also a method of forming a film while holding the substrate in a vertical state in order to reduce impurities or defects in the film.

On the other hand, in order to improve the productivity of the equipment, a method is adopted in which target electrodes are placed on both wall surfaces of the sputtering chamber which face each other, and film formation is performed from both sides of the substrate holder that has passed through or moved between the target electrodes.

However, if you try to satisfy the above conditions at the same time,
As for the structural arrangement of the auto-revolution mechanism, as in Japanese Patent Laid-Open No. 63-282260, the drive source thereof is a motor provided at a position opposite to both side wall portions of the sputter chamber. At this time, spatter particles adhere to the power transmission shaft of the drive motor that is exposed on the substrate surface side, causing peeling that is a source of foreign matter, and a large amount of foreign matter from the gear section and bearing section of the auto-revolution mechanism section. Therefore, these foreign substances and dust are the main causes of hindering the formation of high quality films.

[Problems to be Solved by the Invention]

The above-mentioned conventional technique is carried out via a motor or a transmission shaft arranged on the film formation source side, and the influence of dust generation from these is not sufficiently taken into consideration, and dust adheres to the vertical rotation substrate. There was a problem.

The present invention has been made in view of the above points, and an object of the present invention is to prevent adhesion of sputtered particles to a rotation-and-revolution substrate holder drive system to prevent generation of foreign matter, as well as to prevent the generation of foreign matter. It is an object of the present invention to provide a sputtering apparatus capable of performing high-quality film formation while suppressing dust generation and minimizing the influence on the film formation surface.

[Means for solving the problem]

In order to achieve the above object, the present invention arranges two substrate holders so as to face both side wall portions of a vacuum container supporting a target electrode, respectively, and to form a substantially circular plate in a plane space between the two substrate holders. -Shaped rotation and revolution mechanism section is provided, and permanent magnets are arranged close to the periphery of the rotation and revolution mechanism section with alternating polarities, while on the other hand, on the periphery of the substrate support plate on which the substrate is placed and rotates. In addition, permanent magnets are arranged with alternating polarities, a permanent magnet is also provided on the peripheral edge of the substrate holder, and the substrate holder is revolved outside the auto-revolution mechanism section. Accordingly, the sputtering apparatus is provided with a magnetic generation source that moves or varies the strength so as to give a driving force for rotating the substrate.

[Action]

Permanent magnets are arranged around the self-revolving mechanism with alternating poles. At this time, if the permanent magnet is regarded as the rotor of the motor, the stator that gives the rotation driving force is arranged around the permanent magnet so that the permanent magnet is similar to the motor, and the substrate holder can revolve. On the other hand, by similarly arranging the poles of the permanent magnets alternately on the substrate support plate, as the substrate holder revolves, the substrate can rotate on the basis of the same relationship as above.

As described above, the substrate holder and the substrate support plate can be revolved in a non-contact manner without using a motor transmission shaft or the like.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

As shown in the figure, target electrodes 12 on which targets to be film-forming materials are mounted are attached to both walls of the vacuum container 11. Substrate holders 2 are arranged at positions substantially facing each of the targets, and a plurality of substrate support plates 3 on which the substrates 1 to be deposited are placed are attached to the surface of the substrate holders. A magnet plate 4 for rotation is connected to the substrate support plate 3 on the opposite side of the substrate holder 2 via a shaft 5 for rotation. As shown in the figure, magnets are alternately arranged around the rotating magnet plate 4 so that the polarities thereof are different from each other.

On the other hand, the substrate holder 2 is connected to both sides of the auto-revolution mechanism section 6 via a revolution shaft 8. As shown in the figure, the revolving mechanism 6 has magnets 7 arranged so as to have polarities different from each other.
Has been arranged.

Further, a magnetic device 9 composed of a stator coil or a magnet for moving the magnetic pole or changing the strength thereof is arranged in the lower part.

First, the polar part of the magnet 7 of the auto-revolution mechanism 6 different from the magnetic pole of the magnetic device 9 provided at the bottom of the auto-revolution mechanism 6 is magnetically attracted. That is, the S and N poles of the magnet are attracted.
Next, when the polarity of the magnetic device 9 is moved or changed, the self-revolving mechanism section 6 receives a force by the magnetic attraction force and starts to move. When the movement of the polarity or the extreme change is repeated, the revolving mechanism section 6 eventually causes the magnetic device 9 which is a driving force source and the substrate holder 2 which is a rotated body to operate in the same principle as a so-called motor. It will start rotating with contact. Next, the substrate holder 2 is provided with a substrate support plate 3 and a rotation magnet plate 4 for each substrate 1. The outer periphery of the magnet plate 4 for rotation is a magnet 7 provided on the rotation mechanism part 6.
Of the magnet 7 provided in the revolving mechanism section 6 so as to be inscribed in the row of the magnets. At the same time, the different poles are attracted to each other by the magnetic attraction force, and the rotational driving force is transmitted as before. In this case as well, the row of the magnets 7 serving as the driving source and the substrate support plate 3 serving as the rotated body start rotating without being in contact with each other.

As described above, by operating the magnetic device 9 provided outside the auto-revolution mechanism unit 6, the substrate holder 2 can be brought into a non-contact state.
It is possible to revolve the substrate 1 provided on the substrate. Therefore, since the sliding and the hindrance peculiar to the mechanical system are eliminated, it is possible to suppress the generation of foreign matter except for the revolving shaft portion, and it is possible to form a high quality film.

Further, by providing this mechanism section between the substrate holders, the deposition of the film-forming material due to sputtering is almost eliminated, and it is possible to further reduce foreign matters.

Another embodiment is shown in FIG. 3 and FIG. In the example shown in the figure, an annular stator pole 10 is provided over the entire circumference of the revolving mechanism 6 in place of the magnetic device 9 described above. According to this, a sufficient driving force can be obtained even if the auto-revolution mechanism system becomes large.

〔The invention's effect〕

According to the sputtering apparatus of the present invention described above,
The two substrate holders are arranged so as to face both side wall portions of the vacuum container supporting the target electrode, respectively.
A substantially disk-shaped revolving mechanism is provided in the plane space between two substrate holders, and permanent magnets are arranged close to the periphery of the revolving mechanism in alternating polarities. Permanent magnets are also arranged with alternating polarities also on the periphery of the substrate supporting plate that is placed and rotated, and further, permanent magnets are also provided on the peripheral portion of the substrate holder, and outside the rotation and revolution mechanism part, Since the substrate holder is revolved, and the substrate holder drive system is equipped with a magnetic generation source that moves or changes the strength to give a driving force for the substrate to rotate with the revolution of the substrate holder. Since it is arranged between the two substrate holders, it is of course possible to prevent the sputtered particles from adhering to the rotation / revolution substrate holder drive system to prevent the generation of foreign matter.
The drive mechanism part of the rotation substrate holder is a non-contact type that does not require mechanical contact parts such as movement and friction, so that dust generation from the drive mechanism part of the rotation substrate holder is suppressed and the influence on the film formation surface Can be minimized and high quality film formation can be performed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a sputtering apparatus of the present invention, FIG. 2 is a front view showing a partially revolving mechanism part thereof in section, and FIG. 3 is a cross-sectional view showing another embodiment of the present invention. FIG. 4 is a front view showing a part of the auto-revolution mechanism section. DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Substrate holder, 3 ... Substrate support plate, 4 ... Rotation magnet plate, 5 ... Rotation shaft, 6 ... Revolution mechanism, 7 ... Magnet,
8 ... Revolution axis, 9 ... Magnetic device, 10 ... Stator pole, 11 ... Vacuum container, 12 ... Target electrode.

Claims (1)

[Claims] 1. A substrate holder, which holds a plurality of substrates to be deposited on a concentric circle, is held vertically while facing a target electrode provided on a side wall of a vacuum container, and the substrate is held on the surface of the substrate holder. In a sputtering apparatus for forming a thin film by revolving the substrate, the two substrate holders are arranged so as to face both side wall portions of the vacuum container supporting the target electrode, respectively, and a plane space between the two substrate holders is arranged. A substantially disk-shaped revolving mechanism part is provided inside, and permanent magnets are arranged close to each other on the periphery of the revolving mechanism part with alternating polarities, while the substrate is placed and rotated. Permanent magnets are also arranged on the periphery of the substrate support plate with alternating polarities, and permanent magnets are also provided on the periphery of the substrate holder, and the substrate holder is revolved outside the rotation mechanism. Let A sputtering apparatus comprising a magnetic generation source capable of moving or varying the strength of the substrate holder so as to give a driving force for rotating the substrate holder around its axis.