JPS6367065U - - Google Patents

Info

Publication number
JPS6367065U
JPS6367065U JP1986162646U JP16264686U JPS6367065U JP S6367065 U JPS6367065 U JP S6367065U JP 1986162646 U JP1986162646 U JP 1986162646U JP 16264686 U JP16264686 U JP 16264686U JP S6367065 U JPS6367065 U JP S6367065U
Authority
JP
Japan
Prior art keywords
carrier
magnet
wafer
surface plate
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986162646U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986162646U priority Critical patent/JPS6367065U/ja
Publication of JPS6367065U publication Critical patent/JPS6367065U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による一実施例を示す側断面図
、第2図は本考案による一実施例を示すA―A断
面図、第3図は従来の研磨装置を示す側断面図、
である。 図において、1は上部定盤、2は下部定盤、3
は太陽ギア、4はインターナルギア、5はキヤリ
ア、5aはギア部、6はウエーハ、7は上部磁石
、8は下部磁石、を示す。
FIG. 1 is a side sectional view showing one embodiment of the present invention, FIG. 2 is an AA sectional view showing one embodiment of the present invention, and FIG. 3 is a side sectional view showing a conventional polishing device.
It is. In the figure, 1 is the upper surface plate, 2 is the lower surface plate, and 3
4 is a sun gear, 4 is an internal gear, 5 is a carrier, 5a is a gear portion, 6 is a wafer, 7 is an upper magnet, and 8 is a lower magnet.

Claims (1)

【実用新案登録請求の範囲】 キヤリア5によつて保持されたウエーハ6を、
回転する上下二枚の定盤1,2の間に挾んで研磨
する研磨装置であつて、 上部定盤1の上部の前記キヤリア5の真上に上
部磁石7、下部定盤2の下部の前記キヤリア5の
真下に下部磁石8を配設し、 強磁性材料よりなる前記キヤリア5を用いて前
記ウエーハ6を研磨することを特徴とする研磨装
置。
[Claims for Utility Model Registration] The wafer 6 held by the carrier 5 is
It is a polishing device that performs polishing by being sandwiched between two rotating upper and lower surface plates 1 and 2, and the upper magnet 7 is placed directly above the carrier 5 on the upper part of the upper surface plate 1, and the said magnet 7 is placed on the lower part of the lower surface plate 2. A polishing apparatus characterized in that a lower magnet 8 is disposed directly below the carrier 5, and the wafer 6 is polished using the carrier 5 made of a ferromagnetic material.
JP1986162646U 1986-10-22 1986-10-22 Pending JPS6367065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986162646U JPS6367065U (en) 1986-10-22 1986-10-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986162646U JPS6367065U (en) 1986-10-22 1986-10-22

Publications (1)

Publication Number Publication Date
JPS6367065U true JPS6367065U (en) 1988-05-06

Family

ID=31090108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986162646U Pending JPS6367065U (en) 1986-10-22 1986-10-22

Country Status (1)

Country Link
JP (1) JPS6367065U (en)

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