JPS6440505U - - Google Patents
Info
- Publication number
- JPS6440505U JPS6440505U JP13469587U JP13469587U JPS6440505U JP S6440505 U JPS6440505 U JP S6440505U JP 13469587 U JP13469587 U JP 13469587U JP 13469587 U JP13469587 U JP 13469587U JP S6440505 U JPS6440505 U JP S6440505U
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grain
- substrate layer
- grain density
- cutting
- dicing blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000006061 abrasive grain Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
その断面図である。第３図は、本考案の他の実施
例の平面図、第４図はその断面図である。第５図
は、従来のブレードの平面図、第６図はその断面
図である。
１……基板層、２ａ，２ｂ……切刃層、３……
単層の切刃層。
FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view thereof. FIG. 3 is a plan view of another embodiment of the present invention, and FIG. 4 is a sectional view thereof. FIG. 5 is a plan view of a conventional blade, and FIG. 6 is a sectional view thereof. 1... Substrate layer, 2a, 2b... Cutting edge layer, 3...
Single layer cutting edge layer.
Claims (1)
ードにおいて、砥粒密度が低く金属バインダ量の
多い基板層と、基板層の両主面に各々配置した砥
粒密度の高い切刃層から構成したことを特徴とす
る半導体ウエハダイシングブレード。 A dicing blade for cutting and dividing semiconductor wafers is characterized by consisting of a substrate layer with a low abrasive grain density and a large amount of metal binder, and a cutting blade layer with a high abrasive grain density arranged on both main surfaces of the substrate layer. Semiconductor wafer dicing blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13469587U JPS6440505U (en) | 1987-09-02 | 1987-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13469587U JPS6440505U (en) | 1987-09-02 | 1987-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6440505U true JPS6440505U (en) | 1989-03-10 |
Family
ID=31393681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13469587U Pending JPS6440505U (en) | 1987-09-02 | 1987-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6440505U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01180220U (en) * | 1988-06-08 | 1989-12-25 |
-
1987
- 1987-09-02 JP JP13469587U patent/JPS6440505U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01180220U (en) * | 1988-06-08 | 1989-12-25 | ||
| JPH0332344Y2 (en) * | 1988-06-08 | 1991-07-09 |
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