JPS6418733U - - Google Patents
Info
- Publication number
- JPS6418733U JPS6418733U JP11303687U JP11303687U JPS6418733U JP S6418733 U JPS6418733 U JP S6418733U JP 11303687 U JP11303687 U JP 11303687U JP 11303687 U JP11303687 U JP 11303687U JP S6418733 U JPS6418733 U JP S6418733U
- Authority
- JP
- Japan
- Prior art keywords
- chips
- chip
- semiconductor wafer
- semiconductor
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 9
- 238000002161 passivation Methods 0.000 claims description 4
Description
第１図はこの考案の半導体チツプ用材料の一実
施例をあらわす平面図、第２図は第１図の―
線断面図、第３図はこの実施例の半導体チツプ用
材料から切り出された半導体チツプをあらわす斜
視図、第４図は従来の半導体チツプ用材料の一例
をあらわす平面図、第５図はこの従来例の半導体
チツプ用材料から切り出された半導体チツプをあ
らわす平面図である。
１……パツシベーシヨン膜、１ａ……パツシベ
ーシヨン膜角部、Ａ……半導体チツプ用材料、Ｅ
……素子。
Fig. 1 is a plan view showing an embodiment of the semiconductor chip material of this invention, and Fig. 2 is a plan view of the semiconductor chip material of this invention.
3 is a perspective view showing a semiconductor chip cut out from the semiconductor chip material of this embodiment, FIG. 4 is a plan view showing an example of a conventional semiconductor chip material, and FIG. 5 is a plan view showing an example of the conventional semiconductor chip material. FIG. 2 is a plan view showing a semiconductor chip cut out from an example semiconductor chip material. 1... Passivation film, 1a... Passivation film corner, A... Material for semiconductor chip, E
……element.
Claims (1)
ぞれのチツプ上に実装されるべき多数の素子が前
記半導体ウエハ上に形成され、この各素子を覆う
よう各チツプに相当する半導体ウエハ表面がチツ
プの数だけのパツシベーシヨン膜で被覆されてな
る半導体チツプ用材料であつて、分割後のチツプ
角部に相当するパツシベーシヨン膜角部が滑らか
な曲面を描いて一辺から他辺に繋がれていること
を特徴とする半導体チツプ用材料。 When a semiconductor wafer is divided into a large number of chips, a large number of elements to be mounted on each chip are formed on the semiconductor wafer, and the surface of the semiconductor wafer corresponding to each chip is covered with the same number of chips as the number of chips. A semiconductor chip material coated with a passivation film, characterized in that the corners of the passivation film corresponding to the corners of the chip after division form a smooth curved surface and are connected from one side to the other. Materials for semiconductor chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11303687U JPS6418733U (en) | 1987-07-22 | 1987-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11303687U JPS6418733U (en) | 1987-07-22 | 1987-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418733U true JPS6418733U (en) | 1989-01-30 |
Family
ID=31352519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11303687U Pending JPS6418733U (en) | 1987-07-22 | 1987-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418733U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997047029A1 (en) * | 1996-06-07 | 1997-12-11 | Rohm Co., Ltd. | Semiconductor chip and method for manufacturing the same |
-
1987
- 1987-07-22 JP JP11303687U patent/JPS6418733U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997047029A1 (en) * | 1996-06-07 | 1997-12-11 | Rohm Co., Ltd. | Semiconductor chip and method for manufacturing the same |