JPS61104553U - - Google Patents
Info
- Publication number
- JPS61104553U JPS61104553U JP18929684U JP18929684U JPS61104553U JP S61104553 U JPS61104553 U JP S61104553U JP 18929684 U JP18929684 U JP 18929684U JP 18929684 U JP18929684 U JP 18929684U JP S61104553 U JPS61104553 U JP S61104553U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- utility
- entire surface
- same material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は従来の半導体装置を示す斜視図である。
１，２１はリード端子、２はパツケージの表面
、２２は熱放散用の凹凸、２３はペレツトを内包
する部分。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing a conventional semiconductor device. 1 and 21 are lead terminals, 2 is the surface of the package, 22 is unevenness for heat dissipation, and 23 is a part containing pellets.
Claims (1)
ジと同一材料でなる複数の円柱状突起を設けたこ
とを特徴とする半導体装置。 A semiconductor device characterized in that a plurality of cylindrical projections made of the same material as the package are provided on a part or the entire surface of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18929684U JPS61104553U (en) | 1984-12-13 | 1984-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18929684U JPS61104553U (en) | 1984-12-13 | 1984-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61104553U true JPS61104553U (en) | 1986-07-03 |
Family
ID=30746747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18929684U Pending JPS61104553U (en) | 1984-12-13 | 1984-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61104553U (en) |
-
1984
- 1984-12-13 JP JP18929684U patent/JPS61104553U/ja active Pending