JPS61162058U - - Google Patents

Info

Publication number
JPS61162058U
JPS61162058U JP1985045672U JP4567285U JPS61162058U JP S61162058 U JPS61162058 U JP S61162058U JP 1985045672 U JP1985045672 U JP 1985045672U JP 4567285 U JP4567285 U JP 4567285U JP S61162058 U JPS61162058 U JP S61162058U
Authority
JP
Japan
Prior art keywords
conductive region
semiconductor device
thick film
film layer
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985045672U
Other languages
Japanese (ja)
Other versions
JPH0717159Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985045672U priority Critical patent/JPH0717159Y2/en
Publication of JPS61162058U publication Critical patent/JPS61162058U/ja
Application granted granted Critical
Publication of JPH0717159Y2 publication Critical patent/JPH0717159Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す半導体装置の
要部斜視図、第２図は第１図におけるＡ―Ａ線に
て切断した断面図、第３図は従来例を示す半導体
装置の要部斜視図、第４図はその断面図である。 ２……一導電領域（Ｐ層）、３……他導電領域
（Ｎ層）、４，５……電極、４２，５２……厚膜
層。 FIG. 1 is a perspective view of the main parts of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line A--A in FIG. 1, and FIG. 3 is a conventional example of a semiconductor device. A perspective view of the main part, and FIG. 4 is a sectional view thereof. 2... One conductive region (P layer), 3... Other conductive region (N layer), 4, 5... Electrode, 42, 52... Thick film layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ペレツト表面の一の導電領域上及び他の導電領
域上のそれぞれに、放熱用厚膜層を形成したこと
を特徴とする半導体装置。 A semiconductor device characterized in that a thick film layer for heat dissipation is formed on one conductive region and the other conductive region on the surface of a pellet.
JP1985045672U 1985-03-27 1985-03-27 Resin-sealed semiconductor device Expired - Lifetime JPH0717159Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985045672U JPH0717159Y2 (en) 1985-03-27 1985-03-27 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985045672U JPH0717159Y2 (en) 1985-03-27 1985-03-27 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS61162058U true JPS61162058U (en) 1986-10-07
JPH0717159Y2 JPH0717159Y2 (en) 1995-04-19

Family

ID=30559381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985045672U Expired - Lifetime JPH0717159Y2 (en) 1985-03-27 1985-03-27 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH0717159Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918598U (en) * 1972-05-18 1974-02-16
JPS5419375A (en) * 1977-07-14 1979-02-14 Mitsubishi Electric Corp Semiconductor device
JPS55153385A (en) * 1979-05-18 1980-11-29 Nippon Telegr & Teleph Corp <Ntt> Current squeezing type semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918598U (en) * 1972-05-18 1974-02-16
JPS5419375A (en) * 1977-07-14 1979-02-14 Mitsubishi Electric Corp Semiconductor device
JPS55153385A (en) * 1979-05-18 1980-11-29 Nippon Telegr & Teleph Corp <Ntt> Current squeezing type semiconductor device

Also Published As

Publication number Publication date
JPH0717159Y2 (en) 1995-04-19

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