JPS63145337U - - Google Patents
Info
- Publication number
- JPS63145337U JPS63145337U JP3692987U JP3692987U JPS63145337U JP S63145337 U JPS63145337 U JP S63145337U JP 3692987 U JP3692987 U JP 3692987U JP 3692987 U JP3692987 U JP 3692987U JP S63145337 U JPS63145337 U JP S63145337U
- Authority
- JP
- Japan
- Prior art keywords
- package
- grooves
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例を説明する要部斜
視図、第２図は、従来のＩＣパツケージを説明す
る斜視図である。
図において、１，３はＩＣパツケージ、２はリ
ード端子、４は溝、をそれぞれ示す。
FIG. 1 is a perspective view of a main part of an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional IC package. In the figure, 1 and 3 indicate an IC package, 2 a lead terminal, and 4 a groove, respectively.
Claims (1)
たことを特徴とするＩＣパツケージの構造。 The structure of an IC package is characterized in that a plurality of grooves 4 are formed on the surface of the IC package 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3692987U JPS63145337U (en) | 1987-03-12 | 1987-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3692987U JPS63145337U (en) | 1987-03-12 | 1987-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145337U true JPS63145337U (en) | 1988-09-26 |
Family
ID=30847787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3692987U Pending JPS63145337U (en) | 1987-03-12 | 1987-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145337U (en) |
-
1987
- 1987-03-12 JP JP3692987U patent/JPS63145337U/ja active Pending