JPH0215865U - - Google Patents
Info
- Publication number
- JPH0215865U JPH0215865U JP9389488U JP9389488U JPH0215865U JP H0215865 U JPH0215865 U JP H0215865U JP 9389488 U JP9389488 U JP 9389488U JP 9389488 U JP9389488 U JP 9389488U JP H0215865 U JPH0215865 U JP H0215865U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- holder
- water
- substrate
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
第１図は本考案の研磨ホルダを用いた研磨状態
の一実施例を説明するための断面図、第２図は研
磨終了時に水を供給し始めた状態を示す断面図、
第３図は更に水を供給することにより、基板が研
磨皿面から離れた状態を示す断面図、第４図は本
考案の研磨ホルダを用いた研磨装置の一実施例を
示す正面図である。
１…基板、２…ホルダ、３…保持部、４…アー
ム、５…本体、６…研磨皿、７…主軸、８…エツ
チヤントタンク、９…弁、１０…ノズル、１１…
水タンク、１２…弁、１３…スリツプリング、１
４…中空部、１５…穴、１６…注水口、１７…圧
力板、１８…遮液壁、１９…柱、２０…貫通部、
２１…スプリング。
FIG. 1 is a cross-sectional view for explaining an example of the polishing state using the polishing holder of the present invention, and FIG. 2 is a cross-sectional view showing a state in which water is started to be supplied at the end of polishing.
FIG. 3 is a sectional view showing a state where the substrate is separated from the surface of the polishing dish by further supplying water, and FIG. 4 is a front view showing an embodiment of the polishing apparatus using the polishing holder of the present invention. . DESCRIPTION OF SYMBOLS 1... Substrate, 2... Holder, 3... Holding part, 4... Arm, 5... Main body, 6... Polishing plate, 7... Main shaft, 8... Etchant tank, 9... Valve, 10... Nozzle, 11...
Water tank, 12...Valve, 13...Slip ring, 1
4... Hollow part, 15... Hole, 16... Water inlet, 17... Pressure plate, 18... Liquid shielding wall, 19... Pillar, 20... Penetrating part,
21...Spring.
Claims (1)
し、研磨皿上に供給された水溶性エツチヤントの
ハイドロプレーン効果により前記基板を浮上させ
、加工する研磨装置に用いる該基板保持用の研磨
ホルダにおいて、前記ホルダ下面に水を供給する
機構と、該機構による水供給に連動して該ホルダ
下面外周部から下方に環状の遮液壁を出す機構を
備えることを特徴とする研磨ホルダ。 A polishing holder for holding a semiconductor substrate used in a polishing apparatus that holds a semiconductor substrate facing a rotating polishing plate and processes the substrate by floating the substrate by a hydroplane effect of a water-soluble etchant supplied onto the polishing plate, A polishing holder comprising: a mechanism for supplying water to the lower surface of the holder; and a mechanism for protruding an annular liquid-shielding wall downward from the outer periphery of the lower surface of the holder in conjunction with the water supply by the mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389488U JPH0215865U (en) | 1988-07-14 | 1988-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389488U JPH0215865U (en) | 1988-07-14 | 1988-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215865U true JPH0215865U (en) | 1990-01-31 |
Family
ID=31318372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9389488U Pending JPH0215865U (en) | 1988-07-14 | 1988-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215865U (en) |
-
1988
- 1988-07-14 JP JP9389488U patent/JPH0215865U/ja active Pending