JPS62103247U - - Google Patents
Info
- Publication number
- JPS62103247U JPS62103247U JP19500685U JP19500685U JPS62103247U JP S62103247 U JPS62103247 U JP S62103247U JP 19500685 U JP19500685 U JP 19500685U JP 19500685 U JP19500685 U JP 19500685U JP S62103247 U JPS62103247 U JP S62103247U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- cleaning liquid
- onto
- coating
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
第１図は本考案に係る塗布装置の一実施例を示
す側断面図、第２図は第１図の装置の一部拡大図
である。第３図及び第４図は従来の塗布装置の各
動作状態での側断面図、第５図は第３図の一部拡
大図、第６図乃至第８図は第３図及び第４図の装
置における半導体ウエーハの供給及び取出し装置
の一例を説明するためのもので、第６図は平面図
、第７図及び第８図は各動作状態での側面図であ
る。
１……半導体ウエーハ、２……チヤツク、６…
…塗布液〔フオトレジスト材〕、１１……洗浄液
、１３……流体供給手段、１４……流体〔純水〕
。
FIG. 1 is a side sectional view showing an embodiment of a coating device according to the present invention, and FIG. 2 is a partially enlarged view of the device shown in FIG. Figures 3 and 4 are side sectional views of a conventional coating device in various operating states, Figure 5 is a partially enlarged view of Figure 3, and Figures 6 to 8 are Figures 3 and 4. 6 is a plan view, and FIGS. 7 and 8 are side views in each operating state. 1...Semiconductor wafer, 2...Chick, 6...
... Coating liquid [photoresist material], 11 ... Cleaning liquid, 13 ... Fluid supply means, 14 ... Fluid [pure water]
.
Claims (1)
部を吸着し、チヤツクで半導体ウエーハをその中
心点を中心に回転させて、半導体ウエーハ状に供
給された塗布液を遠心力で半導体ウエーハ上面全
域に拡げ塗布すると共に、回転する半導体ウエー
ハの周縁部下面に、前記塗布液を溶解する洗浄液
を吹き付けるようにした装置において、 回転する半導体ウエーハの周縁部上面に、半導
体ウエーハ周縁部下面からの前記洗浄液の回り込
みを防止する流体を供給する流体供給手段を付設
したことを特徴とする塗布装置。[Claims for Utility Model Registration] The center of the lower surface of the semiconductor wafer is adsorbed onto a horizontal chuck, and the chuck rotates the semiconductor wafer around its center point to apply a centrifugal force to the coating liquid supplied onto the semiconductor wafer. In this apparatus, the cleaning liquid is applied to the entire upper surface of a semiconductor wafer and sprays a cleaning liquid that dissolves the coating liquid onto the lower surface of the peripheral edge of the rotating semiconductor wafer. A coating device comprising a fluid supply means for supplying a fluid that prevents the cleaning liquid from leaking from the lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19500685U JPS62103247U (en) | 1985-12-18 | 1985-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19500685U JPS62103247U (en) | 1985-12-18 | 1985-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62103247U true JPS62103247U (en) | 1987-07-01 |
Family
ID=31152496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19500685U Pending JPS62103247U (en) | 1985-12-18 | 1985-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62103247U (en) |
-
1985
- 1985-12-18 JP JP19500685U patent/JPS62103247U/ja active Pending