JPS6274338U - - Google Patents
Info
- Publication number
- JPS6274338U JPS6274338U JP16777685U JP16777685U JPS6274338U JP S6274338 U JPS6274338 U JP S6274338U JP 16777685 U JP16777685 U JP 16777685U JP 16777685 U JP16777685 U JP 16777685U JP S6274338 U JPS6274338 U JP S6274338U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating tank
- semiconductor
- rotating blade
- vortex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Description
第１図ａ及びｂは本考案による一実施例を示す
側断面図及び平面図、第２図は従来装置の側断面
図である。
１：メツキ液、２：メツキ槽、３：半導体ウエ
ハ、４：カソードピン電極、５：アノード電極、
６：吹出し口、７：溢路、８：回転羽根。
1A and 1B are a side sectional view and a plan view showing an embodiment of the present invention, and FIG. 2 is a side sectional view of a conventional device. 1: plating liquid, 2: plating tank, 3: semiconductor wafer, 4: cathode pin electrode, 5: anode electrode,
6: Air outlet, 7: Overflow path, 8: Rotating blade.
Claims (1)
接触させて露出部に金属層を形成する装置におい
て、 メツキ槽に設置され且つ半導体基板が相対向す
るメツキ槽底部に、メツキ液に渦流を生じさせる
ための回転羽根を設けてなることを特徴とする半
導体装置の製造装置。[Scope of Claim for Utility Model Registration] In an apparatus for forming a metal layer on the exposed portion by bringing a pre-masked semiconductor substrate into contact with the surface of a plating solution, the device is installed in a plating tank and at the bottom of the plating tank where the semiconductor substrates face each other, 1. A semiconductor device manufacturing apparatus, comprising a rotating blade for generating a vortex in a plating liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16777685U JPS6274338U (en) | 1985-10-29 | 1985-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16777685U JPS6274338U (en) | 1985-10-29 | 1985-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6274338U true JPS6274338U (en) | 1987-05-13 |
Family
ID=31100025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16777685U Pending JPS6274338U (en) | 1985-10-29 | 1985-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6274338U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01128548A (en) * | 1987-11-13 | 1989-05-22 | Fujitsu Ltd | Fine pattern gold plating apparatus |
| JP2006028629A (en) * | 2004-07-21 | 2006-02-02 | Electroplating Eng Of Japan Co | Metal plating method and metal plating device |
| JP2012126966A (en) * | 2010-12-16 | 2012-07-05 | Mitomo Semicon Engineering Kk | Cup type plating device, and plating method |
-
1985
- 1985-10-29 JP JP16777685U patent/JPS6274338U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01128548A (en) * | 1987-11-13 | 1989-05-22 | Fujitsu Ltd | Fine pattern gold plating apparatus |
| JP2006028629A (en) * | 2004-07-21 | 2006-02-02 | Electroplating Eng Of Japan Co | Metal plating method and metal plating device |
| JP2012126966A (en) * | 2010-12-16 | 2012-07-05 | Mitomo Semicon Engineering Kk | Cup type plating device, and plating method |
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