JPH03103260U

JPH03103260U -

Info

Publication number: JPH03103260U
Application number: JP1038790U
Authority: JP
Priority date: 1990-02-05
Filing date: 1990-02-05
Publication date: 1991-10-28

Description

[Brief explanation of drawings]

第１図および第２図が本考案に関し、第１図は
本考案のバンプ電極の電解めつき用治具の実施例
をウエハ等とともに示す断面図、第２図は本考案
による治具を用いて成長されるバンプ電極の電解
めつき時と完成時の状態を示すウエハの周縁部の
拡大断面図である。第３図は従来技術による電解
めつき用治具を第１図と同じ要領で示す断面図で
ある。図において、１０……ウエハ、１１……半導体基板、１２…
…高濃度不純物層、１３……酸化膜、１４……配
線膜、１５……保護膜、１６……めつき電極膜、
１７……下地膜、１８……フオトレジスト膜、２
０〜２２……バンプ電極、３０……治具本体、３
１……筒状部、３２……ウエハ受け、３３……陽
極受け、３４……筒状部の下端、４０……陽極板
、４１……小孔、４２……絶縁リード、５０……
めつき液、５１……導入口、５２……末広がり状
の流れ、５３……溢出孔、６０……めつき槽、６
１……底板、６２……導入管、６３……案内板、
７０……ばね板、８０……めつき用電源、９０…
…従来の電解めつき用治具、９１……本体、９２
……管状部、９３……陽極板、である。 Figures 1 and 2 relate to the present invention; Figure 1 is a sectional view showing an embodiment of the jig for electrolytic plating of bump electrodes of the present invention together with a wafer, etc.; FIG. 4 is an enlarged sectional view of the peripheral edge of the wafer showing the state of the bump electrode grown by electrolytic plating and the completed state. FIG. 3 is a sectional view showing a conventional electrolytic plating jig in the same manner as FIG. 1. In the figure, 10... wafer, 11... semiconductor substrate, 12...
... High concentration impurity layer, 13 ... Oxide film, 14 ... Wiring film, 15 ... Protective film, 16 ... Plated electrode film,
17... Base film, 18... Photoresist film, 2
0 to 22...Bump electrode, 30...Jig body, 3
1... Cylindrical part, 32... Wafer holder, 33... Anode holder, 34... Lower end of cylindrical part, 40... Anode plate, 41... Small hole, 42... Insulated lead, 50...
Plating liquid, 51... Inlet, 52... Spreading flow, 53... Overflow hole, 60... Plating tank, 6
1...Bottom plate, 62...Introduction pipe, 63...Guide plate,
70... Spring plate, 80... Power supply for plating, 90...
... Conventional electrolytic plating jig, 91 ... Main body, 92
. . . tubular portion, 93 . . . anode plate.

Claims

[Scope of utility model registration request]

A jig main body formed in a roughly cylindrical shape, overflow holes for the dripping liquid drilled distributed around the periphery below the upper opening of the main body, and a jig body formed in an upwardly convex curved surface attached to the middle part of the main body. The jig is equipped with a porous anode plate and an inlet for the plating liquid opened at the bottom of the jig body, a wafer is placed in the upper opening of the jig body, and the plating liquid is introduced upward from the inlet through the anode plate. After contacting the wafer surface in a laminar flow state that spreads towards the end, a bump electrode is grown on the surface that will be in contact with the plating solution, using the wafer as a cathode while flowing through the main body so as to lead out from the overflow hole. A jig for electrolytic plating of bump electrodes.