JPS62122338U - - Google Patents
Info
- Publication number
- JPS62122338U JPS62122338U JP900486U JP900486U JPS62122338U JP S62122338 U JPS62122338 U JP S62122338U JP 900486 U JP900486 U JP 900486U JP 900486 U JP900486 U JP 900486U JP S62122338 U JPS62122338 U JP S62122338U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chemical liquid
- chemical
- chuck part
- spouted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims 3
- 230000005684 electric field Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図は本考案の装置におけるａ化成液噴出し
部の平面図、ｂ全体の構成図、第２図は従来の装
置における構成図である。
１…半導体ウエハー、２…真空チヤツク、３…
真空吸引ノズル、４…化成液噴出し部、４ａ…同
切欠き、４ｂ…化成液噴出し口、５…化成液循環
ポンプ、６…化成液回収槽、７…電極、８，９…
リード線、１０…定電圧定電流電源。
FIG. 1 is a plan view of a chemical liquid ejection part in the apparatus of the present invention, b is an overall configuration diagram, and FIG. 2 is a configuration diagram of a conventional apparatus. 1... Semiconductor wafer, 2... Vacuum chuck, 3...
Vacuum suction nozzle, 4...Chemical liquid spouting part, 4a...Same notch, 4b...Chemical liquid spouting port, 5...Chemical liquid circulation pump, 6...Chemical liquid recovery tank, 7...Electrode, 8, 9...
Lead wire, 10... Constant voltage constant current power supply.
Claims (1)
ウエハーを支持するチヤツク部と、チヤツク部に
支持したウエハーの表面に近接して相対して設置
され、ウエハーの直径と同じか或いはそれより広
い口径を有する化成液噴出し部と、化成液噴出し
部より噴出た化成液がウエハー表面のみに接触し
ている状態で、ウエハー裏面のチヤツク部及び化
成液を通してウエハー表面に電界を加える電源と
を有する化成装置において、前記化成液噴出し部
上面外周部に切欠きを設け、噴出した化成液を均
一に流れ落とさせることにより、ウエハー面内の
電流密度を均一にして化成を行うようにしたこと
を特徴とする半導体ウエハー製造用化成装置。 A chuck part that supports a semiconductor wafer with its surface facing downward; and a chuck part that is installed close to and facing the surface of the wafer supported by the chuck part, and has an aperture that is the same as or wider than the diameter of the wafer. A chemical conversion apparatus having a chemical liquid spouting part and a power source that applies an electric field to the wafer surface through a chuck part on the back side of the wafer and the chemical liquid while the chemical liquid spouted from the chemical liquid spouting part is in contact only with the wafer surface. In this method, a notch is provided on the outer periphery of the upper surface of the chemical liquid spouting part to allow the spouted chemical liquid to flow down uniformly, thereby making the current density uniform within the wafer surface and performing chemical conversion. Chemical conversion equipment for semiconductor wafer manufacturing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP900486U JPS62122338U (en) | 1986-01-24 | 1986-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP900486U JPS62122338U (en) | 1986-01-24 | 1986-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62122338U true JPS62122338U (en) | 1987-08-03 |
Family
ID=30793908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP900486U Pending JPS62122338U (en) | 1986-01-24 | 1986-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122338U (en) |
-
1986
- 1986-01-24 JP JP900486U patent/JPS62122338U/ja active Pending
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