JPS6394967U - - Google Patents
Info
- Publication number
- JPS6394967U JPS6394967U JP19003986U JP19003986U JPS6394967U JP S6394967 U JPS6394967 U JP S6394967U JP 19003986 U JP19003986 U JP 19003986U JP 19003986 U JP19003986 U JP 19003986U JP S6394967 U JPS6394967 U JP S6394967U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- cathode terminal
- plating solution
- provided inside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図は本考案の第１の実施例を示すめつき装
置の断面図、第２図は従来のめつき装置の一構成
例を示す断面図、第３図は本考案の第２の実施例
を示すめつき装置の断面図、第４図は本考案の第
３の実施例を示すめつき装置の断面図である。
２１……めつき槽、２２……受け部、２３……
半導体ウエハ、２４……陰極端子部、２５……蓋
部材、２７，４１，５１……整流部材、２８……
めつき槽底部、２９……流入口、３０……流出口
、３１，４３……収束部、３３，４４……吹出し
口、３４，４５……陽極部材、３５……めつき液
、４２……スラツト、５２……翼部材。
FIG. 1 is a cross-sectional view of a plating device showing a first embodiment of the present invention, FIG. 2 is a cross-sectional view showing an example of the configuration of a conventional plating device, and FIG. 3 is a second embodiment of the present invention. FIG. 4 is a sectional view of a plating apparatus showing a third embodiment of the present invention. 21...Plating tank, 22...Receiving part, 23...
Semiconductor wafer, 24... cathode terminal section, 25... lid member, 27, 41, 51... rectifying member, 28...
Plating tank bottom, 29...Inflow port, 30...Outflow port, 31, 43...Convergence part, 33, 44...Blowout port, 34, 45...Anode member, 35...Plating liquid, 42... ...Slat, 52...Wing member.
Claims (1)
支持する受け部を有し、他端部からめつき液を導
入して前記被めつき物に接触させるめつき槽と、
前記受け部に設けられ前記被めつき物と接続する
陰極端子部と、前記めつき槽内部に設けられ前記
陰極端子部と共働して前記被めつき物に前記めつ
き液によるめつきを施す陽極部材とを備えためつ
き装置において、 前記陽極部材は前記めつき液の流れを層流にす
る形状にすると共に、前記陽極部材を経ためつき
液を前記被めつき物表面に対して均等に分布させ
る整流部材を設けたことを特徴とするめつき装置
。[Claims for Utility Model Registration] A receiving part for supporting a plated object is provided inside near one end of both ends of the cylinder, and a plating liquid is introduced from the other end and brought into contact with the plated object. A plating tank,
A cathode terminal provided in the receiving portion and connected to the object to be plated, and a cathode terminal provided inside the plating tank working together with the cathode terminal to plate the object to be plated with the plating solution. In the plating apparatus, the anode member has a shape that makes the flow of the plating solution laminar, and the plating solution is evenly distributed over the surface of the object to be plated through the anode member. A plating device characterized by being provided with a rectifying member that distributes the current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19003986U JPS6394967U (en) | 1986-12-10 | 1986-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19003986U JPS6394967U (en) | 1986-12-10 | 1986-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6394967U true JPS6394967U (en) | 1988-06-18 |
Family
ID=31142887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19003986U Pending JPS6394967U (en) | 1986-12-10 | 1986-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6394967U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313591A (en) * | 1989-06-09 | 1991-01-22 | Susumu Kogyo Kk | Method and device for plating |
| JP2001316887A (en) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | Plating equipment |
| WO2017110765A1 (en) * | 2015-12-25 | 2017-06-29 | 株式会社山本鍍金試験器 | Plating device |
-
1986
- 1986-12-10 JP JP19003986U patent/JPS6394967U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313591A (en) * | 1989-06-09 | 1991-01-22 | Susumu Kogyo Kk | Method and device for plating |
| JP2001316887A (en) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | Plating equipment |
| WO2017110765A1 (en) * | 2015-12-25 | 2017-06-29 | 株式会社山本鍍金試験器 | Plating device |
| JPWO2017110765A1 (en) * | 2015-12-25 | 2018-10-18 | 株式会社山本鍍金試験器 | Plating equipment |
| US10697079B2 (en) | 2015-12-25 | 2020-06-30 | Yamamoto-Ms Co., Ltd. | Plating device |
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