JPS6031085Y2 - spotting device - Google Patents

Description

[Detailed description of the invention] This invention is a spot plating device for partially plating IC frames and other electrical components, and more specifically, the material to be plated has a cathode placed on a mask with multiple through holes. The present invention relates to an improvement of an apparatus for plating a material by plating the material in close contact with the material and by disposing a plurality of nozzles under the mask and spraying a plating liquid onto the material.

The nozzles used in conventional equipment are generally cylindrical nozzles, and in structures with multiple nozzles, the jet height of the plating solution jetted from each nozzle is determined by the flow resistance of each nozzle or by the pump pressure. As a result, uneven plating occurs on the surface to be plated, making it impossible to obtain a uniform plating effect and restricting the nozzle diameter. Since it cannot be made very large, it is difficult to increase the current density of plating, and it is difficult to increase the speed of plating work.

Furthermore, since the anode must be energized individually for each of the plurality of nozzles, the wiring structure is complicated.

The present invention aims to solve the problems of conventional products by using the slit shape of the nozzle hole and the wire mesh arrangement structure, simplify the current-carrying structure on the anode side, and provide a spot plating device with excellent workability and plating effect. With the goal.

To explain the embodiment of the present invention with reference to the drawings, Fig. 1 shows a tank (
1 is a receiving plate equipped with a mask 2, which allows the material a to be plated to be transferred onto the mask 2 in a timely manner, and a press plate 3. is installed so as to be able to move up and down, and the downward movement of this press plate 3 brings the material a into close contact with the mask 2.

A plurality of nozzles 10, 10, . . . are installed under the receiving plate 1 (FIG. 2).

The mask 2 is a flexible, chemical-resistant sheet made of rubber, polyvinyl chloride, etc., and has through holes 5° 5... to spray the plating solution 4 onto predetermined positions of the material a. A plated surface a on which the material a is plated is set according to the shape of the through hole 5.

In FIGS. 1 and 2, the through hole 5 is formed in a long rectangular shape that substantially fits the plated object a so that it has a long rectangular shape.

The receiving plate 1 is provided with through holes 5' corresponding to the through holes 5, 5, . . . of the mask 2, respectively.
5'... The nozzles 10 are disposed facing each other below.

The nozzle 10 is a flat cylindrical body, and has a nozzle hole 11 having a slit shape, that is, an elongated hole shape in cross section, and the nozzle hole 11 is opposed to the through hole 5' of the receiving plate 1 over substantially the entire length thereof.

Each of the nozzles 10 is installed in a communication manner on the liquid feeding tank 12,
The plating liquid 4 supplied to the liquid sending tank 12 by a pump (not shown) is sprayed upward through each nozzle hole 11, 11, . . . .

A rectifying material 13 such as a full-mesh sheet is placed horizontally in the liquid feeding tank 12 to rectify the flow of the plating solution 4.

A wire mesh sheet 20 is interposed between the plurality of nozzles 10, 10, . . . and the receiving plate 1.

In the drawings of the embodiment, the wire mesh sheet 20 has a nozzle of 10°1.
0... shows a structure in which each upper end surface is covered and covered.

The wire mesh sheet 20 is made of stainless steel, platinum, titanium plated with platinum, etc., and it is preferable to use a mesh that is as fine as possible.

An energizing wire 14 is connected to a part of the wire mesh sheet 20 to energize an anode, and a cathode energizes the material a to be plated.

The plating solution 4 sprayed from the nozzles 10, 10, . . . passes through the wire mesh sheet 20 and passes through the through holes 5'.

Each plating surface a', a' of material a through 5.
・Plating is applied to each side by wiping.

Next, FIG. 3 shows a modification of the arrangement of the nozzle 10 when the through hole 5 of the mask 2 is a small hole, that is, the plated surface a' is a small surface. ...It has a structure in which they are placed facing each other at the bottom.

A plurality of the nozzles 10 are arranged in parallel or in series, or one nozzle 10 is connected to the second nozzle 10, 10.
.

In this invention, the nozzle of the spot plating device is made into a flat cylinder shape and the nozzle hole is opened in the shape of a slit, so that a wide area corresponding to multiple conventional circular nozzles can be made up of one nozzle hole. The spray height of the plating solution sprayed from the nozzle hole is uniform, and the plating solution sprayed from all the nozzles is rectified by the wire mesh sheet interposed between the plurality of nozzles and the mask, so that it covers the entire range. The injection height becomes uniform.

Therefore, a product without uneven plating can be obtained, and quality control is easy.

Then, I applied an anode to the wire mesh sheet, so
Compared to the conventional structure in which the plating solution is sprayed from a nozzle covered with an anode, the area of the anode in contact with the plating solution is increased, and the ratio of the anode area to the cathode area of the surface to be plated is increased, making it possible to increase the plating current density. Therefore, it is possible to speed up the plating work.

In addition, the means for applying the anode only requires connecting the anode electrode to a part of the wire mesh or energizing the anode to one of a plurality of nozzles, and the wiring structure is simpler than the conventional method of connecting the anode to each nozzle. is easy.

Therefore, the intended purpose can be achieved.

[Brief explanation of drawings]

FIG. 1 is a sectional view of the present invention, FIG. 2 is an exploded perspective view with a portion of the main part of the device cut away, and FIG. 3 is a sectional view showing a modified example. In the figure, 2 is a mask, 4 is a plating solution, 5 is a through hole, 10 is a nozzle, 11 is a nozzle hole, 20 is a wire mesh sheet, a is a material to be plated, and a' is a surface to be plated.

Claims (1)

[Scope of utility model registration request] The material to be plated, which has a cathode applied to it, is brought into close contact with a mask that has multiple through holes, and multiple nozzles are placed under the mask to spray plating liquid onto the material to plate the material. In the spot plating apparatus, the nozzle holes are opened in the shape of slits, a wire mesh sheet is interposed between the nozzles and the mask, and the sheet is anodized.