JPH0313591A - Method and device for plating - Google Patents
Method and device for platingInfo
- Publication number
- JPH0313591A JPH0313591A JP14806689A JP14806689A JPH0313591A JP H0313591 A JPH0313591 A JP H0313591A JP 14806689 A JP14806689 A JP 14806689A JP 14806689 A JP14806689 A JP 14806689A JP H0313591 A JPH0313591 A JP H0313591A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead wire
- wire
- nozzle
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title claims description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000007788 liquid Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、例えば電子部品のリード線にメッキを施す方
法及びその装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for plating lead wires of electronic components, for example.
［従来の技術］
電子部品に用いられるリード線にメッキを施すに際し、
従来は、予めメッキの施されたリード線を用いて部品を
組み立てる方法、あるいはメッキの施されていないリー
ド線を用いて部品を構成した後に最終形態でメッキ施工
の必要とされる箇所に対してメッキを施す方法が採られ
る。[Prior art] When plating lead wires used in electronic components,
Conventionally, parts were assembled using pre-plated lead wires, or parts were assembled using unplated lead wires, and then plating was applied to the parts that required plating in the final form. A plating method is used.
［発明が解決しようとする課題］
ところが、従来技術の前者においては次のような問題点
があった。[Problems to be Solved by the Invention] However, the former prior art has the following problems.
■メッキ被膜が半田や錫などの低融点金属の場合には、
リード線を本体に取り付ける際の熱によりメッキ被膜が
溶融・凝縮するため、メッキ被膜の厚みにムラが生じて
リード線部分の半田付は性を劣化させる。■If the plating film is a low melting point metal such as solder or tin,
The heat generated when attaching the lead wire to the main body causes the plating film to melt and condense, resulting in uneven thickness of the plating film and deteriorating the soldering properties of the lead wire portion.
■メッキを施した後にリード線の成形加工を行う場合に
は、成形部分でメッキ被膜に割れが生じたり、メッキ被
膜が薄くなるなど、半田付は性や信頼性を劣化させる。■If the lead wire is molded after plating, soldering may cause cracks in the plating film at the molded part or thinning of the plating film, resulting in poor soldering performance and reliability.
■リード線に施されたメッキ被膜の厚さのバラツキや硬
さの変化が部品の組立精度に影響を及ぼし、高い寸法精
度を要求される部品には適用できない。■Differences in the thickness and hardness of the plating coating applied to the lead wires affect the assembly accuracy of parts, so it cannot be applied to parts that require high dimensional accuracy.
これらの問題を解決する有効な方法がないことから、高
精度で高い信頼性を要求される部品においては、部品構
成後にメッキを施す後者の方法が採られてきた。しかし
、この後者に関しても従来技術では下記のような問題点
があった。Since there is no effective method to solve these problems, the latter method, in which plating is applied after component construction, has been adopted for parts that require high precision and high reliability. However, regarding the latter, the prior art has the following problems.
■リード線のメッキに際して、部品全体がメッキ液に浸
漬されるためにメッキ液が本体に付着する。樹脂封止型
の電子部品等では付着したメッキ液が部品の内部に浸透
するなど洗浄を施しても完全には除去できず、その残渣
が腐食の原因となり長期信頼性に支障をきたす。■When plating lead wires, the entire part is immersed in the plating solution, so the plating solution adheres to the main body. In resin-sealed electronic parts, adhering plating liquid penetrates into the inside of the part and cannot be completely removed even after cleaning, and its residue causes corrosion and impairs long-term reliability.
■メッキ液の中で部品を攪拌しながらメッキを施すバレ
ルメッキでは、メッキ液中での部品の攪拌によるリード
線の損傷が著しく、そのため高い寸法精度を要求される
部品には適用できない。- Barrel plating, in which parts are plated while agitating them in a plating solution, causes significant damage to lead wires due to agitation of parts in the plating solution, so it cannot be applied to parts that require high dimensional accuracy.
本発明はこれらの問題点を解決するために考案されたも
のであり、構成済みの部品の本体にメッキ液を付着させ
ることなく、また、成形されたリード線の形状や寸法精
度を損なうことなく均一なメッキを施すことができ、か
つ、その後の半田付は性や部品の長期信頼性を確保する
ものである。The present invention has been devised to solve these problems, and can be done without attaching plating solution to the main body of the configured parts, and without impairing the shape or dimensional accuracy of the molded lead wire. Uniform plating can be applied, and subsequent soldering also ensures long-term reliability of the parts.
［課題を解決するための手段］
本発明のメッキ方法は、子部品のリード線を陰極とし、
該リード線に、陽極として作用するメッキ液を接触させ
メッキ処理を行うメッキ方法であって、
メッキ液が上記リード線に沿って流れるように所定の向
きにメッキ液を噴出させることを特徴とする。[Means for Solving the Problems] The plating method of the present invention uses the lead wire of the child component as a cathode,
A plating method in which the lead wire is brought into contact with a plating solution that acts as an anode, and is characterized by spouting the plating solution in a predetermined direction so that the plating solution flows along the lead wire. .
又、本発明のメッキ装置は、電子部品を所定の位置に保
持する製品ホルダーと、
前記電子部品のリード線に対向するようにして設けられ
たノズルと、
前記リード線が陰極、メッキ液に浸漬されるメッキ材料
が陽極となるように直流電圧を印加するメッキ電圧印加
手段と、
前記メッキ液を前記ノズルより噴出させるメッキ液送給
手段と、
メッキ液が前記リード線に沿って流れるよう、前記ノズ
ルより噴出するメッキ液の流路を制御する分流部材と、
を備えたことを特徴とする。Further, the plating apparatus of the present invention includes: a product holder for holding an electronic component in a predetermined position; a nozzle provided to face a lead wire of the electronic component; plating voltage applying means for applying a DC voltage so that the plating material to be plated becomes an anode; plating solution supply means for ejecting the plating solution from the nozzle; The present invention is characterized by comprising: a flow dividing member that controls the flow path of the plating liquid ejected from the nozzle.
［作用コ
本発明によるメッキ方法では、電子部品の部品本体にメ
ッキ液が付着しないように、メッキ液を例えばリード線
の方向等の所定の向きに噴出させており、これを実現さ
せるために、本発明のメッキ装置では、ノズルより噴出
するメッキ液を分流部材にてその流路を制御している。[Function] In the plating method according to the present invention, the plating solution is ejected in a predetermined direction, such as the direction of the lead wire, so that the plating solution does not adhere to the main body of the electronic component. In the plating apparatus of the present invention, the flow path of the plating liquid jetted from the nozzle is controlled by the flow dividing member.
又、本発明のメッキ装置の製品ホルダーに固定する部品
のリード線を基板実装時の形状に予め加工しておけ１ｆ
、メッキ処理後のリード線の加工を行わなくて済みメッ
キ被膜を損傷させることはない。Also, the lead wires of the parts to be fixed to the product holder of the plating apparatus of the present invention can be processed in advance into the shape for mounting on the board.
There is no need to process the lead wires after plating, and the plating film will not be damaged.
［実施例］
第１図は、本発明のメッキ方法を適用したメッキ装置の
一実施例を示す断面図である。[Example] FIG. 1 is a sectional view showing an example of a plating apparatus to which the plating method of the present invention is applied.
１は、メッキ液２を蓄えるメッキ槽であり、３は、メッ
キ槽ｌ内の所定部に保持されるノズルであり、このノズ
ル３の空胴部３ａ内には、方形状の液拡散板４と、この
液拡散板４の上方にて水平方向に延在する、メッキ材料
である円柱状のメッキ陽極５とが設けられる。又、ノズ
ル３には、前記空胴部３ａより上方に向けて貫通するス
リット状の開口３ｂが形成されており、この間口３ｂの
スリット方向は、前記メッキ陽極５の延在方向と合致す
る。６は、開口３ｂ内に遊嵌状態にして保持された、断
面がＴ字型をなす分流部材であり、この分流部材６の頂
部の分流板６ａは、開口３ｂの先端部の近傍所定部に位
置している。1 is a plating tank that stores plating solution 2; 3 is a nozzle held at a predetermined part in the plating tank 1; inside the cavity 3a of this nozzle 3 is a rectangular liquid diffusion plate 4; A cylindrical plating anode 5 made of plating material is provided above the liquid diffusion plate 4 and extending horizontally. Further, the nozzle 3 is formed with a slit-shaped opening 3b that penetrates upward from the cavity 3a, and the direction of the slit of the opening 3b coincides with the direction in which the plating anode 5 extends. Reference numeral 6 denotes a flow dividing member having a T-shaped cross section and held in a loosely fitted state in the opening 3b. positioned.
又、メッキ槽ｌ内のメッキ液２をノズル３の空胴部３ａ
の下方より送給するための液送給管７及び循環ポンプ８
が設けられる。Also, the plating solution 2 in the plating tank 1 is transferred to the cavity 3a of the nozzle 3.
Liquid feed pipe 7 and circulation pump 8 for feeding from below
will be provided.
一方、開口３ｂの両側には、製品ホルダー９が設けられ
ており、この製品ホルダー９上に、部品１０のＬ字型に
折曲したリード線１１の部分を載置したとき、第２図に
示したように、リード線１１の折曲部１１ａが前記分流
板６ａの直上となるよう、この製品ホルダー９は上下動
自在となっており、通常、部品１０の底面とノズル３の
先端面とのギャップＧがｌｎｍ程度に製品ホルダー９が
セットされる。又、部品ＩＯのリード線１１の長さに応
じて製品ホルダー９の間隔も可変となっている。On the other hand, product holders 9 are provided on both sides of the opening 3b, and when the L-shaped lead wire 11 of the component 10 is placed on the product holder 9, as shown in FIG. As shown, the product holder 9 is vertically movable so that the bent portion 11a of the lead wire 11 is directly above the flow dividing plate 6a, and normally the bottom surface of the component 10 and the tip surface of the nozzle 3 are The product holder 9 is set so that the gap G is about 1 nm. Further, the interval between the product holders 9 is also variable depending on the length of the lead wire 11 of the component IO.
１２は、製品ホルダー９上に載置した部品ＩＯのリード
線１１を上方から押し付けて固定するとともに、リード
線１１と電気的に接触するメッキ陰極である。尚、又、
上述のノズル３．成鉱散板４゜分流部材６及び製品ホル
ダー９は、メッキ液２により溶出したり、メッキ液２と
反応しないように高分子の絶縁材料で構成される。Reference numeral 12 denotes a plating cathode which presses and fixes the lead wire 11 of the component IO placed on the product holder 9 from above and which makes electrical contact with the lead wire 11 . Furthermore, again,
The above-mentioned nozzle 3. The mineral scattering plate 4° diversion member 6 and the product holder 9 are made of a polymeric insulating material so as not to be eluted by or react with the plating solution 2.
次に上記構成の装置を用いたメッキ処理について説明す
る。Next, a plating process using the apparatus having the above configuration will be explained.
メッキ液２としては、アルカノールスルフォン酸系を用
い、２８℃に保った。メッキ陽極５としては、鉛−錫系
の合金材料を用いた。部品ＩＯのリード線１１としては
、厚さ０．１５ｕ＋の極めて軟質の無酸素銅箔をエツチ
ング加工したものであり、線幅０ 、２ ｘｍ、間隔０
．６３５貢ｌで２９本づつ部品！０の両側に引き出され
ている。尚、このリード線の加工は、部品１０の組立の
前後のどちらで行ってもよい。As plating solution 2, an alkanolsulfonic acid system was used and the temperature was maintained at 28°C. As the plating anode 5, a lead-tin alloy material was used. The lead wires 11 of the component IO are etched from extremely soft oxygen-free copper foil with a thickness of 0.15u+, and have line widths of 0.2 x m and spacing of 0.
．． 29 parts each for 635 liters! It is pulled out on both sides of 0. Note that this lead wire processing may be performed either before or after the component 10 is assembled.
この部品ｌＯを図面に示したごとく、製品ホルダー９上
に載置し、リード線１！部をメッキ陰極１２により固定
した上で、リード線１１の折曲部１１ａが分流板６ａの
直上となるよう、製品ホルダー９の位置を微調整する。Place this component IO on the product holder 9 as shown in the drawing, and lead wire 1! After fixing the part with the plating cathode 12, the position of the product holder 9 is finely adjusted so that the bent part 11a of the lead wire 11 is directly above the flow dividing plate 6a.
そして、メッキ陰極１２と、メッキ陽極５とに対しそれ
ぞれ一極、十極ととなるように所定のメッキ電圧を印加
する。この後、循環ポンプ８を運転すると、メッキ槽ｌ
内のメッキ液２は、送給管７を介してノズル３の空胴部
３ａへ送給される。空洞部３ａに送り込まれたメッキ液
２は、まず、成鉱散板４に下方から行き当たることによ
り、メッキ液２が拡散され、この拡散されたメッキ液２
は、更にメッキ陽極５を包み込むようにして通過して開
口３ｂの方に送給される。開口３ｂ内においては、メッ
キ液２は、分流部材６の両側に沿って上方へ流れ、この
ノズル３の先端部より噴流したメッキ液２は、第２図に
示したように、分流部材６の分流板６ａに当たって図中
左右方向に分流して流路が制御されるので、部品ＩＯの
本体側に流れ込むことなく、各リード線１１に沿って一
様に流れ、その後、メッキ液２は、メッキ槽Ｉへ滴下す
る。このようにしてメッキ液２は循環するが、メッキ陽
極５と、陰極として作用するリード線１１との間がメッ
キ液２を介して電気的につながると、電気メッキが起こ
り、メッキ陽極５よりメッキ液２に溶出した金属イオン
が、被メッキ物となるリード線ｌ！の表面に析出する。Then, a predetermined plating voltage is applied to the plating cathode 12 and the plating anode 5 so that the plating voltage becomes one pole and ten poles, respectively. After that, when the circulation pump 8 is operated, the plating tank l
The plating liquid 2 inside is fed to the cavity 3a of the nozzle 3 via the feed pipe 7. The plating solution 2 sent into the cavity 3a first hits the synthetic ore scattering plate 4 from below, causing the plating solution 2 to be diffused.
further passes through so as to wrap around the plating anode 5 and is fed toward the opening 3b. Inside the opening 3b, the plating liquid 2 flows upward along both sides of the flow dividing member 6, and the plating liquid 2 jetted from the tip of the nozzle 3 flows into the flow dividing member 6 as shown in FIG. Since the flow path is controlled by hitting the flow divider plate 6a and branching in the left and right directions in the figure, the plating solution 2 flows uniformly along each lead wire 11 without flowing into the main body side of the component IO. Drop into tank I. In this way, the plating solution 2 circulates, but when the plating anode 5 and the lead wire 11 that acts as a cathode are electrically connected via the plating solution 2, electroplating occurs, and the plating from the plating anode 5 occurs. The metal ions eluted into the liquid 2 are applied to the lead wire l! which becomes the object to be plated! precipitates on the surface of
１公事のメッキ処理でリード線１１表面にはおよそ２０
μｍのメッキ被膜が得られ、このときの厚さのバラツキ
は５μ−程度であった。メッキ処理の終わった部品１０
は、この装置から取り外し、半田付けに必要となるリー
ド線を残すようにして、例えば第２図中のｘｍで示した
箇゛所でリード線１１を切断し、表面実装型部品として
供する。The surface of the lead wire 11 has approximately 20
A plated film with a thickness of 5 μm was obtained, and the variation in thickness was about 5 μm. Parts 10 that have been plated
is removed from this device, and the lead wire 11 is cut, for example, at the location indicated by xm in FIG. 2, leaving the lead wire necessary for soldering, and used as a surface-mounted component.
この実施例では、上記のギャップＧの間に分流板６ａを
設け、メッキ液２が左右方向に延在するリード線２に噴
流させる構造としたが、ノズル３の先端部の先端や分流
板６ａの形状・寸法を変更することにより、この実施例
以外のリード線形状の部品についても適用は可能であり
、以下にこの装置の変形例を第３図及び第４図を用いて
説明する。尚、第３図、第４図において第１図及び第２
図と同一の部分については同一の符号を付しその説明を
省略する。In this embodiment, a flow divider plate 6a is provided between the gap G, and the plating liquid 2 is jetted onto the lead wire 2 extending in the left-right direction. By changing the shape and dimensions of the device, it is possible to apply the device to lead wire-shaped components other than this embodiment, and a modification of this device will be described below with reference to FIGS. 3 and 4. In addition, in Figures 3 and 4, Figures 1 and 2 are
The same parts as those in the figures are given the same reference numerals and the explanation thereof will be omitted.
第３図において、１０°は、部品本体の両側より左右水
平方向に延在するリード線ｌｌ′を有する部品である。In FIG. 3, 10° indicates a component having lead wires ll' extending horizontally from both sides of the component body.
分流部材６の分流板６ａ’は、部品１０°の底面とほぼ
合致する寸法形状を有しており、又、この分流板６ａ’
によってメッキ液２の流路を斜め上方向に制御できるよ
うに、分流板６ａ’の下面及びノズル３の先端面には図
示したような所定の勾配が設けられる。メッキ処理時に
は、製品ホルダー９に載置した部品１０’の裏面に分流
板６ａ’が当接する程度に製品ホルダー９の位置を調整
する。この状態でメッキ液２をノズル３より噴出させれ
ば、この噴出したメッキ液２は、分流板６ａ’によって
その流路が制御され、水平方向のリード線ｌビを伝わる
ようにして流れる。The flow dividing plate 6a' of the flow dividing member 6 has a size and shape that almost matches the bottom surface of the component 10°, and this flow dividing plate 6a'
In order to control the flow path of the plating solution 2 diagonally upward, the lower surface of the flow dividing plate 6a' and the tip surface of the nozzle 3 are provided with a predetermined slope as shown. During the plating process, the position of the product holder 9 is adjusted to such an extent that the flow dividing plate 6a' comes into contact with the back surface of the component 10' placed on the product holder 9. When the plating liquid 2 is ejected from the nozzle 3 in this state, the flow path of the ejected plating liquid 2 is controlled by the flow divider plate 6a', and flows along the horizontal lead wire BI.
上述の２つの実施例で扱った部品は、主として基板の表
面に取り付ける高密度表面実装型のものを対象としてお
り、基板にリード線を差し込み、基板裏面より半田付け
を行う通常の部品へのメッキ処理も可能であり、その場
合のメッキ処理装置を第４図により説明する。The parts handled in the two examples above are mainly high-density surface mount type parts that are attached to the surface of the board, and are used for plating on ordinary parts where lead wires are inserted into the board and soldered from the back side of the board. A plating treatment is also possible, and a plating treatment apparatus in that case will be explained with reference to FIG.
部品１０”は、基板差し込み用として部品本体の底面よ
り２本平行に引き出されたタイプのものであり、基板の
差し込み孔の寸法に合致するように、リード線１ビを所
定の間隔に拡げた後、製品ホルダー９にセットできるよ
う、更に左右方向に折曲している。この場合、分流板６
ａがリード線ｌどの１番目の折曲部１１ａ’の箇所に対
向するよう、分流部材６を上方向に移動させる。そして
、ノズル３より噴出したメッキ液２が分流板６ａまで導
けるように、ノズル３の上部に別のノズル１３が設けら
れる。Component 10'' is a type in which two wires are drawn out parallel to each other from the bottom of the component body for insertion into the board, and the lead wires are spread out at a predetermined interval to match the dimensions of the insertion hole in the board. After that, it is further bent in the left and right direction so that it can be set in the product holder 9. In this case, the flow dividing plate 6
The flow dividing member 6 is moved upward so that a is opposed to the first bent portion 11a' of the lead wire l. Another nozzle 13 is provided above the nozzle 3 so that the plating liquid 2 spouted from the nozzle 3 can be guided to the flow dividing plate 6a.
また、メッキ液やメッキ陽極の材料を変更することによ
り、半田以外の材料、例えば錫などのメッキにも同様に
対応する装置であることを確認している。It has also been confirmed that by changing the plating solution and the material of the plating anode, the device can be used for plating materials other than solder, such as tin.
［発明の効果］
以上説明したごとく、本発明のメッキ方法及びメッキ装
置によれば、リード線に対して所定の向きにメッキ液を
噴出させるようにしたので、電子部品の本体にメッキ液
が付着せず、よって、メッキ液の残渣による電子部品の
特性の劣化も生じない。又、メッキ処理前に予めリード
線の加工を行っておけば、加工に伴うメッキ被膜の損傷
もなく、リード線の機械的寸法精度、およびメッキ被膜
の信頼性を保証でき、多数の極細リード線を有する高密
度実装型電子部品の製造に最適となる。[Effects of the Invention] As explained above, according to the plating method and plating apparatus of the present invention, the plating liquid is ejected in a predetermined direction with respect to the lead wire, so that the plating liquid is not applied to the main body of the electronic component. Therefore, the characteristics of electronic components do not deteriorate due to the residue of the plating solution. In addition, if the lead wires are processed in advance before plating, there will be no damage to the plating film due to processing, and the mechanical dimensional accuracy of the lead wires and the reliability of the plating film can be guaranteed. It is ideal for manufacturing high-density mounted electronic components.
第１図は本発明のメッキ装置の一実施例を示す断面図、
第２図は、第１図の部品装着部の詳細を示す断面図、第
３図及び第４図は、異なるリード線引き出しの電子部品
に対してメッキ処理を行うためのメッキ装置の変形例を
示す部品装着部の断面図である。
１・・・メッキ槽、２・・・メッキ液、３．１３・・・
ノズル、３ｂ・・・開口、４・・・成鉱散部、５・・・
メッキ陽極、６・・・分流部材、６ ａ、 ６ ａ’・
・・分流板、７・・・送給管、訃・・循環ポンプ、
９・・・製品ホルダー
＋ ０，１０°、１０−・・部品、
１１．１１’、１ ビ・・・リード線、１２・・・メッ
キ陰極。FIG. 1 is a sectional view showing an embodiment of the plating apparatus of the present invention;
Fig. 2 is a cross-sectional view showing details of the component mounting section in Fig. 1, and Figs. 3 and 4 show modified examples of a plating device for plating electronic components with different lead wires. FIG. 3 is a cross-sectional view of the component mounting section shown in FIG. 1... Plating tank, 2... Plating solution, 3.13...
Nozzle, 3b...Opening, 4...Ore dispersion part, 5...
Plated anode, 6... Diversion member, 6 a, 6 a'・
...Broadcast plate, 7...Feed pipe, end...Circulation pump, 9...Product holder + 0,10°, 10-...Parts, 11.11', 1 B...Lead wire, 12... Plating cathode.
Claims (3)
陽極として作用するメッキ液を接触させメッキ処理を行
うメッキ方法であって、 メッキ液が上記リード線に沿って流れるように所定の向
きにメッキ液を噴出させることを特徴とするメッキ方法
。(1) The lead wire of an electronic component is used as a cathode, and the lead wire is
A plating method in which plating is performed by contacting with a plating solution that acts as an anode, and the plating method is characterized by spouting the plating solution in a predetermined direction so that the plating solution flows along the lead wire.
、 前記電子部品のリード線に対向するようにして設けられ
たノズルと、 前記リード線が陰極、メッキ液に浸漬されるメッキ材料
が陽極となるように直流電圧を印加するメッキ電圧印加
手段と、 前記メッキ液を前記ノズルより噴出させるメッキ液送給
手段と、 メッキ液が前記リード線に沿って流れるよう、前記ノズ
ルより噴出するメッキ液の流路を制御する分流部材と、 を備えたことを特徴とするメッキ装置。(2) a product holder for holding an electronic component in a predetermined position; a nozzle provided to face a lead wire of the electronic component; the lead wire being a cathode, and the plating material immersed in a plating solution being an anode; plating voltage applying means for applying a DC voltage so that the plating liquid is ejected from the nozzle so that the plating liquid is ejected from the nozzle so that the plating liquid flows along the lead wire; A plating device comprising: a flow dividing member for controlling a flow path;
線は、電子部品組込み時の、所定の形状に加工されたも
のである請求項（２）記載のメッキ装置。(3) The plating apparatus according to claim 2, wherein the lead wire of the electronic component fixed to the product holder is processed into a predetermined shape when the electronic component is assembled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1148066A JPH0718034B2 (en) | 1989-06-09 | 1989-06-09 | Plating method and its equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1148066A JPH0718034B2 (en) | 1989-06-09 | 1989-06-09 | Plating method and its equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0313591A true JPH0313591A (en) | 1991-01-22 |
| JPH0718034B2 JPH0718034B2 (en) | 1995-03-01 |
Family
ID=15444440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1148066A Expired - Fee Related JPH0718034B2 (en) | 1989-06-09 | 1989-06-09 | Plating method and its equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0718034B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022137339A1 (en) * | 2020-12-22 | 2022-06-30 | 株式会社荏原製作所 | Plating device, pre-wetting treatment method, and cleaning treatment method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61110790A (en) * | 1984-11-05 | 1986-05-29 | Electroplating Eng Of Japan Co | Jet plating method of ic lead frame |
| JPS62186973U (en) * | 1986-05-15 | 1987-11-27 | ||
| JPS6394967U (en) * | 1986-12-10 | 1988-06-18 |
-
1989
- 1989-06-09 JP JP1148066A patent/JPH0718034B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61110790A (en) * | 1984-11-05 | 1986-05-29 | Electroplating Eng Of Japan Co | Jet plating method of ic lead frame |
| JPS62186973U (en) * | 1986-05-15 | 1987-11-27 | ||
| JPS6394967U (en) * | 1986-12-10 | 1988-06-18 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022137339A1 (en) * | 2020-12-22 | 2022-06-30 | 株式会社荏原製作所 | Plating device, pre-wetting treatment method, and cleaning treatment method |
| CN114981486A (en) * | 2020-12-22 | 2022-08-30 | 株式会社荏原制作所 | Plating apparatus, pre-wet processing method, and cleaning processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0718034B2 (en) | 1995-03-01 |
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