JPS6178869U - - Google Patents
Info
- Publication number
- JPS6178869U JPS6178869U JP16145284U JP16145284U JPS6178869U JP S6178869 U JPS6178869 U JP S6178869U JP 16145284 U JP16145284 U JP 16145284U JP 16145284 U JP16145284 U JP 16145284U JP S6178869 U JPS6178869 U JP S6178869U
- Authority
- JP
- Japan
- Prior art keywords
- chemical liquid
- semiconductor wafer
- liquid blowing
- blowing part
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims 4
- 238000006243 chemical reaction Methods 0.000 claims 3
- 230000005684 electric field Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000011084 recovery Methods 0.000 description 1
Landscapes
- Chemical Treatment Of Metals (AREA)
Description
第１図は本考案の一実施例を示す構成図、第２
図は化成液吹出し口の上面図、第３図は従来例を
示す構成図である。１……半導体ウエハー、２…
真空チヤツク、３……真空ノズル、４……化成液
吹出し口、５……循環ポンプ、６……化成液回収
槽、７……電極、８……リード線、９……リード
線、１０……定電圧定電流電源、１１……導電性
リーグ、１２……段付部、１３……Ｖ溝部。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is a top view of the chemical liquid outlet, and FIG. 3 is a configuration diagram showing a conventional example. 1... semiconductor wafer, 2...
Vacuum chuck, 3... Vacuum nozzle, 4... Chemical liquid outlet, 5... Circulation pump, 6... Chemical liquid recovery tank, 7... Electrode, 8... Lead wire, 9... Lead wire, 10... ... Constant voltage constant current power supply, 11 ... Conductive league, 12 ... Stepped part, 13 ... V groove part.
Claims (1)
ウエハーを支持するチヤツク部と、前記半導体ウ
エハー表面に対向して設置された化成液吹出部と
、化成液を通して前記半導体ウエハー表面に電界
を加えながら化成を行なうための電源部とを有す
る化成装置において、前記化成液吹出部の外周部
を段づきにし、かつ端面部には溝を付け、さらに
前記化成液吹出部の導電性リングを取付けたこと
を特徴とする化成装置。 A chuck part that supports the semiconductor wafer with its surface facing downward, a chemical liquid blowing part installed opposite to the semiconductor wafer surface, and a chemical liquid blowing part installed to face the semiconductor wafer surface, which performs chemical conversion while applying an electric field to the semiconductor wafer surface through the chemical liquid. In the chemical conversion apparatus, the outer peripheral part of the chemical liquid blowing part is stepped, and the end face part is provided with a groove, and a conductive ring is attached to the chemical liquid blowing part. chemical conversion equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16145284U JPS6178869U (en) | 1984-10-25 | 1984-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16145284U JPS6178869U (en) | 1984-10-25 | 1984-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6178869U true JPS6178869U (en) | 1986-05-26 |
Family
ID=30719361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16145284U Pending JPS6178869U (en) | 1984-10-25 | 1984-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6178869U (en) |
-
1984
- 1984-10-25 JP JP16145284U patent/JPS6178869U/ja active Pending