JPS6179536U - - Google Patents
Info
- Publication number
- JPS6179536U JPS6179536U JP16528584U JP16528584U JPS6179536U JP S6179536 U JPS6179536 U JP S6179536U JP 16528584 U JP16528584 U JP 16528584U JP 16528584 U JP16528584 U JP 16528584U JP S6179536 U JPS6179536 U JP S6179536U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semiconductor wafer
- cylinder
- electrode disposed
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図及び第２図は本考案の一実施例の半導体
製造装置を示す要部側断面図及びＡ−Ａ線からの
平面図、第３図及び第４図は本考案装置のメツキ
電極に加えるメツキ制御電圧の二例を示す電圧波
形図である。第５図及び第６図は従来のバンプ電
極メツキ装置の要部断面図及びＢ−Ｂ線に沿う平
面図、第７図及び第８図はメツキされる半導体ウ
エーハの平面図及びＣ−Ｃ線拡大断面図である。
１…メツキ筒、４…下部電極、５…半導体ウエ
ーハ、６…上部電極、７…メツキ液、１３…バン
プ電極、１４…中間電極。
1 and 2 are side sectional views of essential parts and a plan view taken along line A-A of a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIGS. 3 and 4 are plating electrodes of the apparatus of the present invention. FIG. 6 is a voltage waveform diagram showing two examples of applied plating control voltages. 5 and 6 are sectional views of main parts of a conventional bump electrode plating apparatus and a plan view along line B-B, and FIGS. 7 and 8 are plan views of semiconductor wafers to be plated and line C-C. It is an enlarged sectional view. DESCRIPTION OF SYMBOLS 1... Plating tube, 4... Lower electrode, 5... Semiconductor wafer, 6... Upper electrode, 7... Plating liquid, 13... Bump electrode, 14... Intermediate electrode.
Claims (1)
る噴流式メツキ装置であつて、半導体ウエーハを
被メツキ面を下にして保持するメツキ筒と、メツ
キ筒上の半導体ウエーハの上面に接触する上部電
極と、メツキ筒内を上昇して半導体ウエーハ下面
に噴流するメツキ液中に配置された下部電極と、
半導体ウエーハの下面周辺部に近接対向配置され
て選択的にメツキ制御電位が付与される中間電極
とを具備したことを特徴とする半導体製造装置。 A jet plating device for partially forming bump electrodes on a semiconductor wafer, comprising: a plating cylinder that holds the semiconductor wafer with the surface to be plated facing down; an upper electrode that contacts the upper surface of the semiconductor wafer on the plating cylinder; a lower electrode disposed in a plating liquid rising inside the plating cylinder and jetting onto the lower surface of the semiconductor wafer;
1. A semiconductor manufacturing apparatus comprising: an intermediate electrode disposed close to and opposite to the peripheral portion of a lower surface of a semiconductor wafer and to which a plating control potential is selectively applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16528584U JPS6179536U (en) | 1984-10-30 | 1984-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16528584U JPS6179536U (en) | 1984-10-30 | 1984-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6179536U true JPS6179536U (en) | 1986-05-27 |
Family
ID=30723140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16528584U Pending JPS6179536U (en) | 1984-10-30 | 1984-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6179536U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316887A (en) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | Plating equipment |
-
1984
- 1984-10-30 JP JP16528584U patent/JPS6179536U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316887A (en) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | Plating equipment |
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