JPS56152991A - Jet type plating device - Google Patents
Jet type plating deviceInfo
- Publication number
- JPS56152991A JPS56152991A JP5561480A JP5561480A JPS56152991A JP S56152991 A JPS56152991 A JP S56152991A JP 5561480 A JP5561480 A JP 5561480A JP 5561480 A JP5561480 A JP 5561480A JP S56152991 A JPS56152991 A JP S56152991A
- Authority
- JP
- Japan
- Prior art keywords
- pins
- substrate
- water
- plating soln
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prevent the plating soln. from creeping up onto the top surface of a substrate by providing supporting pins for supporting the substrate and side pins for locating peripheral side surface on the top end surface of a cylindrical head and forming gap between the end surface of the cylindrical head and the surface of the substrate.
CONSTITUTION: Support pins 15 supporting the substrate and locating side pins 16 are projected on the top end face of a cylindircal head 13. For example, a wafer 2 is used as the substrate, and the water 2 with its back electrodes 1 faced upward is placed on the pins 15, and is located by the side pins 16. An upper electrode 20 is pressed and fixed to the central part of the top surface of the water 2 and voltage is applied across the lower electrode 10 as pluse and the upper electrode 20 as minus, by which plating soln. 22 is spouted upward and bump electrodes 3 are grown on the under surface of the wafer 2. The plating soln. 22 flows out to the outside from a gap (g), and since the upper edge 14' is on the side inner than the side face of the water 2, the plating soln. 22 is prevented from creeping up on the top surface of the water 2.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5561480A JPS6020477B2 (en) | 1980-04-26 | 1980-04-26 | Jet plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5561480A JPS6020477B2 (en) | 1980-04-26 | 1980-04-26 | Jet plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56152991A true JPS56152991A (en) | 1981-11-26 |
JPS6020477B2 JPS6020477B2 (en) | 1985-05-22 |
Family
ID=13003644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5561480A Expired JPS6020477B2 (en) | 1980-04-26 | 1980-04-26 | Jet plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6020477B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60251295A (en) * | 1984-05-25 | 1985-12-11 | Fuji Electric Co Ltd | Electroplating apparatus |
JPH01198017A (en) * | 1988-02-03 | 1989-08-09 | Casio Comput Co Ltd | Formation of external electrode of wafer |
JPH0261089A (en) * | 1988-08-29 | 1990-03-01 | Nippon Denso Co Ltd | Plating device |
-
1980
- 1980-04-26 JP JP5561480A patent/JPS6020477B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60251295A (en) * | 1984-05-25 | 1985-12-11 | Fuji Electric Co Ltd | Electroplating apparatus |
JPH0447036B2 (en) * | 1984-05-25 | 1992-07-31 | Fuji Electric Co Ltd | |
JPH01198017A (en) * | 1988-02-03 | 1989-08-09 | Casio Comput Co Ltd | Formation of external electrode of wafer |
JPH0261089A (en) * | 1988-08-29 | 1990-03-01 | Nippon Denso Co Ltd | Plating device |
Also Published As
Publication number | Publication date |
---|---|
JPS6020477B2 (en) | 1985-05-22 |
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