JPS56152991A - Jet type plating device - Google Patents

Jet type plating device

Info

Publication number
JPS56152991A
JPS56152991A JP5561480A JP5561480A JPS56152991A JP S56152991 A JPS56152991 A JP S56152991A JP 5561480 A JP5561480 A JP 5561480A JP 5561480 A JP5561480 A JP 5561480A JP S56152991 A JPS56152991 A JP S56152991A
Authority
JP
Japan
Prior art keywords
pins
substrate
water
plating soln
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5561480A
Other languages
Japanese (ja)
Other versions
JPS6020477B2 (en
Inventor
Setsuo Hiraoka
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP5561480A priority Critical patent/JPS6020477B2/en
Publication of JPS56152991A publication Critical patent/JPS56152991A/en
Publication of JPS6020477B2 publication Critical patent/JPS6020477B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the plating soln. from creeping up onto the top surface of a substrate by providing supporting pins for supporting the substrate and side pins for locating peripheral side surface on the top end surface of a cylindrical head and forming gap between the end surface of the cylindrical head and the surface of the substrate.
CONSTITUTION: Support pins 15 supporting the substrate and locating side pins 16 are projected on the top end face of a cylindircal head 13. For example, a wafer 2 is used as the substrate, and the water 2 with its back electrodes 1 faced upward is placed on the pins 15, and is located by the side pins 16. An upper electrode 20 is pressed and fixed to the central part of the top surface of the water 2 and voltage is applied across the lower electrode 10 as pluse and the upper electrode 20 as minus, by which plating soln. 22 is spouted upward and bump electrodes 3 are grown on the under surface of the wafer 2. The plating soln. 22 flows out to the outside from a gap (g), and since the upper edge 14' is on the side inner than the side face of the water 2, the plating soln. 22 is prevented from creeping up on the top surface of the water 2.
COPYRIGHT: (C)1981,JPO&Japio
JP5561480A 1980-04-26 1980-04-26 Jet plating device Expired JPS6020477B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5561480A JPS6020477B2 (en) 1980-04-26 1980-04-26 Jet plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5561480A JPS6020477B2 (en) 1980-04-26 1980-04-26 Jet plating device

Publications (2)

Publication Number Publication Date
JPS56152991A true JPS56152991A (en) 1981-11-26
JPS6020477B2 JPS6020477B2 (en) 1985-05-22

Family

ID=13003644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5561480A Expired JPS6020477B2 (en) 1980-04-26 1980-04-26 Jet plating device

Country Status (1)

Country Link
JP (1) JPS6020477B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60251295A (en) * 1984-05-25 1985-12-11 Fuji Electric Co Ltd Electroplating apparatus
JPH01198017A (en) * 1988-02-03 1989-08-09 Casio Comput Co Ltd Formation of external electrode of wafer
JPH0261089A (en) * 1988-08-29 1990-03-01 Nippon Denso Co Ltd Plating device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60251295A (en) * 1984-05-25 1985-12-11 Fuji Electric Co Ltd Electroplating apparatus
JPH0447036B2 (en) * 1984-05-25 1992-07-31 Fuji Electric Co Ltd
JPH01198017A (en) * 1988-02-03 1989-08-09 Casio Comput Co Ltd Formation of external electrode of wafer
JPH0261089A (en) * 1988-08-29 1990-03-01 Nippon Denso Co Ltd Plating device

Also Published As

Publication number Publication date
JPS6020477B2 (en) 1985-05-22

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