JPS5295169A - Solder electrode forming for semi-conductor - Google Patents

Solder electrode forming for semi-conductor

Info

Publication number
JPS5295169A
JPS5295169A JP1144976A JP1144976A JPS5295169A JP S5295169 A JPS5295169 A JP S5295169A JP 1144976 A JP1144976 A JP 1144976A JP 1144976 A JP1144976 A JP 1144976A JP S5295169 A JPS5295169 A JP S5295169A
Authority
JP
Japan
Prior art keywords
conductor
semi
electrode forming
solder electrode
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1144976A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1144976A priority Critical patent/JPS5295169A/en
Publication of JPS5295169A publication Critical patent/JPS5295169A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To prevent cracking of semi-conductor base plate caused by quick heating or quick cooling at solder electrode forming by heating whole base plate after forming solder plating layer on the upper surface of conductor for plating, and forming solder electrodes protruded by surface tension.
COPYRIGHT: (C)1977,JPO&Japio
JP1144976A 1976-02-06 1976-02-06 Solder electrode forming for semi-conductor Pending JPS5295169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1144976A JPS5295169A (en) 1976-02-06 1976-02-06 Solder electrode forming for semi-conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1144976A JPS5295169A (en) 1976-02-06 1976-02-06 Solder electrode forming for semi-conductor

Publications (1)

Publication Number Publication Date
JPS5295169A true JPS5295169A (en) 1977-08-10

Family

ID=11778392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1144976A Pending JPS5295169A (en) 1976-02-06 1976-02-06 Solder electrode forming for semi-conductor

Country Status (1)

Country Link
JP (1) JPS5295169A (en)

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