JPS52146563A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52146563A
JPS52146563A JP6320476A JP6320476A JPS52146563A JP S52146563 A JPS52146563 A JP S52146563A JP 6320476 A JP6320476 A JP 6320476A JP 6320476 A JP6320476 A JP 6320476A JP S52146563 A JPS52146563 A JP S52146563A
Authority
JP
Japan
Prior art keywords
semiconductor device
insulating substrate
metallized layer
interposing
securing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6320476A
Other languages
Japanese (ja)
Other versions
JPS6056300B2 (en
Inventor
Tomokazu Maki
Shozo Noguchi
Yukio Hirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6320476A priority Critical patent/JPS6056300B2/en
Publication of JPS52146563A publication Critical patent/JPS52146563A/en
Publication of JPS6056300B2 publication Critical patent/JPS6056300B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To effectively radiate the heat evolved within elements by interposing a metal plate of thermal conductivity higher than that of an insulating substrate between the element and a metallized layer at the time of securing the semiconductor element to the metallized layer provided to the insulating substrate surface.
COPYRIGHT: (C)1977,JPO&Japio
JP6320476A 1976-05-31 1976-05-31 semiconductor equipment Expired JPS6056300B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6320476A JPS6056300B2 (en) 1976-05-31 1976-05-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6320476A JPS6056300B2 (en) 1976-05-31 1976-05-31 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS52146563A true JPS52146563A (en) 1977-12-06
JPS6056300B2 JPS6056300B2 (en) 1985-12-09

Family

ID=13222433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6320476A Expired JPS6056300B2 (en) 1976-05-31 1976-05-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6056300B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374365A (en) * 1976-12-15 1978-07-01 Toshiba Corp Semiconductor ceramic package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374365A (en) * 1976-12-15 1978-07-01 Toshiba Corp Semiconductor ceramic package
JPS5625023B2 (en) * 1976-12-15 1981-06-10

Also Published As

Publication number Publication date
JPS6056300B2 (en) 1985-12-09

Similar Documents

Publication Publication Date Title
JPS52146563A (en) Semiconductor device
JPS5314561A (en) Packaging device of semiconductor device
JPS5440583A (en) Semiconductor device
JPS5429555A (en) Heat sink constituent
JPS5422163A (en) Semiconductor device
JPS53131781A (en) Condensing type solar battery device
JPS53143174A (en) Mounting structure of disc form thyristor
JPS5236980A (en) Heat sink for semiconductor devices
JPS5220773A (en) Semi-conductor element
JPS52135670A (en) Semiconductor device
JPS5253670A (en) Semiconductor device
JPS53143047A (en) Self-temperature-control type heating element
JPS5267983A (en) Semiconductor unit
JPS52113680A (en) Radiating substrate unit
JPS5337384A (en) Semiconductor element mounting method
JPS5365063A (en) Semiconductor device
JPS52147971A (en) Semiconductor device
JPS5335375A (en) Heating method
JPS5362472A (en) Semiconductor device
JPS5313360A (en) Semiconductor container
JPS5336467A (en) Semiconductor pellet fixture to metal substrate
JPS5350674A (en) Semiconductor device
JPS5373974A (en) Heat dissipating construction for semiconductor device
JPS5456766A (en) Semiconductor device
JPS5330274A (en) Semiconductor device