JPS5434751A - Washing method for silicon wafer - Google Patents
Washing method for silicon waferInfo
- Publication number
- JPS5434751A JPS5434751A JP10047377A JP10047377A JPS5434751A JP S5434751 A JPS5434751 A JP S5434751A JP 10047377 A JP10047377 A JP 10047377A JP 10047377 A JP10047377 A JP 10047377A JP S5434751 A JPS5434751 A JP S5434751A
- Authority
- JP
- Japan
- Prior art keywords
- silicon wafer
- washing method
- oxidize
- supplying
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To oxidize and remove foreign matter on a Si substrate surface while supplying O3 into a washing solution.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10047377A JPS5434751A (en) | 1977-08-24 | 1977-08-24 | Washing method for silicon wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10047377A JPS5434751A (en) | 1977-08-24 | 1977-08-24 | Washing method for silicon wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5434751A true JPS5434751A (en) | 1979-03-14 |
Family
ID=14274870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10047377A Pending JPS5434751A (en) | 1977-08-24 | 1977-08-24 | Washing method for silicon wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5434751A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56160043A (en) * | 1980-05-13 | 1981-12-09 | Mitsubishi Metal Corp | Prevention from contamination for surface of semiconductor wafer |
JPS57180132A (en) * | 1981-04-30 | 1982-11-06 | Fujitsu Ltd | Washing method of substrate |
JPS57204132A (en) * | 1981-06-10 | 1982-12-14 | Fujitsu Ltd | Washing method for silicon wafer |
JPS60239028A (en) * | 1984-05-11 | 1985-11-27 | Nec Corp | Cleaning method of surface |
JPH0199221A (en) * | 1987-10-12 | 1989-04-18 | Nec Corp | Cleaning method for semiconductor substrate |
JPH01140727A (en) * | 1987-11-27 | 1989-06-01 | Dainippon Screen Mfg Co Ltd | Cleaning of substrate |
JPH03246938A (en) * | 1990-02-23 | 1991-11-05 | Mitsubishi Materials Corp | Silicon wafer and its manufacture |
JPH04179225A (en) * | 1990-11-14 | 1992-06-25 | Ebara Res Co Ltd | Cleaning method |
US6817370B2 (en) | 1997-05-09 | 2004-11-16 | Semitool, Inc. | Method for processing the surface of a workpiece |
US6837252B2 (en) | 1997-05-09 | 2005-01-04 | Semitool, Inc. | Apparatus for treating a workpiece with steam and ozone |
US7378355B2 (en) | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
US7404863B2 (en) | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
CN109698256A (en) * | 2018-12-29 | 2019-04-30 | 无锡琨圣科技有限公司 | A kind of silicon chip surface oxidative system and method |
-
1977
- 1977-08-24 JP JP10047377A patent/JPS5434751A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0440857B2 (en) * | 1980-05-13 | 1992-07-06 | Mitsubishi Materiaru Kk | |
JPS56160043A (en) * | 1980-05-13 | 1981-12-09 | Mitsubishi Metal Corp | Prevention from contamination for surface of semiconductor wafer |
JPS57180132A (en) * | 1981-04-30 | 1982-11-06 | Fujitsu Ltd | Washing method of substrate |
JPS57204132A (en) * | 1981-06-10 | 1982-12-14 | Fujitsu Ltd | Washing method for silicon wafer |
JPH0473613B2 (en) * | 1984-05-11 | 1992-11-24 | ||
JPS60239028A (en) * | 1984-05-11 | 1985-11-27 | Nec Corp | Cleaning method of surface |
JPH0199221A (en) * | 1987-10-12 | 1989-04-18 | Nec Corp | Cleaning method for semiconductor substrate |
JPH01140727A (en) * | 1987-11-27 | 1989-06-01 | Dainippon Screen Mfg Co Ltd | Cleaning of substrate |
JPH03246938A (en) * | 1990-02-23 | 1991-11-05 | Mitsubishi Materials Corp | Silicon wafer and its manufacture |
JPH04179225A (en) * | 1990-11-14 | 1992-06-25 | Ebara Res Co Ltd | Cleaning method |
US6817370B2 (en) | 1997-05-09 | 2004-11-16 | Semitool, Inc. | Method for processing the surface of a workpiece |
US6837252B2 (en) | 1997-05-09 | 2005-01-04 | Semitool, Inc. | Apparatus for treating a workpiece with steam and ozone |
US7378355B2 (en) | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
US7404863B2 (en) | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
CN109698256A (en) * | 2018-12-29 | 2019-04-30 | 无锡琨圣科技有限公司 | A kind of silicon chip surface oxidative system and method |
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