JPS5434751A - Washing method for silicon wafer - Google Patents

Washing method for silicon wafer

Info

Publication number
JPS5434751A
JPS5434751A JP10047377A JP10047377A JPS5434751A JP S5434751 A JPS5434751 A JP S5434751A JP 10047377 A JP10047377 A JP 10047377A JP 10047377 A JP10047377 A JP 10047377A JP S5434751 A JPS5434751 A JP S5434751A
Authority
JP
Japan
Prior art keywords
silicon wafer
washing method
oxidize
supplying
foreign matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10047377A
Other languages
Japanese (ja)
Inventor
Hideo Shibuya
Junichi Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10047377A priority Critical patent/JPS5434751A/en
Publication of JPS5434751A publication Critical patent/JPS5434751A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To oxidize and remove foreign matter on a Si substrate surface while supplying O3 into a washing solution.
COPYRIGHT: (C)1979,JPO&Japio
JP10047377A 1977-08-24 1977-08-24 Washing method for silicon wafer Pending JPS5434751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10047377A JPS5434751A (en) 1977-08-24 1977-08-24 Washing method for silicon wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10047377A JPS5434751A (en) 1977-08-24 1977-08-24 Washing method for silicon wafer

Publications (1)

Publication Number Publication Date
JPS5434751A true JPS5434751A (en) 1979-03-14

Family

ID=14274870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10047377A Pending JPS5434751A (en) 1977-08-24 1977-08-24 Washing method for silicon wafer

Country Status (1)

Country Link
JP (1) JPS5434751A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160043A (en) * 1980-05-13 1981-12-09 Mitsubishi Metal Corp Prevention from contamination for surface of semiconductor wafer
JPS57180132A (en) * 1981-04-30 1982-11-06 Fujitsu Ltd Washing method of substrate
JPS57204132A (en) * 1981-06-10 1982-12-14 Fujitsu Ltd Washing method for silicon wafer
JPS60239028A (en) * 1984-05-11 1985-11-27 Nec Corp Cleaning method of surface
JPH0199221A (en) * 1987-10-12 1989-04-18 Nec Corp Cleaning method for semiconductor substrate
JPH01140727A (en) * 1987-11-27 1989-06-01 Dainippon Screen Mfg Co Ltd Cleaning of substrate
JPH03246938A (en) * 1990-02-23 1991-11-05 Mitsubishi Materials Corp Silicon wafer and its manufacture
JPH04179225A (en) * 1990-11-14 1992-06-25 Ebara Res Co Ltd Cleaning method
US6817370B2 (en) 1997-05-09 2004-11-16 Semitool, Inc. Method for processing the surface of a workpiece
US6837252B2 (en) 1997-05-09 2005-01-04 Semitool, Inc. Apparatus for treating a workpiece with steam and ozone
US7378355B2 (en) 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US7404863B2 (en) 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone
CN109698256A (en) * 2018-12-29 2019-04-30 无锡琨圣科技有限公司 A kind of silicon chip surface oxidative system and method

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0440857B2 (en) * 1980-05-13 1992-07-06 Mitsubishi Materiaru Kk
JPS56160043A (en) * 1980-05-13 1981-12-09 Mitsubishi Metal Corp Prevention from contamination for surface of semiconductor wafer
JPS57180132A (en) * 1981-04-30 1982-11-06 Fujitsu Ltd Washing method of substrate
JPS57204132A (en) * 1981-06-10 1982-12-14 Fujitsu Ltd Washing method for silicon wafer
JPH0473613B2 (en) * 1984-05-11 1992-11-24
JPS60239028A (en) * 1984-05-11 1985-11-27 Nec Corp Cleaning method of surface
JPH0199221A (en) * 1987-10-12 1989-04-18 Nec Corp Cleaning method for semiconductor substrate
JPH01140727A (en) * 1987-11-27 1989-06-01 Dainippon Screen Mfg Co Ltd Cleaning of substrate
JPH03246938A (en) * 1990-02-23 1991-11-05 Mitsubishi Materials Corp Silicon wafer and its manufacture
JPH04179225A (en) * 1990-11-14 1992-06-25 Ebara Res Co Ltd Cleaning method
US6817370B2 (en) 1997-05-09 2004-11-16 Semitool, Inc. Method for processing the surface of a workpiece
US6837252B2 (en) 1997-05-09 2005-01-04 Semitool, Inc. Apparatus for treating a workpiece with steam and ozone
US7378355B2 (en) 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US7404863B2 (en) 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone
CN109698256A (en) * 2018-12-29 2019-04-30 无锡琨圣科技有限公司 A kind of silicon chip surface oxidative system and method

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