JPS6441131U - - Google Patents
Info
- Publication number
- JPS6441131U JPS6441131U JP13641787U JP13641787U JPS6441131U JP S6441131 U JPS6441131 U JP S6441131U JP 13641787 U JP13641787 U JP 13641787U JP 13641787 U JP13641787 U JP 13641787U JP S6441131 U JPS6441131 U JP S6441131U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wafer
- cup
- liquid
- jetted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図乃至第５図はこの考案のウエハ用メツキ
装置に関し、第１図はこの考案の第１実施例によ
るウエハ用メツキ装置の断面図、第２図は第１図
のウエハ用メツキ装置で用いられたヘツドリング
の斜視図、第３図は第２図のヘツドリングの作用
を説明する平面図、第４図はこの考案の第２実施
例によるウエハ用メツキ装置の断面図、第５図は
第４図のウエハ用メツキ装置における作用を説明
するカツプ部分の平面図、第６図はバンプ電極形
成前のウエハを示した断面図、第７図はバンプ電
極形成後のウエハを示した断面図、第８図は従来
のウエハ用メツキ装置を示した断面図である。
３……カツプ、６……メツキ液、８，８′……
カソードピン、１０……ウエハ、１１……ヘツド
リング、１２，１２′……メツキ液遮断壁、１４
，１４′……メツキ液遮断壁。
1 to 5 relate to the wafer plating device of this invention, FIG. 1 is a sectional view of the wafer plating device according to the first embodiment of this invention, and FIG. 2 is a sectional view of the wafer plating device of FIG. 1. 3 is a plan view illustrating the action of the hedling shown in FIG. 2; FIG. 4 is a sectional view of a wafer plating device according to a second embodiment of the invention; FIG. FIG. 4 is a plan view of the cup portion explaining the operation of the wafer plating device; FIG. 6 is a cross-sectional view of the wafer before bump electrodes are formed; FIG. 7 is a cross-sectional view of the wafer after bump electrodes are formed; FIG. 8 is a sectional view showing a conventional wafer plating device. 3... Cup, 6... Metsuki liquid, 8,8'...
Cathode pin, 10... Wafer, 11... Head ring, 12, 12'... Plating liquid blocking wall, 14
, 14'... Metsuki liquid blocking wall.
Claims (1)
をその金属層が装置内部のメツキ用電極ピンに当
接するように配置して、前記カツプ内において噴
流するメツキ液を前記ウエハのメツキ面を浸しな
がら前記カツプ外に流出させる形式のウエハ用メ
ツキ装置において、前記カツプの上部に、前記メ
ツキ用電極ピンの先端よりもカツプ中心側にあつ
て、前記ウエハのメツキ面上をウエハエツジに向
かつて流れる噴流メツキ液が前記メツキ用電極ピ
ンに向かつて流れるのを阻止するメツキ液遮断壁
を設けたことを特徴とするウエハ用メツキ装置。 The wafer is placed above the cup into which the plating liquid is jetted, so that its metal layer is in contact with the plating electrode pins inside the device, and the plating surface of the wafer is soaked in the jetted plating liquid in the cup. In the wafer plating device of the type in which the wafer flows out of the cup, a jet plating is provided on the upper part of the cup, which is located closer to the center of the cup than the tip of the plating electrode pin, and which flows toward the wafer edge on the plating surface of the wafer. A plating apparatus for wafers, characterized in that a plating liquid blocking wall is provided to prevent the liquid from flowing toward the plating electrode pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13641787U JPS6441131U (en) | 1987-09-07 | 1987-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13641787U JPS6441131U (en) | 1987-09-07 | 1987-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6441131U true JPS6441131U (en) | 1989-03-13 |
Family
ID=31396906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13641787U Pending JPS6441131U (en) | 1987-09-07 | 1987-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6441131U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314155U (en) * | 1989-06-28 | 1991-02-13 |
-
1987
- 1987-09-07 JP JP13641787U patent/JPS6441131U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314155U (en) * | 1989-06-28 | 1991-02-13 |
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