JPS62162676U - - Google Patents

Info

Publication number
JPS62162676U
JPS62162676U JP5091686U JP5091686U JPS62162676U JP S62162676 U JPS62162676 U JP S62162676U JP 5091686 U JP5091686 U JP 5091686U JP 5091686 U JP5091686 U JP 5091686U JP S62162676 U JPS62162676 U JP S62162676U
Authority
JP
Japan
Prior art keywords
mini
plate
flat package
mold flat
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5091686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5091686U priority Critical patent/JPS62162676U/ja
Publication of JPS62162676U publication Critical patent/JPS62162676U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例を示す斜視図、第2図
は本考案の実施例を示す上面図、第3図は本考案
の実施例を示す側面図、第4図は本考案の実施例
を示す断面図、第5図、第6図、第7図、第8図
、は従来のプローブの概観図、第9図はMFPの
斜視図。 5:M.F.P.、6:M.F.P.端子、7
:プローブプレート、8:コンタクトピン、9:
チヤツク。
Fig. 1 is a perspective view showing an embodiment of the invention, Fig. 2 is a top view showing an embodiment of the invention, Fig. 3 is a side view showing an embodiment of the invention, and Fig. 4 is an implementation of the invention. 5, 6, 7, and 8 are general views of conventional probes, and FIG. 9 is a perspective view of an MFP. 5:M. F. P. , 6:M. F. P. terminal, 7
: Probe plate, 8: Contact pin, 9:
Check.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線基板上に搭載したミニモールドフラツ
トパツケージICの複数端子に通電接触する弾性
コンタクトピンと、該コンタクトピンを配列固定
するプレートと、該プレートを前記被測定ミニモ
ールドフラツトパツケージIC上面にのせ挾装す
るチヤツクより成ることを特徴とするIC用プロ
ーブ。
An elastic contact pin that conducts electrical contact with a plurality of terminals of a mini-mold flat package IC mounted on a printed circuit board, a plate for arranging and fixing the contact pins, and a clamp for placing the plate on the top surface of the mini-mold flat package IC to be measured. An IC probe characterized by comprising a chuck for mounting.
JP5091686U 1986-04-07 1986-04-07 Pending JPS62162676U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5091686U JPS62162676U (en) 1986-04-07 1986-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5091686U JPS62162676U (en) 1986-04-07 1986-04-07

Publications (1)

Publication Number Publication Date
JPS62162676U true JPS62162676U (en) 1987-10-16

Family

ID=30874711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5091686U Pending JPS62162676U (en) 1986-04-07 1986-04-07

Country Status (1)

Country Link
JP (1) JPS62162676U (en)

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