JPH0463134U - - Google Patents

Info

Publication number
JPH0463134U
JPH0463134U JP10430890U JP10430890U JPH0463134U JP H0463134 U JPH0463134 U JP H0463134U JP 10430890 U JP10430890 U JP 10430890U JP 10430890 U JP10430890 U JP 10430890U JP H0463134 U JPH0463134 U JP H0463134U
Authority
JP
Japan
Prior art keywords
wiring board
contact
insulating film
contact holder
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10430890U
Other languages
Japanese (ja)
Other versions
JP2533430Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990104308U priority Critical patent/JP2533430Y2/en
Publication of JPH0463134U publication Critical patent/JPH0463134U/ja
Application granted granted Critical
Publication of JP2533430Y2 publication Critical patent/JP2533430Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の実施例を示す断面図、第２
図はその絶縁フイルム３１の拡大平面図、第３図
は弾性加圧手段３７の一例を示す分解図、第４図
は従来のＩＣウエーハ試験用プローブカードを示
す断面図である。 Figure 1 is a sectional view showing an embodiment of this invention, Figure 2 is a sectional view showing an embodiment of this invention.
3 is an exploded view showing an example of the elastic pressurizing means 37, and FIG. 4 is a sectional view showing a conventional IC wafer testing probe card.

Claims (1)

【実用新案登録請求の範囲】 中心孔を有する配線基板と、 その配線基板の一面と対向した面の中心部に一
体に突出形成された固定部が上記中心孔より上記
配線基板の他面側に突出した剛体よりなるコンタ
クト保持体と、 そのコンタクト保持体の上記配線基板と反対の
面に取り付けられ、ＩＣウエーハのパツドと接触
されるべき複数の接点が形成され、これら各接点
に一端が接続され、他探が上記配線基板の配線と
接続されたマイクロストリツプラインが形成され
た絶縁フイルムと、 その絶縁フイルムと上記コンタクト保持体との
間に介在され、上記接点を上記パツドに対して弾
性接触させる弾性加圧手段と、 上記突出した固定部により上記コンタクト保持
体を上記配線基板に取外し自在に固定する固定具
と、 を具備するＩＣウエーハ試験用プローブカード。[Scope of Claim for Utility Model Registration] A wiring board having a center hole, and a fixing portion integrally formed in the center of a surface opposite to one surface of the wiring board, extending from the center hole to the other surface of the wiring board. A contact holder made of a protruding rigid body, and a plurality of contacts that are attached to the surface of the contact holder opposite to the wiring board and are to be brought into contact with the pads of the IC wafer, and one end is connected to each of these contacts. An insulating film on which a microstrip line is formed is connected to the wiring of the wiring board, and an insulating film is interposed between the insulating film and the contact holder, and the contact is brought into elastic contact with the pad. A probe card for testing an IC wafer, comprising: an elastic pressurizing means for removably fixing the contact holder to the wiring board using the protruding fixing part.
JP1990104308U 1990-10-03 1990-10-03 Probe card for IC wafer test Expired - Lifetime JP2533430Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990104308U JP2533430Y2 (en) 1990-10-03 1990-10-03 Probe card for IC wafer test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990104308U JP2533430Y2 (en) 1990-10-03 1990-10-03 Probe card for IC wafer test

Publications (2)

Publication Number Publication Date
JPH0463134U true JPH0463134U (en) 1992-05-29
JP2533430Y2 JP2533430Y2 (en) 1997-04-23

Family

ID=31849532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990104308U Expired - Lifetime JP2533430Y2 (en) 1990-10-03 1990-10-03 Probe card for IC wafer test

Country Status (1)

Country Link
JP (1) JP2533430Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774219A (en) * 1993-08-31 1995-03-17 Kurisutaru Device:Kk Probe substrate, its manufacture and probe device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS644042A (en) * 1987-06-09 1989-01-09 Tektronix Inc Prober
JPH01120838A (en) * 1987-08-28 1989-05-12 Tektronix Inc Probe
JPH02163664A (en) * 1988-10-11 1990-06-22 Hewlett Packard Co <Hp> Automatic compensator and self-levelling

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS644042A (en) * 1987-06-09 1989-01-09 Tektronix Inc Prober
JPH01120838A (en) * 1987-08-28 1989-05-12 Tektronix Inc Probe
JPH02163664A (en) * 1988-10-11 1990-06-22 Hewlett Packard Co <Hp> Automatic compensator and self-levelling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774219A (en) * 1993-08-31 1995-03-17 Kurisutaru Device:Kk Probe substrate, its manufacture and probe device

Also Published As

Publication number Publication date
JP2533430Y2 (en) 1997-04-23

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Legal Events

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R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term