JPS62196375U - - Google Patents
Info
- Publication number
- JPS62196375U JPS62196375U JP8368886U JP8368886U JPS62196375U JP S62196375 U JPS62196375 U JP S62196375U JP 8368886 U JP8368886 U JP 8368886U JP 8368886 U JP8368886 U JP 8368886U JP S62196375 U JPS62196375 U JP S62196375U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pads
- electronic component
- lead electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る印刷配線板の一実施例を
示す平面図、第２図は本考案の他の実施例を示す
平面図、第３図はフラツトパツケージＩＣを搭載
する従来の印刷配線板を示す分解斜視図、第４図
、第５図及び第６図は従来の印刷配線板を示す平
面図である。
１…フラツトパツケージＩＣ、１ａ…リード電
極、２…印刷配線板、４…パツド、４ａ，４ｂ…
端部のパツド。
FIG. 1 is a plan view showing one embodiment of a printed wiring board according to the present invention, FIG. 2 is a plan view showing another embodiment of the present invention, and FIG. 3 is a conventional printed circuit board equipped with a flat package IC. An exploded perspective view showing the wiring board, and FIGS. 4, 5, and 6 are plan views showing conventional printed wiring boards. DESCRIPTION OF SYMBOLS 1... Flat package IC, 1a... Lead electrode, 2... Printed wiring board, 4... Pad, 4a, 4b...
Padded ends.
Claims (1)
を搭載する印刷配線板おいて、この印刷配線板に
形成された前記電子部品のリード電極を接続する
ためのパツドのうち、少くとも一方の端部のパツ
ドを他のパツドより広く形成したことを特徴とす
る印刷配線板。 (2) 電子部品はフラツトパツケージＩＣである
ことを特徴とする実用新案登録請求の範囲第１項
記載の印刷配線板。[Claims for Utility Model Registration] (1) In a printed wiring board mounted with an electronic component having a plurality of lead electrodes arranged in parallel, for connecting the lead electrodes of the electronic components formed on the printed wiring board. A printed wiring board characterized in that at least one end of the pads is formed wider than the other pads. (2) The printed wiring board according to claim 1, wherein the electronic component is a flat package IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8368886U JPS62196375U (en) | 1986-06-03 | 1986-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8368886U JPS62196375U (en) | 1986-06-03 | 1986-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62196375U true JPS62196375U (en) | 1987-12-14 |
Family
ID=30937501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8368886U Pending JPS62196375U (en) | 1986-06-03 | 1986-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62196375U (en) |
-
1986
- 1986-06-03 JP JP8368886U patent/JPS62196375U/ja active Pending
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