JP6315092B2 - Plating jig - Google Patents

Description

  The present invention relates to a plating jig capable of easily taking in and out a wafer and preventing a plating solution from remaining inside.

  For example, copper plating is applied to the surface of a wafer used as a substrate for mounting a semiconductor. Specifically, a wafer is mounted on a plating jig, and the entire surface of the plating jig on which the wafer is mounted is immersed in a copper plating solution stored in a plating tank, thereby plating the surface of the wafer. To do.

  For example, Patent Document 1 discloses a semiconductor wafer plating jig that can hold a semiconductor wafer between a first holding member and a second holding member. In Patent Document 1, the annular fixing ring is rotated to lock the protrusion (locking portion) and the inverted L-shaped claw (locked portion), and in this state, the plating solution in the plating tank The semiconductor wafer is plated by immersing the substrate in the substrate.

JP 2007-169792 A

  However, since the fixing ring has an annular shape, a large force is required to lock the locking portion and the locked portion by rotating, and it is difficult to smoothly attach and detach. there were. In addition, since they are connected in an annular shape, there is a problem in that the amount of pushing at the time of locking cannot be adjusted according to the locking location, and there is a possibility that the semiconductor wafer may be cracked.

  Furthermore, since the fixing ring is annular, the plating solution stays inside the fixing ring, and the amount of the plating solution taken out increases. Therefore, there also exists a problem that there exists a possibility of causing the increase in metal-plating process expense. In addition, since the fixing ring is disposed on the second holding member, the distance between the upper surface of the fixing ring and the plating surface of the semiconductor wafer is increased, and the thickness of the plating jig is increased. There is also a problem that there is a possibility that the mixture cannot be sufficiently stirred. In addition, since the annular fixing ring is provided on the second holding member, there is a problem that when removing the wafer, the wafer cannot be taken out unless both the fixing ring and the second holding member are removed. It was.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a plating jig that can easily take in and out a wafer and in which a plating solution hardly remains inside.

  In order to achieve the above object, a plating jig according to the present invention comprises a holding base body that contacts one surface of a wafer that is a substrate to be plated, and a surface of the wafer that is independent of the holding base body. A holding base having a plurality of locking portions movable in parallel with each other, a covering member main body that abuts against an outer edge of the other surface of the wafer, and a plurality of engaged members protruding outward from the covering member main body A cover member having a stop portion, moving the plurality of locking portions to lock the plurality of locked portions, and holding the wafer sandwiched between the holding base and the cover member. It is characterized by that.

  In the above configuration, the wafer is held between the holding base and the covering member by moving the plurality of locking portions and locking the plurality of locked portions, so that the plurality of locked portions are arranged. Fine adjustment can be made to a suitable height for each position, and a force can be uniformly applied to the wafer, so that cracking of the wafer can be reduced. Further, it is possible to make the plating thickness uniform by making the contact resistance uniform when energized.

  In the plating jig according to the present invention, the holding base further includes a plurality of guide members, and each of the guide members moves the locking portion in a direction perpendicular to the surface of the wafer. It is preferable to restrain.

  In the above configuration, the holding base further includes a plurality of guide members, and each guide member restrains the movement of the locking portion in the direction perpendicular to the surface of the wafer. It is possible to appropriately lock the portions.

  Further, in the plating jig according to the present invention, when the target surface of the plating of the wafer is installed in a vertical direction in a state where the wafer is held, a plurality of the locking portions are the plating of the wafer. When the wafer is held or released, the adjacent locking portions are preferably moved in opposite directions to each other. .

  In the above configuration, the plurality of locking portions are arranged at positions symmetrical with respect to the vertical line passing through the center of the target surface of the wafer plating, and when holding or releasing the wafer, adjacent locking portions Are moved in opposite directions. Thereby, the force for moving the locking portion is uniformly distributed to the plurality of locking portions, and the wafer can be held or released with a small force. In addition, since the adjacent locking portions are moved in opposite directions, the distance between the adjacent locked portions can be increased, and a sufficient opening can be secured for taking in and out of the wafer by the wafer supply arm. It becomes possible.

  Further, the plating jig according to the present invention is configured such that when the wafer is held and the plating target surface of the wafer is installed in the vertical direction, the locking portion and the locked portion are the wafer. It is preferable that it is disposed at a position other than the vertical line passing through the center of the plating target surface, and the vertical line passing through the center of the plating target surface is in an open state.

  In the above configuration, when the wafer plating target surface is installed in the vertical direction while the wafer is held, the locking portion and the locked portion are not on a vertical line passing through the center of the wafer plating target surface. Since it is in an open state on the vertical line that is disposed at the position and passes through the center of the plating target surface, it is difficult for the plating solution to remain inside, and the amount of the plating solution taken out can be minimized.

  Further, in the plating jig according to the present invention, the holding base includes a plurality of stoppers that restrict movement of the plurality of locking portions, and the plurality of locking portions abut on the stoppers. Accordingly, it is preferable that the wafer is disposed at a position other than the vertical line passing through the center of the plating target surface.

  In the above configuration, the plurality of locking portions abut against one stopper when holding the wafer, and abut against another adjacent stopper when opening the wafer, so that the opening state can be reliably formed, Thus, the plating solution hardly remains, and the amount of the plating solution taken out can be minimized.

  In the plating jig according to the present invention, the locking portion is positioned higher than the locked portion, with one surface of the holding base body being parallel to the surface of the wafer as a reference surface. The bottom surface of the locking part or the top surface of the locked part is inclined, and the locked part is sandwiched and locked between the holding base body and the locking part. It is preferable.

  In the above configuration, the locking portion is provided at a position higher than the locked portion with one surface of the holding base body parallel to the surface of the wafer as a reference surface. The upper surface of the locking portion is inclined, and the locked portion is sandwiched and locked between the holding base body and the locking portion. Thus, the locked portion can be reliably locked by moving the locking portion, and the wafer can be securely held.

  In the plating jig according to the present invention, the upper surface of the locking member body is parallel to the surface of the wafer, with the one surface of the holding base body serving as a reference surface. It is preferable to be provided at a position below the height.

  In the above configuration, since the engaging portion is provided at a position below the height of the upper surface of the covering member main body, the stirring paddle installed in the plating tank can be brought closer to the target surface of the plating of the wafer. The plating solution near the target surface can be sufficiently stirred.

  According to the above configuration, the plurality of locked portions are held between the holding base and the covering member by moving the plurality of locking portions and locking the plurality of locked portions. Can be finely adjusted to a suitable height for each position where the film is disposed, and the plating thickness can be made uniform by making the contact resistance uniform when energized.

It is a schematic diagram for demonstrating the outline | summary of the plating apparatus using the jig | tool for plating which concerns on embodiment of this invention. It is a perspective view which shows the use condition of the jig | tool for plating which concerns on embodiment of this invention. It is a side view of the plating apparatus using the jig for plating concerning an embodiment of the invention. It is a perspective view which shows the structure of the jig | tool for plating which concerns on embodiment of this invention. It is a perspective view which shows the structure at the time of wafer mounting of the jig | tool for plating which concerns on embodiment of this invention. It is a perspective view which shows the structure before mounting | wearing of the covering member of the jig | tool for plating which concerns on embodiment of this invention. It is a perspective view which shows the structure at the time of mounting | wearing of the covering member of the jig | tool for plating which concerns on embodiment of this invention. It is a perspective view which shows the structure when the covering member of the jig | tool for plating which concerns on embodiment of this invention is latched and the wafer is hold | maintained. It is a fragmentary sectional view of the jig for plating concerning an embodiment of the invention. It is a fragmentary sectional view which shows the latching state of the bottom face of the latching | locking part of the plating jig which concerns on embodiment of this invention, and the upper surface of a to-be-latched part. It is a schematic diagram which shows the example of arrangement | positioning of the latching | locking part of the jig for plating which concerns on embodiment of this invention. It is a fragmentary top view which shows the latching state of the covering member by the latching | locking part of the jig for plating which concerns on other embodiment of this invention. It is a fragmentary top view which shows the latching state of the covering member by the latching | locking part of the jig for plating which concerns on other embodiment of this invention. It is the schematic cross section and schematic plan view which show the structure of the guide member of the jig | tool for metal plating which concerns on other embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram for explaining an outline of a plating apparatus using a plating jig according to an embodiment of the present invention. As shown in FIG. 1, in a plating apparatus 1 using a plating jig 10 according to the present embodiment, a plating solution 40 is stored in a plating tank 30.

  The anode 20 is installed in the plating tank 30, and the plating jig 10 that holds the wafer 7 that is the substrate to be plated is put in and out of the plating tank 30 in which the plating solution 40 is stored. The anode of the DC power supply 50 is connected to the anode electrode 20 and the anode is connected to the plating jig 10. A plating film is generated on the surface of the wafer 7 by supplying a DC current.

  FIG. 2 is a perspective view showing a usage state of the plating jig 10 according to the embodiment of the present invention. As shown in FIG. 2, in the plating jig 10 according to the present embodiment, the gripping portion 11 is gripped by a transport unit (not shown) and moved to a position directly above the plating tank 30. Then, the plating jig 10 is lowered in the direction of the arrow, and the holding base 12 holding the wafer 7 is immersed in the plating solution 40 stored in the plating tank 30, thereby performing the plating process on the surface of the wafer 7. Run.

  A plurality of plating tanks 30 are provided in one plating apparatus 1. FIG. 3 is a side view of the plating apparatus 1 using the plating jig 10 according to the embodiment of the present invention. As shown in FIG. 3, the plating apparatus 1 is provided with a plurality of plating tanks 30 for taking in and out the plating jig 10 holding the wafer 7 from above the plating tank 30.

  In the plating apparatus 1, the plating tanks 30 are arranged in an array as viewed from above, adjacent to a plating tank group composed of a plurality of plating tanks 30, a water washing tank 31 for washing the plating solution with water, and a drying (not shown). A tank is provided. During the plating process, the plating jig 10 holding the wafer 7 is immersed in one plating tank 30 and energized for a predetermined time to execute the plating process. After the plating process is performed, the plating jig 10 is lifted and moved to the water washing tank 31. After washing the plating solution adhering in the water washing tank 31, it is moved to a drying tank to remove water droplets adhering to the surface.

  FIG. 4 is a perspective view showing the configuration of the plating jig 10 according to the embodiment of the present invention. As shown in FIG. 4, the plating jig 10 according to the present embodiment includes the above-described gripping portion 11 and a holding base 12 that is plate-shaped and formed of an electrically insulating material such as a synthetic resin. ing. The holding base 12 is provided with a holding base main body 121 and a plurality of locking portions 122 that can move independently of the holding base main body 121. The locking portion 122 is a part of the locking member 112 (see FIG. 8B), and means a portion that substantially locks with the locked portion 132.

  In the example of FIG. 4, the plating jig 10 includes a stage 123 having a corresponding shape in the central portion of the holding base body 121 in order to mount the disc-shaped wafer 7. The plurality of locking portions 122 are provided so as to surround the stage 123. More specifically, the plurality of locking portions 122 are provided outside the covering member 13 described later, and the plating target surface T of the wafer 7 is installed in the vertical direction while the wafer 7 is held. In this case, two wafers are disposed at positions symmetrical to a vertical line passing through the center of the plating target surface of the wafer 7.

  The holding base body 121 is provided with a plurality of guide members 135 so as to correspond to the plurality of locking portions 122, respectively. An annular groove 121 a is formed in the holding base body 121, and the locking portion 122 can move in parallel with the surface of the wafer 7 along the groove 121 a. However, the movement of the locking portion 122 in the thickness direction (perpendicular to the surface of the wafer 7) is restricted by the guide member 135. A stopper 137 is provided at the tip of the locking portion 122 in the moving direction so that the locking portion 122 does not move more than necessary.

  The stage 123 is provided with two arm escape grooves 124 in the same direction as the moving direction of the plating jig 10 to the plating tank 30. The wafer 7 is mounted on the stage 123 by a wafer supply arm (not shown) that moves along the arm escape groove 124.

  FIG. 5 is a perspective view showing a configuration of the plating jig 10 according to the embodiment of the present invention when the wafer 7 is mounted. As shown in FIG. 5, a disk-shaped wafer 7 is mounted directly on a stage 123 having a corresponding shape. As described above, the wafer 7 is mounted on the stage 123 by the wafer supply arm.

  Next, the wafer 7 is pressed using the covering member 13. FIG. 6 is a perspective view showing a configuration before mounting the covering member 13 of the plating jig 10 according to the embodiment of the present invention. As shown in FIG. 6, the wafer 7 is pressed by applying a frame-shaped covering member 13 from the side opposite to the surface on which the wafer 7 is mounted on the stage 123. The covering member 13 includes a covering member main body 131 that contacts the outer edge of the plating target surface T of the wafer 7 and presses the wafer 7, and a plurality of locked portions 132 that protrude outward from the covering member main body 131. It is configured. A seal member (not shown) may be provided between the inner edge 131 a of the covering member 13 and the wafer 7.

  FIG. 7 is a perspective view showing a configuration when the covering member 13 of the plating jig 10 according to the embodiment of the present invention is mounted. As shown in FIG. 7, the covering member 13 is disposed inside the plurality of locking portions 122, and the inner edge 131 a of the covering member 13 is brought into contact with the outer edge of the plating target surface T of the wafer 7, thereby Is brought into close contact with the stage 123. When the covering member 13 is covered, the locked portion 132 is covered so as not to overlap the locking portion 122. Specifically, it covers the recessed portion 125 of the locking portion 122 so that the locked portion 132 enters. Further, the position of the covering member 13 is restricted by a positioning pin (not shown) or the like so as not to rotate and slide with respect to the holding base body 121 when the covering member 13 is locked.

  When the covering member 13 is covered, the bottom surface of the locking portion 122 that contacts the locked portion 132 is covered by using one surface of the holding base body 121 (a surface parallel to the surface of the wafer 7) as a reference surface. The position is higher than the upper surface of the locking portion 132. As a result, the locking part 122 can move (rotate) so as to cover the locked part 132.

  Then, the gap between the outer edge of the wafer 7 and the inner edge 131 a of the covering member 13 is sealed by a locking operation in which the locking part 122 is rotated and the locked part 132 is locked to the locking part 122. The FIG. 8A is a perspective view illustrating a configuration when the covering member 13 of the plating jig 10 according to the embodiment of the present invention is locked and the wafer 7 is held, and FIG. 8B is a diagram illustrating the embodiment of the present invention. It is a fragmentary sectional view of jig 10 for plating concerning a form. As shown in FIG. 8A and FIG. 8B, by moving (rotating) the plurality of locking portions 122, the locking portions 122 cover the locked portions 132 and lock the locked portions 132. be able to. Thus, the wafer 7 can be held between the holding base 12 and the covering member 13.

  As described above, according to the present embodiment, the wafer 7 is sandwiched between the holding base 12 and the covering member 13 by moving the plurality of locking portions 122 and locking the plurality of locked portions 132. Therefore, it is possible to finely adjust the height to be suitable for each position where the plurality of locked portions 132 are arranged, and to uniform the plating thickness by making the contact resistance uniform when energized. It becomes possible.

  The bottom surface b of the locking part 122 or the upper surface u of the locked part 132 is preferably inclined. By moving the locking portion 122, the degree of contact between the bottom surface b of the locking portion 122 and the upper surface u of the locked portion 132 can be changed, and the locked portion 132 of the covering member 13 can be engaged more firmly. This is because the wafer 7 can be held more securely.

  FIG. 8C is a partial cross-sectional view showing a locked state between the bottom surface of locking portion 122 and the top surface of locked portion 132 of plating jig 10 according to the embodiment of the present invention. In the example of FIG. 8C, a case is shown in which the bottom surface of the locking portion 122 is inclined so as to gradually become lower in the direction opposite to the moving direction of the locking portion 122.

  In this case, as shown in FIG. 8C (a), the locking portion 122 approaches the locked portion 132 from the higher bottom surface. Then, as shown in FIG. 8C (b), the upper surface of the locked portion 132 comes into contact with the bottom surface of the locking portion 122, thereby restricting the movement of the locking portion 122 and pushing it firmly. The frictional force between the bottom surface of the portion 122 and the top surface of the locked portion 132 is increased, and the locked portion 132 can be reliably locked.

  Further, when the wafer 7 is held or released, the adjacent locking portions 122 are moved in opposite directions as indicated by arrows in FIG. 8A. Thereby, compared with the case where it is locked with a single rotating member, the moving (rotating) force is distributed to the plurality of locking portions 122, so that the wafer 7 can be held or released as a whole with a small force. it can. Further, since the adjacent locking portions 122 are moved in opposite directions, the distance between the adjacent locked portions 132 can be increased. Therefore, for example, an opening M (see FIG. 4) sufficient for taking in and out of the wafer 7 by a wafer supply arm (not shown) can be easily secured.

  In the present embodiment, when the wafer 7 plating target surface is installed in the vertical direction while the wafer 7 is held, the locking portion 122 and the locked portion 132 are the plating target surface of the wafer 7. It is arrange | positioned in positions other than on the vertical line which passes along the center of this, and the vertical line which passes along the center of the object surface of plating will be in an open state. FIG. 9 is a schematic diagram illustrating an arrangement example of the locking portions 122 of the plating jig 10 according to the embodiment of the present invention.

  As shown in FIG. 9, the locking portion 122 is not arranged on the center line 91 passing through the center O of the stage 123 on which the wafer 7 is mounted (vertical line passing through the center of the plating target surface of the wafer 7) 91. . And the latching | locking part 122 is arrange | positioned in the position which becomes line symmetrical with respect to the centerline 91. FIG. By arranging in this way, the wafer 7 can be reliably held, and since the engaging portion 122 is not arranged on the lower center line 91 of the holding base 12, the plating solution remains inside. Hateful.

  Further, the holding base main body 121 includes a plurality of stoppers 137 that restrict the movement of the plurality of locking portions 122. The plurality of locking portions 122 are arranged at positions other than the vertical line passing through the center of the plating target surface of the wafer 7 by making contact with the stopper 137. Specifically, the plurality of locking portions 122 abut against one stopper 137 when holding the wafer 7 and abut against another adjacent stopper 137 when opening the wafer 7. As a result, the opening state can be reliably formed, the plating solution 40 hardly remains inside, and the amount of the plating solution 40 taken out can be minimized.

  In addition, with one surface of the holding base body 121 as a reference surface S, the upper surface u2 of the locking portion 122 is preferably provided at a position (height) that is less than or equal to the height of the upper surface u1 of the covering member body 131. . Since the engaging portion 122 is provided at a position below the height of the upper surface of the covering member main body 131, the stirring paddle installed in the plating tank 30 can be brought as close as possible to the plating target surface T of the wafer 7. The plating solution 40 in the vicinity of the plating target surface T can be sufficiently stirred. Therefore, the plating thickness distribution can be made more uniform. Further, since the thickness of the plating jig 10 itself can be reduced, the plating tank 30 can be made smaller.

  10A and 10B are partial plan views showing a state in which the covering member 13 is locked by the locking portion 122 of the plating jig 10 according to another embodiment of the present invention, and FIG. It is the schematic cross section and schematic plan view which show the structure of the guide member 135 of the jig | tool 10 for plating which concerns on other embodiment. As shown in FIGS. 10A and 10B, the locking portion 122 is formed with an arc-shaped slit 126. As shown in FIG. 11A, a headed guide pin 130 is inserted into the slit 126 of the locking portion 122, and the guide pin 130 is fixed to the holding base body 121. Then, as shown in FIG. 11B, the locking portion 122 moves in the rotation direction, and the guide pin 130 contacts the end portion in the slit 126, so that the movement of the locking portion 122 is limited.

  Thereby, for example, when the surface to be plated of the wafer 7 is installed in the vertical direction while the wafer 7 is held, the locking portion 122 and the locked portion 132 are the center of the surface to be plated of the wafer 7. Therefore, the plating solution hardly remains in the interior, and the amount of the plating solution taken out can be suppressed to the minimum.

  However, the guide member 135 is not limited to being configured by the guide pin 130 and the slit 126 inserted into the pin hole 127 provided in the holding base body 121, and can be moved. The configuration is not particularly limited as long as the movement of the unit 122 can be limited.

  In addition, it goes without saying that the embodiment described above can be changed without departing from the spirit of the present invention. For example, the arrangement of the locking portion 122 and the locked portion 132 is not limited to the above-described embodiment, and a plurality of the positioning portions may be arranged so that the wafer 7 can be securely held. Therefore, the number is not particularly limited.

DESCRIPTION OF SYMBOLS 1 Plating apparatus 7 Wafer 10 Jig for plating 12 Holding base 13 Cover member 121 Holding base main body 122 Locking part 131 Covering member main body 132 Locked part 135 Guide member 137 Stopper

Claims (7)

A holding base body that comes into contact with one surface of the wafer to be plated; and
A holding base having a plurality of engaging portions movable independently of the holding base body in parallel to the surface of the wafer;
A covering member main body contacting the outer edge of the other surface of the wafer;
A covering member having a plurality of locked portions projecting outward from the covering member main body,
A plating jig, wherein the plurality of locking portions are moved to lock the plurality of locked portions, and the wafer is held between the holding base and the covering member. The holding base further includes a plurality of guide members,
2. The plating jig according to claim 1, wherein each of the guide members restrains the movement of the locking portion in a direction perpendicular to the surface of the wafer. In the state where the wafer is held, when the target surface of plating of the wafer is installed in the vertical direction, a plurality of the locking portions are in relation to a vertical line passing through the center of the target surface of plating of the wafer. Placed in a symmetrical position,
3. The plating jig according to claim 1, wherein when the wafer is held or released, the adjacent engaging portions are moved in directions opposite to each other.   In a state where the wafer is held and the plating target surface of the wafer is installed in the vertical direction, the locking portion and the locked portion are on a vertical line passing through the center of the plating target surface of the wafer. 4. The plating jig according to claim 1, wherein the plating jig is in an open state on a vertical line that is disposed at a position other than the center and passes through the center of the plating target surface. 5. The holding base includes a plurality of stoppers that restrict movement of the plurality of locking portions,
5. The plating according to claim 4, wherein the plurality of locking portions are arranged at positions other than on a vertical line passing through a center of the plating target surface of the wafer by contacting the stopper. jig. The locking portion is provided at a position higher than the locked portion, with one surface of the holding base body parallel to the surface of the wafer as a reference surface.
The bottom surface of the locking part or the top surface of the locked part is inclined,
The plating jig according to any one of claims 1 to 5, wherein the locked portion is sandwiched and locked between the holding base body and the locking portion.   The upper surface of the locking portion is provided at a position equal to or lower than the height of the upper surface of the covering member body, with one surface of the holding base body parallel to the surface of the wafer as a reference surface. The plating jig according to claim 1, wherein the plating jig is a plating jig.