JP2000150421A - Device and method for plating substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for plating substrate by which a highly uniform plated film can be formed on the part to be plated of a substrate, such as the semiconductor wafer, etc., and the adhesion of a plating solution to the part not to be plated of the substrate can be prevented. SOLUTION: A plating jig 20, which holds a substrate wf when the substrate wf is arranged together with an anode plate in an plating tank when the substrate wf is electroplated by means of plating equipment, has an opening 22a formed to expose the surface to be plated of the substrate wf, first and second sealing members 25 and 26 attached to the periphery of the opening 22a, and a conductive member 27 that comes into contact with the surface edge section of the substrate wf which is prevented from coming into contact with a plating solution Q by the sealing members 25 and 26. The jig 20 also has an external electrode contact 28 for the jig which is provided on the external surface of the jig 20 for connecting the jig 20 to a power source. The plating equipment is provided with a jig holding mechanism having a jig holding section which holds the jig 20 in the plating tank and the mechanism is provided with an external electrode contact for holding tool which comes into contact with the external electrode contact 28 for jig in the jig holding section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate plating apparatus and method for forming a plating film on a substrate such as a semiconductor wafer.

[0002]

2. Description of the Related Art When a semiconductor wafer is plated, the surface on which a plating film is formed is generally the front surface of the semiconductor wafer. This is undesirable because it causes diffusion. Therefore, it has been practiced to expose only a surface portion of a semiconductor wafer on which a plating film is to be formed to a plating solution, and to seal other portions with a sealing member so as not to come into contact with the plating solution.

When plating a semiconductor wafer, there are many factors that affect plating, such as current density, current form, plating solution composition, solution concentration, and solution temperature. In order to perform appropriate plating, a semiconductor wafer is relatively moved with respect to a plating solution.

In the case of forming wiring of an integrated circuit element by plating, uniformity of the film thickness is required more than before, and a plating method and a substrate plating apparatus capable of forming a plating film with a more uniform film thickness. There is a demand for development.

When plating a semiconductor wafer, a plating jig is used, and the semiconductor wafer is mounted on the jig.
The jig is immersed in a plating solution to perform plating. When a metal film, such as copper, which is easily diffused inside a semiconductor wafer is formed by plating, the plating liquid is not plated on the semiconductor wafer even after the plating is completed, even when the substrate is taken out of a plating apparatus or a plating jig. Must not adhere to

In the conventional plating jig, since the plating solution cannot be sufficiently removed at the stage of taking out the semiconductor wafer from the jig, there is a problem that the plating solution adheres to a portion of the semiconductor wafer where plating is not performed. . Therefore, measures such as forming a barrier layer in advance on a portion of a semiconductor wafer where plating is not performed are taken.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and a highly uniform plating film can be formed on a portion where a substrate such as a semiconductor wafer is to be plated, and a portion on which no plating is to be performed can be formed. It is an object of the present invention to provide a plating apparatus and a plating method for a substrate which can prevent the plating solution from adhering.

[0008]

According to a first aspect of the present invention, there is provided a method for disposing a substrate held by a plating jig and an anode electrode plate in a plating tank containing a plating solution. In a substrate plating apparatus for plating a substrate by passing a plating current between the anode electrode plate and the substrate, an opening for exposing a surface of the substrate to be plated is formed in the plating jig. A sealing member is attached to the periphery of the substrate, and a conductive member is provided in contact with a surface edge of the substrate, which is prevented from contacting the plating solution by the sealing member, and the conductive member is provided at a predetermined position on an outer surface of the plating jig. A jig external electrode contact for connecting a power supply is provided, and jig holding means having a jig holding part for holding a plating jig inside the plating tank is provided, and the jig holding means is a jig holding part. Jig holding the plating jig Characterized by comprising a holder electrode contact that contacts the part electrode contact.

As described above, the substrate is mounted on the plating jig, the plating jig is held in the jig holding portion of the jig holding means, and electrolytic plating is performed. Since only the surface of the substrate exposed to the opening is in contact with the plating solution, the plating solution adheres to portions other than the plating surface, and the inconvenience such as diffusion of the plating metal into the substrate is eliminated.

Further, in the substrate plating apparatus according to the first aspect, the jig holding means turns the surface of the held plating jig exposed to the opening upward or downward, and rotates the jig in that state. It is characterized by comprising lifting means for lifting and lowering.

By providing the rotating means as described above, the plating jig is rotated during electrolytic plating to form a plating film having a uniform thickness on the surface exposed to the opening of the substrate. be able to. Also, by providing the rotating means and the elevating means, the plating jig is raised above the plating liquid surface, and rotated at a high speed to remove the plating liquid adhering to the substrate, the plating jig and the jig holding portion. After being scattered and removed by centrifugal force, the plating jig is taken out of the jig holding portion, and the substrate is taken out of the plating jig. Therefore, there is no danger of plating solution sticking when taking out the substrate.

[0012] The invention according to claim 2 is a method of plating a substrate by electroplating the substrate, the step of mounting the substrate on a plating jig, and the step of mounting the plating jig with the substrate on the jig. A step of mounting and holding on the holding means, a step of arranging the plating jig mounted on the jig holding means at a predetermined position in the plating solution of the plating tank, and a step of placing the anode electrode plate in the plating solution of the plating tank. Position, a step of passing a plating current between the anode electrode plate and the substrate to perform electrolytic plating, a step of moving the anode electrode plate out of the plating tank, and a step of plating mounted on the jig holding means. A step of moving the jig to a plating jig removal position outside the plating solution, a step of releasing the holding of the plating jig mounted on the jig holding means, and removing the plating jig from the jig holding means Process, removing the substrate from the plating jig Characterized in that it consists of degree.

In the method of plating the substrate, each of the above-mentioned steps is performed after the substrate is mounted on a plating jig. The liquid does not touch.

According to a third aspect of the present invention, there is provided a method of plating a substrate for plating a substrate, the step of mounting the substrate on a plating jig, and holding the plating jig with the substrate mounted on the jig. Means for mounting and holding on the means, means for arranging the plating jig mounted on the jig holding means at a predetermined position in the plating solution in the plating tank, and plating on the surface of the substrate exposed from the plating jig. Performing a step of moving the plating jig mounted on the jig holding means out of the plating solution and then rotating the jig to spatter and remove the plating solution by centrifugal force. Moving to the position to remove the
The method is characterized by comprising a step of removing the plating jig from the jig holding means and a step of removing the substrate from the plating jig.

The plating method comprising the above steps is performed when the anode electrode plate is not above the plating jig, that is, when the surface of the substrate to be plated faces downward and is below the jig holding means by the anode electrode plate, or This is a plating method that can be applied when there is no electrode plate.

The invention according to claim 4 is a substrate plating method for plating a substrate, wherein the plating is performed by holding a plating jig holding the substrate by a jig holding means and then performing plating. Cleaning and drying are performed while holding the substrate subjected to the plating with the plating jig, and the substrate is removed from the plating jig in a state where the plating solution does not adhere to the unplated surface of the substrate. Features.

Since washing and drying are performed while the substrate is held by the plating jig as described above, there is no danger that the plating solution will adhere to the substrate when the substrate is removed from the plating jig.

According to a fifth aspect of the present invention, a plating current is passed between a substrate held by a substrate holding means disposed in a plating tank containing a plating solution and an anode electrode plate to plate the substrate. In the apparatus for plating a substrate to be applied, the substrate holding means includes a first holding member and a second holding member for sandwiching the substrate, wherein the second holding member has an opening exposing a surface of the substrate to be plated, and a periphery of the opening. A sealing member attached to the
A substrate holding means, comprising: a conductive member in contact with a surface edge of the substrate partitioned by the seal member so as not to come into contact with the plating solution; and holding the substrate with the surface to be plated facing downward. A rotating means for rotating around a rotation axis in the plane of the substrate while holding the substrate, and / or a moving means for moving in the axial direction of the rotation axis, are attached to an upper structure disposed above the plating tank, A structure opening / closing driving means for driving the body to open / close is provided.

By adopting the above-described configuration in the substrate plating apparatus, only the surface of the substrate exposed to the opening of the second holding member of the substrate holding means contacts the plating solution, and the other surface does not contact the plating solution. After the electroplating is completed, after the plating is completed, the substrate holding means is raised above the plating liquid surface by the elevating means, and is rotated at a high speed by the rotating means, so that the plating liquid can be removed. No contact with plating solution. In addition, since the substrate holding means holding the substrate is rotated at a low speed during the plating period, a plating film having a uniform thickness can be formed on the surface of the substrate exposed at the opening.

According to a sixth aspect of the present invention, there is provided a method for plating a substrate by electroplating the substrate, wherein the substrate is held between the first holding member and the second holding member of the substrate holding means. Moving the substrate holding means to a predetermined position in the plating bath, disposing the substrate holding means, plating the exposed surface of the substrate, and moving the substrate holding means onto the surface of the plating solution. Removing the plating solution by rotating the substrate, moving the substrate holding means to a position for releasing the holding of the substrate, releasing the substrate holding means from the substrate holding means, removing the second holding member, and removing the substrate It is characterized by consisting of.

In the method of plating a substrate, the above-described steps are performed after the substrate is sandwiched and held between the first holding member and the second holding member of the substrate holding means. The plating solution does not touch the surface other than the surface that is in contact with the plating solution. In particular, after the plating is completed, the substrate holding means is moved to a position above the plating liquid surface and rotated to remove the plating liquid. Therefore, when the substrate is removed from the substrate holding means, the substrate does not come into contact with the plating liquid at all.

Further, in the substrate plating apparatus according to the first aspect, the jig holding portion of the jig holding means has at least three arms protruding from an axis in a radial direction, and the tip of the arm is plated. A holding means for holding the tool is provided.

In the apparatus for plating a substrate according to the first aspect, a release means is provided for releasing the holding of the plating jig of the holding means in cooperation with the elevation of the elevation means.

In the apparatus for plating a substrate according to the first aspect of the present invention, the holder electrode contact and the jig external electrode contact are sealed by a plating solution while the holder electrode contact is in contact with the jig external electrode contact. It is characterized by not being touched.

In the apparatus for plating a substrate according to the first aspect, the releasing means is a releasing means for releasing the holding of the plating jig in cooperation with the elevating means of the jig holding means. I do.

In the apparatus for plating a substrate according to the first aspect of the present invention, the jig external electrode contact of the plating jig is formed on an outer edge of the plating jig where an opening for exposing the plating surface of the substrate is formed. The holder electrode contact which is disposed and abuts on the jig external electrode contact is disposed on a holding claw of a jig holding portion of the jig holding means, and the jig external electrode contact and the holder electrode contact are surrounded by a sealing member. Are arranged so as not to touch the plating solution.

[0027] In the apparatus for plating a substrate according to claim 1, the jig external electrode contact of the plating jig is arranged at the center of the outer surface of the second jig member of the plating jig. The holder electrode contact which abuts on the external electrode contact is arranged on the shaft of the jig holding means, and the jig external electrode contact and the holder electrode contact are provided with a sealing member around so that they do not touch the plating solution. It is characterized by having.

In the apparatus for plating a substrate according to claim 1, an anode electrode plate elevating means for elevating and lowering the anode electrode plate is provided, and an anode is provided below the anode electrode plate raised by the anode electrode plate elevating means. A saucer for receiving a plating solution dropped from the electrode plate is provided, and a saucer moving mechanism for moving the saucer between a position outside the plating tank and a position below the anode electrode plate located above the plating tank is provided. I do.

Further, the pan moving mechanism moves the pan between the outside of the plating tank and a position below the anode electrode plate located above the plating tank, and moves the pan and the anode electrode plate between the anode and the anode. It is characterized by having a moving function of simultaneously moving the plating plate outside the plating tank while being positioned below the electrode plate.

In the apparatus for plating a substrate according to the first aspect, the plating jig includes a first jig member and a second jig member, and the second jig member has a surface on which the substrate is to be plated. Opening, a first seal member attached around the opening, a second seal member attached outside the first seal member, and plating by the first seal member and the second seal member. A conductive member that is in contact with a surface edge of the substrate that is isolated from contact with the liquid; and a jig external electrode contact that is electrically connected to the conductive member and provided on an outer surface of the plating jig. Features.

Further, a plurality of connecting means for connecting the second jig member to the first jig member by a spring at an outer peripheral portion of the first jig member are provided, and a projecting portion of the connecting means and the first holding member are provided. A release means is provided for releasing the connection of the connection means by relatively moving the member.

Further, the relative movement between the projecting portion of the coupling means and the first jig member is to move the projection of the coupling means in the radial direction.

The releasing means for releasing the connection of the connecting means includes a releasing member attached to the upper structure of the plating tank, and by moving the releasing member, the releasing means comes into contact with the projection of the connecting means. And the connection is released.

Further, in the method of plating a substrate according to claim 2, after the step of performing electrolytic plating is completed, the plating jig mounted on the jig holding means is moved out of the plating solution and rotated. It is characterized by including a step of scattering and removing the plating solution by centrifugal force.

As described above, after the electrolytic plating is completed, the plating jig is moved out of the plating solution, and the plating solution is spun and removed by centrifugal force to remove the plating solution. There is no fear of doing.

In the apparatus for plating a substrate according to the fifth aspect, the substrate holding means includes a plurality of connecting means on an outer peripheral portion of the first holding member for connecting the second holding member to the first holding member by a spring. Further, there is provided a release means for releasing the connection by moving the protrusion of the connection means relative to the first holding member.

[0037]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration example of a substrate plating apparatus according to the present invention. In the drawing, reference numeral 10 denotes a plating tank containing a plating solution Q, 20 a plating jig for holding a substrate wf such as a semiconductor wafer, 30 a jig holding mechanism for holding the plating jig 20, and 40 an anode electrode. Board, 50
Is a saucer.

The plating tank 10 is provided with a plating liquid supply port 11 and a plating liquid discharge port 12.
0 and discharge from the plating tank 10. As described later, the holding claws 32 of the jig holding portion 31 of the jig holding mechanism 30 are provided on the upper end of the plating tank 10.
(Here, four) release members 1 for releasing the holding of
3 are provided. The release members 13 can move forward and backward as shown by arrows B toward the center of the plating tank.

As will be described in detail later, the plating jig 20
The substrate wf is held by exposing the surface to be plated. The jig holding mechanism 30 includes a jig holding unit 31 that holds the plating jig 20, and the jig holding unit 31 includes at least three or more arms 31-2 as described later in detail. A holding claw 32 for holding the plating jig 20 is provided at the tip of the arm 31-2.

A rotary shaft 33 is provided vertically at the center of the jig holding portion 31, and the rotary shaft 33 can be rotated by a motor 34 via a gear 35. That is, the rotating shaft 33, the motor 34, the gear 35, and the like constitute a rotating mechanism 36 that holds and rotates the jig holding unit 31 in a horizontal posture. The rotating mechanism 36 can be moved up and down by an elevating mechanism 39 including a motor 37 and a rack and pinion gear 38.

The anode electrode plate 40 is attached to the tip of an arm 41, and the arm 41 is attached to a vertically disposed rotating shaft 42.
It is fixed to. The rotating shaft 42 can be moved up and down by a motor 43 via a rack and pinion gear 44. That is, the rotating shaft 42, the motor 43, the rack and pinion gear 44, and the like constitute a lifting mechanism 45 that raises and lowers the anode electrode plate 40.

The receiving tray 50 is attached to the tip of an arm 51, and the other end of the arm 51 is fixed to a rotating shaft 52. The rotating shaft 52 is arranged concentrically outside the rotating shaft 42 and can be rotated by a motor 53 via a gear 54. That is, a rotating mechanism 55 for rotating the arm 51 that supports the tray 50 with the rotating shaft 52, the motor 53, the gear 54, and the like is configured.

FIG. 2 is a view showing the structure of the plating jig 20. FIG. 2 (a) is a front view, FIG. 2 (b) is a plan view, and FIG.
(C) is a sectional view. The plating jig 20 includes a disc-shaped first jig member 21 and an annular second jig member 22 having an opening 22a for exposing a surface of the substrate wf to be plated. A plurality (four in the figure) of coupling claws 23 are provided on the outer peripheral portion of the first jig member 21. The substrate wf is accommodated in the substrate accommodating recess of the first jig member 21, the second jig member 22 is placed thereon, and the edge of the second jig member 22 is clamped by the coupling claws 23. The surface of the substrate wf to be plated is exposed to the opening 22a, and is sandwiched between the first jig member 21 and the second jig member 22.

A first seal member 25 is provided on an outer peripheral portion of the opening 22a of the second jig member 22, and a second seal member 26 is provided outside the first seal member 25 at a predetermined interval. The substrate w is formed by the first seal member 25 and the second seal member 26.
The front edge and the rear surface of f do not touch the plating solution Q. A jig provided with a plurality of (four in the figure) jigs provided on the outer periphery of the upper surface of the second jig member 22 is provided with a conductive member 27 which is in contact with the surface edge of the substrate wf which does not touch the plating solution Q. It is electrically connected to the external electrode contact 28. The connecting claw 23 is constantly urged by the spring 23a around the support shaft 23b in a direction of connecting the second jig member 22 and the first jig member 21 to each other, and pushing the rear end of the connecting claw 23. As a result, it turns around the support shaft 23b in the direction to release the connection.

FIG. 3 shows a jig holding portion 31 of the jig holding mechanism 30.
3A is a front view, FIG. 3B is a plan view, and FIG. 3C is a perspective view showing a holding claw. As shown in the drawing, the jig holding section 31 includes a plurality of (four in the figure) arms 31-2 attached to a base 31-1.
1-2, holding claws 32 for holding plating jig 20 at the tip
Is provided. As shown in FIG. 4 (details of the portion A in FIG. 1), the holding claw 32 is attached to the tip of the arm 31-2 by a support shaft 32-.
1, and is always urged by a spring 32-4 in the direction of holding the plating jig 20 (the direction of arrow B). By pressing the claw release member 32-3, the holding claw 32 is rotated in a direction for releasing the holding of the plating jig 20 (in the direction indicated by the arrow B) to release the holding of the plating jig 20. I have.

On the lower surface of the distal end portion of the holding claw 32, a holding tool electrode contact 32-abutting on a jig external electrode contact 28 provided on the outer circumference of the upper surface of the second jig member 22 of the plating jig 20.
2 are provided. The holder electrode contact 32-2 is shown in FIG.
As shown in FIG. 3, the electrode housing 32-2a and the movable electrode member 32
-2b, the electrode housing 32-2a and the movable electrode member 3
A spring 32-2c is interposed between 2-2b, and the movable electrode member 32-2b has a structure capable of moving up and down. Furthermore, a seal member 32 tightly fixed to the outer periphery of the electrode housing 32-2a on the outer periphery of the movable electrode member 32-2b and the spring 32-2c.
-2d.

With the above-described structure of the holder electrode contact 32-2, the plating jig 20 is placed on the jig holder 31, and the outer peripheral surface of the second jig member 22 is pressed by the holding claw 32. When held, the distal end of the seal member 32-2d is in close contact with the outer peripheral surface, so that the jig external electrode contact 28 and the holder electrode contact 32-2 are surrounded by the seal member 32-2d and come into contact with the plating solution. Never.

When plating the substrate wf in the substrate plating apparatus having the above structure, first, the substrate wf is mounted on the plating jig 20. That is, the substrate wf is accommodated in the substrate accommodating recess of the first jig member 21, the second jig member 22 is placed thereon, and the edge of the second jig member 22 is clamped by the coupling claws 23. The substrate wf is mounted on the plating jig 20.

Subsequently, the motor 37 is started, and the elevating mechanism 39 is operated to raise the jig holding portion 31 to above the release member 13 above the plating liquid level W. In this state, the plurality of release members 13 are advanced toward the center of the plating tank 10 and positioned below the claw release members 32-3. In this state, when the jig holding unit 31 is lowered by the elevating mechanism 39, the lower end of the claw release member 32-3 contacts the release member 13, and the claw release member 32-3 is relatively pushed up. Thereby, the holding claw 32 rotates about the support shaft 32-1 in the direction of releasing the holding of the plating jig 20 (the direction of the arrow B in FIG. 4).

Subsequently, the plating jig 20 on which the substrate wf is mounted is placed on the jig holding portion 31 of the jig holding mechanism 30 with the opening 22a of the second jig member 22 facing upward. In this state, when the jig holding portion 31 is raised by the elevating mechanism 39, the claw release member 32-3 is separated from the release member 13, and the holding claw 32 is held by the spring 32-2c in the direction of holding the plating jig 20 ( The plating jig 20 is held by rotating in the direction of arrow B in FIG. 6A and 6B are diagrams showing a state where the plating jig 20 is held by the jig holding portion 31 of the jig holding mechanism 30. FIG. 6A is a front view, and FIG. 6B is a plan view.
After the jig holding section 31 holds the plating jig 20, the release member 13 is retracted and returned to the original position. Thereby, the jig holding portion 31 can be lowered into the plating tank 10 without being disturbed by the release member 13.

In this state, the jig holding unit 31 is lowered by the lifting mechanism 39 to lower the plating solution Q in the plating tank 10 to a predetermined position where plating is performed. Subsequently, the motor 53 is activated to operate the rotating mechanism 55 to move the anode electrode plate 40 evacuated outside the plating tank 10 to a position directly above the plating tank 10 via the rotating shaft 42 and the arm 41. . Subsequently, the motor 43 is started, and the elevating mechanism 45 is operated to lower the anode electrode plate 40 to a predetermined position in the plating solution Q of the plating tank 10 where plating is performed.

Next, the anode of a plating power source (not shown) is electrically connected to the anode electrode plate 40 (the connection method is not shown), and the cathode is held by the holding claws 32 of the jig holding portion 31. It is electrically connected to the conductive portion on the surface of the substrate wf through the fixture electrode contact 32-2, the jig external electrode contact 28 of the plating jig 20, and the conductive member 27. Subsequently, a plating current is passed between the anode electrode plate 40 and the substrate wf from the plating power source, and plating is performed on the surface of the substrate wf exposed at the opening 22a of the plating jig 20. During this plating period, the jig holding unit 31 is rotated at a low speed by the rotation mechanism 36.
Thereby, a plating film having a uniform thickness can be formed on the exposed surface of the substrate wf.

When the plating is completed, the raising / lowering mechanism 45 raises the anode electrode plate 40 to a predetermined position on the plating liquid surface W just above the plating tank 10. Subsequently, the motor 53 is started, the rotation mechanism 55 is operated, and the pan 50 is swirled and moved directly below the anode electrode plate 40 via the arm 51. As shown in FIG. 7, the pan 50 has the vertical and horizontal dimensions of the anode electrode plate 4.
It is larger than the diameter of 0 and can receive all of the plating solution dropped from the anode electrode plate 40. The plating solution dropped on the tray 50 is discharged from the plating apparatus through a discharge port 56 through a discharge pipe 57.

At a predetermined position on the outer periphery of the rotating shaft 42 for rotating the anode electrode plate 40, as shown in FIG.
a is provided, and a rotation shaft 52 for rotating the pan 50 is provided.
Are provided with two grooves 52a and 52b in the axial direction on the inner circumference thereof. The protrusions 42a of the rotating shaft 42 are formed in the grooves 52a and 52b.
Is to be inserted. The grooves 52a and 52b are formed at substantially right angle intervals.

As described above, the tray 50 is connected to the anode electrode plate 40.
When the arm 51 is positioned directly below the arm 41, the arm 51 is positioned immediately below the arm 41.
a is inserted into the groove 52a. When the rotating shaft 52 is rotated by the rotating mechanism 55 in this state, the anode electrode plate 40 is
0 and moves to the outside of the plating tank 10 so that the plating tank 1
Open above 0.

Subsequently, the jig holding section 31 is raised to a predetermined position above the plating liquid level W by the lifting mechanism 39.
In this state, the jig holding unit 31 is rotated at high speed around the rotation axis 33 by the rotation mechanism 36, and the plating solution adhered to the substrate wf, the plating jig 20 and the jig holding unit 31 is removed by centrifugal force due to the rotation. Spatter and remove the plating solution.

Subsequently, the lifting mechanism 39 moves the jig holding unit 31 to a position above the release member 13, and advances the plurality of release members 13 toward the center of the plating tank 10 as described above to release the claw. It is located below the member 32-3. Subsequently, when the jig holding unit 31 is lowered by the elevating mechanism 39, the lower end of the claw release member 32-3 contacts the release member 13, and the claw release member 32-3 is relatively pushed up. Accordingly, the holding claw 32 rotates about the support shaft 32-1 in a direction in which the holding of the plating jig 20 is released. In this state, the plating jig 20 on which the substrate wf is mounted is taken out by, for example, a robot arm and moved to the next processing step.

The jig holding section 31 is rotated at a high speed around the rotation axis 33, and after the plating solution is removed by centrifugal force due to the rotation, the plating jig 20 taken out of the jig holding section 31 is transferred to the substrate wf. If the substrate wf is taken out after washing and drying with the substrate mounted, the attached plating solution is completely removed.

The groove 52b of the rotating shaft 52 is a groove into which the projection 42a of the rotating shaft 42 is inserted when the anode electrode plate 40 is lowered to the position where plating is performed, and the projection 42a is formed at the bottom of the groove 52b. The anode electrode plate 40 is formed so as to be in a position where plating is performed in the plating tank 10 (the position shown in FIG. 1) when the anode electrode plate 40 comes into contact therewith.

As described above, the anode electrode plate 40 is
0, the saucer 50 slightly larger than the anode electrode plate 40 is disposed immediately below the anode electrode plate 40.
The plating solution adhering to the plate does not drop out of the tray 50. Further, the jig holding unit 31 is rotated around the rotation axis 33, and the centrifugal force of the rotation removes the substrate wf, the plating jig 20 and the plating liquid attached to the jig holding unit 31, and then removes the substrate wf Is moved and the plating jig 20 is taken out, so that there is no possibility that the plating solution adheres to the substrate wf when the substrate wf is taken out.

FIG. 9 is a diagram showing another configuration example of the substrate plating apparatus according to the present invention. In the drawings, the portions denoted by the same reference numerals as those in FIGS. 1 to 9 indicate the same or corresponding portions (hereinafter, the same applies to other drawings). In the present plating apparatus, an upper structure 15 is provided above the plating tank 10, and an elevating / rotating mechanism 60 is mounted on the upper structure 15. The lifting / rotating mechanism 60 is provided with a rotating shaft 61 extending vertically downward, and the jig holding portion 31 is attached to a lower end of the rotating shaft 61. That is, here, the jig holding mechanism 30 includes the jig holding unit 31, the rotating shaft 61, the elevating / rotating mechanism 60, and the like.

The jig holding section 31 of the jig holding mechanism 30 is shown in FIG.
Has substantially the same structure as the jig holder 31 shown in FIG. The plating jig 20 held by the jig holding portion 31 has substantially the same structure as the plating jig 20 shown in FIG. Here, the jig holding portion 31 is attached downward from the upper structure 15, and the plating jig 20 is mounted on the substrate wf exposed at the opening 22a.
Is held by the jig holding portion 31 such that the surface of the jig is on the lower side. Further, the anode electrode plate 40 is disposed below and facing the opening 22 a of the plating jig 20. A release projection 14 is provided on the lower surface of the upper structure 15 for contacting a claw release member 32-3 for releasing the holding claw 32 of the jig holding portion 31.

The conductive member 27 is electrically connected to a jig external electrode contact 28 provided at the center of the back surface (the side opposite to the opening 22 a) of the first jig member 21 of the plating jig 20. I have. When the plating jig 20 is held in the jig holding portion 31 at the center of the base 31-1 of the jig holding portion 31, the holding electrode contact 32 abuts on the jig external electrode contact 28. -5 is provided.

As shown in FIG. 11, the holder electrode contact 32-5 includes a movable electrode member 32-5b and a base 31-1.
A spring 32-5c is interposed between a concave hole 31-1a formed in the center of the movable electrode member and the movable electrode member 32-5b, and the movable electrode member 32-5b has a structure capable of moving up and down. Furthermore,
It has a structure in which a seal member 32-5d is provided on the outer periphery of the movable electrode member 32-5b and the spring 32-5c, which is tightly fixed to the outer periphery of the convex portion 31-1b formed at the center of the base 31-1. is there.

When the plating jig 20 is held by the jig holding portion 31, the tip of the sealing member 32-5 d comes into close contact with the surface of the first jig member 21 of the plating jig 20. The electrode contact 28 and the holder electrode contact 32-5 do not come into contact with the plating solution. The movable electrode member 32-5b is electrically connected to the cathode of the plating power source E,
5b is electrically connected to the conductive member 27 via the jig external electrode contact 28. The anode of the plating power source E is connected to the anode electrode plate 40.

When plating the substrate wf in the substrate plating apparatus having the above configuration, first, the substrate wf is mounted on the plating jig 20. Jig holding part 31 of jig holding mechanism 30
The claw release member 32-3 is lifted above the plating liquid surface W by the lifting / lowering / rotating mechanism 60 via the rotating shaft 61 to a position slightly below the contact position with the release protrusion 14, and is rotated by the lifting / lowering / rotating mechanism 60. By rotating at high speed through the shaft 61, the centrifugal force causes the plating solution attached to the jig holding portion 31 to be scattered and removed. Next, the upper structure 15 equipped with the lifting / lowering / rotating mechanism is moved to a position where the plating jig 20 is attached / detached by the opening / closing means as shown in FIG. When the holding portion 31 is raised and the claw release member 32-3 is brought into contact with the release protrusion 14, the holding claw 32 is opened.

In this state, the plating jig 20 on which the substrate wf is mounted by, for example, a robot arm is moved so that the first jig member 21 is on the jig holding section 31 side.
Contact 1 In this state, when the jig holding unit 31 is moved by the lifting / lowering / rotating mechanism 60 until the claw release member 32-3 is separated from the release protrusion 14, the holding claw 32 rotates in the direction of holding the plating jig 20. Then, the plating jig 20 is held by the jig holding section 31.

Next, the upper structure is moved to a closed position above the plating tank 10 by the opening / closing means, and the elevating / rotating mechanism 60 is moved.
As a result, the jig holding unit 31 is lowered, and the plating jig 20 is lowered to a position where plating is performed in the plating solution Q. In this state, the anode electrode plate 40 and the substrate w
A plating current is applied during f to perform plating. When this plating is being performed, the jig holding unit 31 is rotated around the rotation axis 61 at a low speed by the lifting / lowering / rotating mechanism 60, so that the surface exposed to the opening 22a of the substrate wf has a uniform thickness. A film can be formed.

After the plating is completed, the lifting and rotating mechanism 6
0, the jig holding portion 31 is raised above the plating liquid surface W to a position slightly below the position where the claw release member 32-3 abuts on the release protrusion 14, and then the lift / rotation mechanism 60 rotates the rotary shaft 61. Rotate at high speed. Thus, the plating solution adhering to the substrate wf, the plating holder 20 and the jig holder 31 is scattered and removed by the centrifugal force. Next, the upper structure 15 is moved to the open position. In this state, the jig holding portion 31 is slightly moved to the upper structure 15 side by the elevating / lowering mechanism 60, and the claw release member 32-3 is released from the release protrusion 14. , The holding claws 32 are released.

The plating jig 20 is taken out by the robot arm and transferred to a position where the substrate wf in the next step is taken out, and the substrate wf is taken out of the plating jig 20 there. Thus, the jig holding unit 31 is rotated at a high speed around the rotation axis 33, and the substrate wf and the plating jig 20 are rotated by centrifugal force.
The plating jig 20 is taken out of the substrate wf after removing the plating solution attached to the jig holding portion 31. Therefore, there is no possibility that the plating solution adheres to the substrate wf when the substrate wf is taken out.

FIG. 12 is a diagram showing another configuration example of the substrate plating apparatus according to the present invention. As shown in the figure, the present plating apparatus has a projection 16a formed at the rear end of the upper structure 16 of the plating tank 10, and the rear end is formed on the upper end of a bracket 67 provided on the side of the plating tank 10. It is rotatably supported via a support shaft 65. A support shaft 64 is provided on the protrusion 16a.
The front end of the piston rod 63 of the cylinder 62 is supported via the shaft 62, and the rear end of the cylinder 62 is supported at the lower end of the bracket 67 via the support shaft 66.

By operating the cylinder 62 to extend the piston rod 63, the upper structure 16 covers and covers the upper part of the plating tank 10, and by contracting the piston rod 63, the upper structure 16 is pivoted. 65
To the position shown in FIG. 13, that is, when the substrate wf is mounted on the substrate holding means 100 or the substrate holding means 1
The substrate is moved from 00 to a position where the substrate wf is removed (the upper structure 16 is opened). Here, the cylinder 62 and the piston rod 63 constitute an opening and closing mechanism for opening and closing the upper structure 16. This opening and closing mechanism has substantially the same structure as the opening and closing mechanism for opening and closing the upper structure 15 in FIG.

The substrate holding means 100 includes a disk-shaped first holding member 101 and an annular second jig holding member 102 having an opening 102a for exposing a surface of the substrate wf to be plated. . A plurality of (here, three) holding claws 103 are provided on an outer peripheral portion of the first holding member 101. The substrate wf is accommodated in the substrate accommodating recess of the first holding member 101, and the second holding member 102 is placed thereon, and the holding claw 1
03, the edge of the second holding member 102 is sandwiched to expose the plating surface of the substrate wf to the opening 102a, and the first holding member 101 and the second holding member 102
Sandwiched between.

A first seal member 105 is provided on the outer periphery of the opening 102a of the second holding member 102, and a second seal member 106 is provided outside the first seal member 105 at a predetermined interval. The first seal member 105 and the second seal member 106 prevent the front edge and the rear surface of the substrate wf from touching the plating solution Q. As shown in FIG. 14, the holding claw 103 is constantly urged by a spring 103a in a direction of connecting the second holding member 102 and the first holding member 101 around the support shaft 103b. By pressing the end, the pivot is turned around the support shaft 103b in a direction to release the connection.

A moving / rotating mechanism 80 is mounted on the upper part of the upper structure 16.
The first holding member 101 of the substrate holding means 100 is fixed to the tip of the rotating shaft 68. That is, as shown in FIG. 1, the substrate holding means 100 is directly or indirectly attached to the tip of the rotating shaft 68 without going through the jig holding portion 31 of the jig holding mechanism 30.
Further, a plurality of (here, three) holding claws 103 are provided on an outer peripheral portion of the first holding member 101.

FIG. 14 is a perspective view showing the structure of the holding claw 103. As shown in FIG. As shown in the drawing, the holding claw 103 is rotatably supported on an end of a bracket 101a attached to the outer periphery of the first holding member 101 by a support shaft 103b.
At 03a, the second holding member 102 is urged in the arrow A direction (the direction in which the first holding member 101 and the second holding member 102 are joined) to press the first holding member 101 against the first holding member 101. By pressing the rear end 103c of the holding claw 103, the holding claw 1 is pressed.
Numeral 03 rotates in a direction opposite to arrow A (a direction in which the first holding member 101 and the second holding member 102 are disconnected).

A plurality (three in this case) of release members 17 for pressing the rear end portion 103c of the holding claw 103 are provided on the lower surface of the upper structure 16, and the release members 17
0 (in the direction of arrow B). FIG. 15 is a view showing the configuration of this release mechanism. The release member 17 can be advanced and retracted in the direction of arrow B by the cylinder 18. That is, a release mechanism 70 that releases the connection between the holding claw 103 by the release member 17 and the cylinder 18 or the like is configured. The number of the release mechanisms 70 (three in this case) corresponding to the number of the holding claws 103 is arranged on the outer periphery of the substrate holding means 100. Note that FIG.
15A is a plan view, and FIG. 15B is a side view.

FIG. 16 is a view showing another configuration example of the release mechanism 70 for moving the release member 17 in the direction of arrow D.
As shown in the figure, the release mechanism 70 has a rotatable disk gear 71 disposed on the outer periphery of a rotary shaft 68, and three cranks 72 rotatably supported by a support shaft 73 on the disk gear 71.
One end of the crank 72 is pivotally mounted, and the other end of the crank 72 is
4 is supported, and a release member 17 is further attached to the rod 74. The disk gear 71 can be rotated in the direction of arrow E by a motor 76 via a worm gear 75. Therefore, the disk-shaped gear 71 is
Is rotated in the direction of arrow E, the release member 17 advances and retreats in the direction of arrow B, and the three holding claws 103 can be released simultaneously.

The moving / rotating mechanism 80 rotates the rotating shaft 68 to rotate the substrate holding means 100 and the rotating shaft 6
8 is moved in the axial direction to move the substrate holding means 100 in the same direction. FIG. 17 is a diagram showing a configuration example of the moving / rotating mechanism 80. FIG.
FIG. 17B is a top view (with the frame 81 removed). A disc 82 is fixed at a predetermined interval to the lower surface of the frame 81 of the upper structure 16, and an internal gear 83 is guided above the disc 82 by rotating its outer periphery by three guide rollers 84. It is arranged as possible.

Reference numeral 85 denotes a screw rod.
The three gear rods 85 are arranged at equal angles on the inside of the gear 3, and the lower end of each screw rod 85 is provided with a gear 86 that meshes with the internal teeth of the internal gear 83. Reference numeral 87 denotes a frame of the moving / rotating mechanism 80. The frame 87 has a cylindrical shape, and a pair of upper and lower brackets 88 are mounted on the outer periphery of the frame 87. A pair of upper and lower brackets 88 has screw grooves formed on the inside thereof to be screwed into the respective screw rods 85. A motor 89 for rotating the rotating shaft 68 is mounted on the frame 87. Also, the internal gear 8
The motor 3 is rotated by a motor 90 via a gear 91.

In the moving / rotating mechanism 80 having the above structure,
When the motor 90 is started to rotate the internal gear 83, the three gears 86 rotate at the same time, and the three screw rods 85 rotate at the same time. As a result, the frame 87 via the bracket 88
Move up and down, and the rotating shaft 68 and the substrate holding means 100 attached thereto also move up and down. When the motor 89 is started, the rotating shaft 68 and the substrate holding means 100 attached to the rotating shaft 68 rotate.

When plating the substrate wf with the substrate plating apparatus having the above structure, the plating is performed according to the procedure shown in FIG. First, the cylinder 62 is activated, and the upper structure 16 is moved to the position shown in FIG.
As shown in (a), the bottom face is directed obliquely upward. At this time, the release mechanism shown in FIG. 15 or FIG. 16 is activated, and the three release members 17 are simultaneously advanced toward the center of the upper structure 16 to simultaneously push the rear ends of the holding claws 103 to release the connection. . Thereby, the substrate holding means 100
The second holding member 102 can be detached from the first holding member 101.

In this state, the substrate wf is moved to the first holding member 10.
The substrate-receiving recess is placed with the surface to be plated facing up. When the second holding member 102 is placed thereon and the three release members 17 are returned to their original positions by the above-described release mechanism, as shown in FIG. The first holding member 101 and the second holding member 102 are joined by three joining claws 103 with the substrate wf interposed between the holding members 102.

Subsequently, the cylinder 62 is started, and FIG.
As shown in (c), the upper structure 16 is put on the plating tank 10. In this state, the moving / rotating mechanism 80
The substrate holding means 100 is lowered to a predetermined position in the plating solution Q. In this state, plating current is applied between the substrate wf and the anode electrode plate 40 to perform plating. When plating,
As shown in FIG. 18D by the movement / rotation mechanism 80,
By rotating the substrate holding means 100 at a low speed, a plating film having a uniform thickness can be formed on the substrate wf.

When the plating is completed, the moving / rotating mechanism 80
As a result, the substrate holding means 100 is raised above the level of the plating solution Q. Subsequently, as shown in FIG. 18E, the substrate holding means 100 is rotated at this position at a high speed, and the plating solution attached to the substrate wf and the substrate holding means 100 is removed by the centrifugal force.

Subsequently, the cylinder 62 is started, and FIG.
As shown in (f), the upper structure 16 is rotated to a position where the bottom surface faces obliquely upward. In this state, FIG.
As shown in FIG. 7, the release mechanism 70 is activated, and the three release members 17 are simultaneously advanced toward the center of the upper structure 16,
The rear ends of the holding claws 103 are simultaneously pushed to release the connection. Thereby, the second holding member 1 of the substrate holding means 100
02 is removed from the first holding member 101, the substrate wf after plating is removed by a robot arm or the like, and transferred to the next step.

As described above, the substrate holding means 100 is rotated at a high speed, and the substrate wf and the substrate holding means 10 are rotated by centrifugal force.
After removing the plating solution attached to the substrate 0, the substrate wf is taken out of the substrate holding means 100. Therefore, there is no danger that the plating solution will adhere to the substrate wf when the substrate wf is taken out.

[0088]

As described above, according to the invention described in each claim, the following excellent effects can be obtained.

According to the first aspect of the present invention, the substrate is mounted on the plating jig, the plating jig is held by the jig holding portion of the jig holding means, and electrolytic plating is performed. Since only the surface of the substrate mounted on the plating jig is exposed to the plating solution, the plating solution does not adhere to the surface other than the plating surface, thereby eliminating the inconvenience of the plating metal being diffused into the substrate.

According to the second aspect of the present invention, each step is performed after the substrate is mounted on the plating jig.
Since the substrate does not come into contact with the plating solution except for the surface where the plating jig comes into contact with the plating solution, it is possible to perform plating of the substrate without inconvenience such as diffusion of the plating metal into the substrate. .

Further, according to the third aspect of the present invention, after the plating step is completed, the plating jig mounted on the jig holding means is moved out of the plating solution and then rotated to rotate the plating solution by centrifugal force. When the anode electrode plate is not above the jig for plating, that is, when the surface to be plated of the substrate faces downward and the anode electrode plate is below the jig holding means, or when there is no anode electrode plate Also, when the substrate is removed from the plating jig, there is no possibility that the plating solution adheres to the substrate.

According to the fourth aspect of the present invention, since the substrate is washed and dried while holding the substrate with the plating jig, when the substrate is removed from the plating jig, the plating solution adheres to the substrate. There is no fear of doing it.

According to the fifth aspect of the present invention, only the surface of the substrate exposed to the opening of the second holding member of the substrate holding means contacts the plating solution, so that the other surface does not contact the plating solution. After the electroplating is completed, after the plating is completed, the substrate holding means is raised above the plating liquid surface by the elevating means, and is rotated at a high speed by the rotating means, so that the plating liquid can be removed. No contact with plating solution. In addition, since the substrate holding means holding the substrate is rotated at a low speed during the plating period, a plating film having a uniform thickness can be formed on the surface of the substrate exposed at the opening.

According to the present invention, each of the above-described steps is performed after the substrate is sandwiched and held between the first holding member and the second holding member of the substrate holding means. The plating solution does not come into contact with the plating jig except for the surface that is in contact with the plating solution. In particular, since the plating solution is removed by moving the substrate holding means above the plating liquid surface and rotating it after plating is completed, there is no possibility that the plating liquid will adhere to the substrate when the substrate is removed from the substrate holding means.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration example of a substrate plating apparatus of the present invention.

2 (a) is a front view, FIG. 2 (b) is a plan view, and FIG. 2 (c) is a cross-sectional view showing the structure of a plating jig used in the plating apparatus of the present invention. .

3 (a) is a front view, FIG. 3 (b) is a plan view, and FIG. 3 (b) is a view showing a structure of a jig holding portion of the plating apparatus of the present invention.
(C) is a perspective view showing a holding claw.

FIG. 4 is a diagram showing details of a portion A in FIG. 1;

FIG. 5 is a cross-sectional view showing a structure of a holder electrode contact of a jig holder of the plating apparatus of the present invention.

6A and 6B are diagrams showing a state in which a plating jig is held by a jig holding portion of the plating apparatus of the present invention, wherein FIG. 6A is a front view and FIG. 6B is a plan view.

FIG. 7 is a plan view showing an anode electrode plate and a saucer of the plating apparatus of the present invention.

FIG. 8 is a diagram showing an upper structure of a rotating shaft for rotating the anode electrode plate and the tray.

FIG. 9 is a diagram showing a configuration example of a substrate plating apparatus of the present invention.

10 is a diagram showing a state where an upper structure of the plating apparatus for a substrate shown in FIG. 9 is opened.

FIG. 11 is a cross-sectional view showing a structure of a holder electrode contact of a jig holder of the plating apparatus of the present invention.

FIG. 12 is a diagram showing a configuration example of a substrate plating apparatus according to the present invention.

13 is a diagram showing a state where an upper structure of the plating apparatus for a substrate shown in FIG. 11 is opened.

FIG. 14 is a perspective view showing the structure of the holding claws of the substrate holding means of the substrate plating apparatus of the present invention.

15A and 15B are diagrams showing a configuration example of a holding claw releasing mechanism of a substrate holding means of the substrate plating apparatus of the present invention, wherein FIG. 15A is a plan view and FIG. 15B is a side view.

FIG. 16 is a plan view showing a configuration example of a holding claw releasing mechanism of a substrate holding means of the substrate plating apparatus of the present invention.

17A and 17B are diagrams showing a configuration example of a moving / rotating mechanism of a substrate plating apparatus according to the present invention, wherein FIG.
(B) is a top view.

18 is a diagram showing a plating procedure using the substrate plating apparatus shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Plating tank 13 Release member 20 Plating jig 21 First jig member 22 Second jig member 23 Coupling claw 25 First seal member 26 Second seal member 27 Conductive member 28 Jig external electrode contact 30 Jig holding mechanism REFERENCE SIGNS LIST 31 jig holding portion 32 holding claw 33 rotating shaft 36 rotating mechanism 39 elevating mechanism 40 anode electrode plate 41 arm 42 rotating shaft 45 elevating mechanism 50 receiving pan 51 arm 52 rotating shaft 55 rotating mechanism 60 elevating / rotating mechanism 61 rotating shaft 62 cylinder 68 Rotating shaft 70 Release mechanism 80 Moving / rotating mechanism 100 Substrate holding means 101 First holding member 102 Second holding member 103 Holding claw 105 First seal member 106 Second seal member 107 Conductive member

Claims (6)

[Claims] A substrate held by a plating jig and an anode electrode plate are arranged in a plating tank containing a plating solution, and a plating current is applied between the anode electrode plate and the substrate to apply a current to the substrate. In a plating apparatus for a substrate to be plated, an opening for exposing a surface of the substrate to be plated is formed in the plating jig, a seal member is attached around the opening, and the plating member is exposed to a plating solution by the seal member. A conductive member is provided in contact with a surface edge of the substrate, and a jig external electrode contact for connecting a power source to the conductive member is provided at a predetermined position on an outer surface of the plating jig. A jig holding unit having a jig holding unit for holding the plating jig is provided inside the tank, and the jig holding unit holds the plating jig in the jig holding unit. Holder that contacts the electrode contact Plating apparatus of the substrate, characterized by. 2. A method of plating a substrate by electroplating the substrate, comprising: mounting the substrate on a plating jig; and mounting and holding the plating jig with the substrate mounted on a jig holding means. Arranging a plating jig mounted on the jig holding means at a predetermined position in a plating solution of a plating tank; arranging an anode electrode plate at a predetermined position in a plating solution of a plating tank; A step of flowing a plating current between the anode electrode plate and the substrate to perform electrolytic plating, a step of moving the anode electrode plate out of the plating tank, and plating the plating jig mounted on the jig holding means outside the plating solution. Moving the jig to the jig removal position, releasing the holding of the plating jig mounted on the jig holding means, removing the plating jig from the jig holding means, and removing the plating jig from the jig holding means. It is characterized by comprising the process of taking out from the tool Plating method of a substrate that. 3. A method of plating a substrate for plating a substrate, comprising: mounting the substrate on a plating jig; mounting and holding the plating jig with the substrate mounted on a jig holding means; Disposing a plating jig mounted on the jig holding means at a predetermined position in a plating solution in a plating tank; performing plating on a substrate surface exposed from the plating jig; Moving the plating jig mounted on the means out of the plating solution and then rotating to remove the plating solution by centrifugal force, removing the plating jig, and moving the jig holding means to a position where the plating jig is removed; A method for plating a substrate, comprising: a step of removing a plating jig from the jig holding means; and a step of removing a substrate from the plating jig. 4. A method of plating a substrate, wherein the plating is performed by holding a plating jig holding the substrate by a jig holding means, and then plating the plated substrate. Cleaning and drying while holding the substrate with a jig, and removing the substrate from the plating jig in a state where the plating solution does not adhere to the unplated surface of the substrate. . 5. A plating apparatus for plating a substrate by applying a plating current between an anode electrode plate and a substrate held by a substrate holding means disposed in a plating tank containing a plating solution, wherein the substrate is plated. The holding means has a first holding member and a second holding member for holding the substrate, the second holding member has an opening exposing a surface of the substrate to be plated, a sealing member attached around the opening, A conductive member that is in contact with a surface edge of the substrate partitioned by a seal member so as not to come into contact with a plating solution, and is configured to hold the substrate with a surface to be plated facing downward; A rotating means for rotating around a rotation axis in a plane holding the substrate in the means and / or a moving means for moving in the axial direction of the rotation axis is attached to the upper structure disposed on the plating tank, Said A plating apparatus for a substrate, further comprising a structure opening / closing drive means for driving an upper structure to open / close. 6. A method for plating a substrate by electroplating the substrate, wherein the substrate is sandwiched and held between a first holding member and a second holding member of the substrate holding means, and the substrate holding means is plated. Removing the plating solution by moving the substrate holding means to a predetermined position in the tank, plating the exposed surface of the substrate, and moving the substrate holding means onto the plating solution surface and then rotating the substrate holding means; A step of moving the substrate holding means to a position where the holding of the substrate is released, a step of releasing the holding of the substrate by the substrate holding means, and a step of removing the second holding member and removing the substrate. Plating method.