CN110387571A

CN110387571A - Wafer jig for electroplating device

Info

Publication number: CN110387571A
Application number: CN201810343833.6A
Authority: CN
Inventors: 姜力; 于勇
Original assignee: Individual
Current assignee: Chipmore Technology Corp Ltd
Priority date: 2018-04-17
Filing date: 2018-04-17
Publication date: 2019-10-29
Anticipated expiration: 2038-04-17
Also published as: CN110387571B

Abstract

A kind of wafer jig for electroplating device, including a carrier, at least an interlock ring, at least one plating carrier, at least a upper cover and an at least operating bar, carrier fixed plating carrier and is installed with the interlock ring that can be rotated in a manner of concentric in its side-walls, carrier outer circumferential walls edge, which is electroplated, has multiple locating pieces, interlock ring outer circumferential walls root edge regional area has a gear segment, and outer wall apical margin then has multiple lower fixture blocks；Upper cover is annular cover, and ring inner wall apical margin is dispersed with multiple positioning grooves, and ring inner wall root edge is then equipped with a fixed ring, has multiple upper fixture blocks in fixed ring, operating bar is longitudinally mounted, and partial section has a rack gear in carrier, and rack and pinion section is meshed.It as a result, after upper cover is covered in plating carrier, is fixed because locating piece is located in positioning groove, operator pushes operating bar, is engaged using rack and pinion section, so that interlock ring is rotated, caters to upper fixture block using lower fixture block and then screws upper cover.

Description

Wafer jig for electroplating device

Technical field

The present invention is a kind of technical field of wafer jig, especially a kind of for clamping the knot of wafer in electroplating device Structure is avoided that and excessively clamps wafer, and is conducive to the operation of subsequent automated machinery.

Background technique

As shown in Figure 1, being the wafer clamp structure of existing electroplating device, in plating carrier fixed on a carrier 11 12, in addition it is used cooperatively an inner cover 13 and a upper cover 14.The plating carrier 12 outer circumferential walls have multiple convex blocks 121, the upper cover 14 inner wall edges then have multiple upper protruding blocks 141 of relative number.In use, the wafer A to be electroplated first is placed in plating load On body 12, the inner cover 13 is placed on wafer A, it is desire plate surface that wafer A center Naked, which reveals region, then by the upper cover 14 It is covered on the inner cover 13 and the plating carrier 12 and is rotated, relatively moved using the upper protruding block 141 and the lower protruding block 121 And mutual packing effect is generated, achieve the purpose that the plating carrier 12, wafer A, inner cover 13 and the mutual clamping fixed of upper cover 14.

However above structure have the shortcomings that in use it is several following:

1. can not be with automated machine auxiliary operation: can just lock onto the plating carrier since the upper cover 14 must be rotated 12, to avoid the upper cover 14 from scratching the surface wafer A, it is necessary to using the inner cover 13 that not can rotate as intermediate medium, but be intended to When using automatic machinery auxiliary operation, because of the presence of the inner cover 13, organisation operations are easy to produce interference, therefore such crystalline substance at present The operating process of circle clamp structure can not utilize Machine automated operation all using the movement for manually carrying out upper and lower wafer；

2. in clamping process, crystal round fringes is be easy to cause to rupture: when the upper cover 14 carries out rotating tight movement, it will usually benefit It assists exerting a force with tool, be easy to cause the strength bestowed every time that can not fix, when the upper cover 14 is by excessive screwing, it is interior that this can be oppressed Lid 13 imposes on the excessive active force in the edge wafer A, be easy to cause the edge wafer A to burst apart, generates serious loss；Or it is anti- After being used for multiple times again, excessive force will also result in 141 excessive wear of part upper protruding block 121 and lower protruding block, cause clamp when in Circumference can not provide uniform force.

3. must be equipped with multiple electric wires in carrier, structure is excessively complicated: in electroplating activity, wafer A is cathode, it is necessary to be had Interlock circuit connects therewith, and external power is enable to transmit so far, thus can in the carrier 11 hide and be dispersed with electric wire, this It will increase the degree of difficulty and the subsequent group of trouble loaded onto of the processing of carrier 11.

In view of this, in order to solve existing disadvantage, the present inventor devises this one for electricity by feat of the experience of many years The wafer jig of coating apparatus.

Summary of the invention

It the main purpose of the present invention is to provide a kind of wafer jig, is applied in electroplating device, it is main using different Make flowing mode, achieve the purpose that clamp wafer, and be conducive to the running of subsequent automated equipment.

In order to achieve the above object, the present invention is including on a carrier, at least an interlock ring, at least one plating carrier, at least one Lid and an at least operating bar, the carrier the fixed plating carrier and are installed with and can be rotated in a manner of concentric in its side-walls The interlock ring, the plating carrier outer circumferential walls edge have multiple locating pieces, the partial zones of the interlock ring outer circumferential walls root edge Domain has a gear segment, and outer wall apical margin then has multiple lower fixture blocks.The upper cover is annular cover, and ring inner wall apical margin is dispersed with more A positioning groove, wall inner wall root edge are then equipped with a fixed ring, have multiple upper fixture blocks in the fixed ring, are somebody's turn to do when the locating piece is located at When in positioning groove, the upper cover and the plating carrier will be unable to relative rotation, and the operating bar is longitudinally mounted in the carrier, office Portion's section has a rack gear, which is meshed with the gear segment.

Mode of operation of the invention are as follows: when wafer is placed on the plating carrier, which is covered in by the upper cover, The two is fixed because the locating piece is located in the positioning groove.In addition operator pushes the operating bar, because the rack gear engages In the gear segment interlock ring is rotated, lower fixture block energy packing upper cover is agreed with by fixture block on this, reaches fixed Purpose, if otherwise changing the direction of rotation of the interlock ring just is to release locking condition.This can be omitted using structure of the invention The structure of existing inner cover, it is subsequent to be assisted with automaton, achieve the purpose that wafer automates fluctuating plate.

In addition the operating bar, interlock ring and fixed ring all can be used metal material and constituted in the present invention, cooperate on this The conducting wire of the ring inner wall inner edge of lid can be used as external power and be transmitted to internal power supply line, ties up in electroplating activity Holding the wafer is cathode state.This design can exempt it is existing must in the design for being additionally provided with hidden wiring in carrier, simplify script knot The complexity of structure makes product more practical.

Furthermore in the present invention, which is installed on the plating carrier periphery, and size is less than the plating carrier Apical margin size, the plating carrier be fixed it is motionless, make the interlock ring be only capable of rotate but the plating carrier can not be detached from.

In the present invention, which is made of a plate body and a support portion, forms T font structure body wide at the top and narrow at the bottom, The plate body is recessed an accommodation seat at one side wall, and the plating carrier and the interlock ring are installed on the accommodating groove seat, the accommodating Separately there is the deeper limiting slot of depth, the gear segment of the interlock ring is then located in the limiting slot, the limiting slot in groove seat It is arc-shaped, it limits the interlock ring and is only capable of one predetermined angular of rotation.

In the present invention, the plate body is longitudinal separately has an accommodating space, accommodating space part and with the accommodating groove seat phase Connection, the operating bar are installed on the accommodating space, which communicates place and the interlock ring with the accommodating groove seat in the accommodating space The gear segment be meshed.

In the present invention, the mesh section of the operating bar separately includes an adjustable pipe, a spring and adjustment part, the adjustable pipe energy Make linear reciprocating movement, which is located at the side wall of the adjustable pipe, the spring be restricted to the adjustable pipe and the adjustment part it Between, which can change the distance between the adjustable pipe through rotation, and then adjust the spring by precompressed value.Thus it is clamping Under state, a preset pressure is provided in the adjustable pipe by the spring, so that the rack gear is persistently applied pressure to the gear segment, maintains clamping The tightness of state.

The beneficial effects of the present invention are rotate a fixed angle with the interlock ring every time, reach and be tightened in upper cover Purpose can maintain the consistency to exert a force every time, avoid occurring as it is existing because exert a force it is excessive caused by wafer damage the shortcomings that.

Attached drawing and component symbol is cooperated to do more detailed description to embodiments of the present invention below, so as to be familiar with this skill Skill person can implement accordingly after studying this specification carefully.

Detailed description of the invention

The exploded view of the wafer clamp structure of the existing electroplating device of Fig. 1；

Fig. 2 is perspective view of the invention；

Fig. 3 is exploded view of the invention；

Fig. 4 is the enlarged diagram of upper cover of the present invention, plating carrier and interlock ring；

Fig. 5 is the partial enlargement diagram of operating bar of the present invention；

Fig. 6 is the schematic diagram of real use state of the present invention.

Appended drawing reference is as follows:

Carrier 11

Carrier 12 is electroplated

Lower protruding block 121

Inner cover 13

Upper cover 14

Upper protruding block 141

Wafer A

Carrier 2

Plate body 21

Reference line 211

Support portion 22

Groove 221

Latch 222

Spring 223

Second neck 224

Screw 235

Accommodate groove seat 23

Limiting slot 231

Accommodating space 24

Interlock ring 3

Gear segment 31

Lower fixture block 32

Carrier 4 is electroplated

Locating piece 41

Upper cover 5

Positioning groove 51

Fixed ring 52

Upper fixture block 53

Position line 54

Operating bar 6

Rack gear 61

Adjustable pipe 62

Spring 63

Adjustment part 64

Conducting block 65

First neck 66

Wafer B

Specific embodiment

As shown in Figure 2 and Figure 3, perspective view and exploded view respectively of the invention, wafer jig of the present invention include a carrier 2, An at least interlock ring 3, at least one plating carrier 4, at least a upper cover 5 and an at least operating bar 6.It is in the carrier in embodiment 2 two sides are all equipped with clamping crystal circle structure, and to increase production efficiency, since two sides structure is all identical, the present invention only just wherein one Side structure explains.The interlock ring 3 and the plating carrier 4 are installed on the wherein one side wall of the carrier 2 using concentric circular fashion.It should Plating carrier 4 is fixed motionless, which can be rotated an angle.The operating bar 6 is longitudinally mounted in the carrier 2, and energy It is contacted with the interlock ring 3.When upper cover 5 is covered on the plating carrier 4, the gearing is driven via 6 linear movement of operating bar Ring 3 rotates, and the interlock ring 3 can be made to screw the upper cover 5, achieve the purpose that be locked.

The structure of each component is described with that:

The carrier 2 is installed on this with for each component, which is made of a plate body 21 and a support portion 22, is formed T font structure body wide at the top and narrow at the bottom, 22 width of support portion, thickness are all greater than the plate body 21, with benefit in plating, allow the plate body 21 perpendicular shapes are latent to be dipped into an electroplating bath.The plate body 21 is recessed an accommodation seat 23 at one side wall, the accommodating groove seat 23 This is installed on for the interlock ring 3 and plating carrier 4.Separately there is the deeper limiting slot 231 of depth in the accommodating groove seat 23. The limiting slot 231 is arc-shaped, to limit the revolvable angle of interlock ring 3.In addition the plate body 21 is longitudinal separately has an accommodating Space 24,24 part of accommodating space are simultaneously connected with the accommodating groove seat 23.The accommodating space 24 is to accommodate the operating bar 6. The carrier 2 is as made by insulating materials.

The interlock ring 3 is annular in shape, and the regional area of outer circumferential walls root edge has a gear segment 31,31 bottom of gear segment Portion simultaneously protrudes from 3 bottom surface of interlock ring, and when assembling is partially located in the limiting slot 231.The arc of the limiting slot 231 is greater than should 31 distribution length of gear segment, to limit the 3 revolvable angle of institute of interlock ring.The 3 outer circumferential walls apical margin of interlock ring distribution Multiple lower fixture blocks 32, as shown in figure 4, the lower fixture block 32 has the inclined-plane that tilts down.The lower fixture block 32 is to lock this Upper cover 5.When assembling, which is installed at the circumference of the plating carrier 4, and size is less than the 4 apical margin ruler of plating carrier It is very little, therefore the interlock ring 3 is only capable of rotating but can not be detached from the plating carrier 4.The interlock ring 3 mainly uses rotation clip upper cover 5, and Because it is metal material, the transmission medium of electric power can also be used as.

Wafer places place when 4 top surface of plating carrier is plating.The plating carrier 4 is locked in the accommodation groove with screw 23 bottom surfaces of seat, are allowed to not move.4 top peripheral edge of plating carrier has multiple locating pieces 41 outwardly protruded, in group It is to cooperate when dress with the upper cover 5, prevents the upper cover 5 from rotating.

The upper cover 5 is annular cover, and ring inner wall apical margin is dispersed with multiple positioning grooves 51, the number of the positioning groove 51 and Position is corresponding with the locating piece 41.The upper cover 5 is in tool in a ring inner wall root edge then fixed fixed ring 52, the fixed ring 52 There are multiple upper fixture blocks 53.53 part of fixture block, which has, on this tilts face-up inclined-plane.On this number of fixture block 53 and position be with The lower fixture block 32 matches.The fixed ring 52 is made by metal material, and in addition the inner wall of the upper cover 5 can separately be equipped with conducting block (drawing in figure) is in contact or locks with the fixed ring 52, or is locked the fixed ring 52 using metal screws (drawing in figure), Ring inner wall apical margin is conducted power to using conducting block or metal screws, to act on the medium of power transmission when plating.

Please refer to fig. 5, the operating bar 6 is mounted in the accommodating space 24 of the carrier 2, it is responsible for driving the interlock ring 3 rotations.6 partial section of operating bar has a rack gear 61, is meshed by the rack gear 61 with the gear segment 31 of the interlock ring 3, When the operating bar 6 is back and forth pulled, the interlock ring 3 can be driven to rotate, and then the clamping upper cover 5.But the present invention in order to ensure It is not easy to loosen when in use and there is appropriate tightness, in the present embodiment, the mesh section of the interlock ring 3 and the operating bar 6 has There are some special designs.As shown in figure 5, the mesh section of the operating bar 6 separately includes an adjustable pipe 62, a spring 63 and adjustment Part 64.The adjustable pipe 62 can make linear reciprocating movement, which is located at 62 side wall of adjustable pipe.The spring 63 is restricted to Between the adjustable pipe 63 and the adjustment part 64.The adjustment part 64 can change the distance between the adjustable pipe 62 through rotation, in turn The spring 63 is adjusted by precompressed value.The spring 63 is the tightness for maintaining the adjustable pipe 62.Under actuator state, which is It is pushed in the plate body 21, though the spring 63 is compressed and also persistently applies pressure to the adjustable pipe 62, the rack gear 61 is maintained to be engaged in The tightness of the gear segment 31, it is ensured that the interlock ring 3 is tightened in the upper cover 5.

In the present invention, which can also become a conductor, using as the medium electrically transmitted.This purpose can be reduced In separately setting other electric wires in the carrier 2, make structure more simple.The operating bar 6 is metal material, adjustable pipe 62, spring 63 And adjustment part 64 is also metal material.6 top of the operating bar separately has a conducting block 65,65 shape of conducting block can on demand and Freely change, after being installed on electroplating device with benefit, can be contacted with related electrode.Then have at 22 relative position of support portion one recessed Slot 221, wherein for the conducting block 65 setting.

In addition to fixing the position that the operating bar 6 is inserted into after the carrier 2, relevant positioning is additionally provided at the support portion 22 Structure fixes its position with benefit, but can be a variety of different modes, only explains with regard to one of which in figure, and be not so limited It is only capable of using such mode.The operating bar 6 has the lesser first neck 66 of a size close to the partial section of the conducting block 65. 22 corresponding section of support portion is then equipped with a moveable latch 222 and a spring 223, which also has The lesser second neck 224 of size.As shown in figure 3, the latch 222 is up big and down small type body, in assembling, with drawing side To being from top to bottom set in the hole of the corresponding shape of support portion 22, then with the locking of screw 235, utilize the spring 223 dimension Hold the tightness of the latch 222.Under clip state, which is to be located at the first neck 66 Place, move the operating bar 6 can not, if but bestow an external force, it is from bottom to top to push away latch 222 with Fig. 3 left side structure It is dynamic, it is located at the second neck 224 in the first neck 66, which can pull out a distance, touch the interlock ring 3 Except the locking condition with upper cover 5.

Assembling mode and operating mode are described with that:

The operating bar 6 is first inserted into the accommodating space 24, then the interlock ring 3 and the plating carrier 4 are from top to bottom installed In in the accommodating groove seat 23, which is engaged in by the gear segment 31 of the interlock ring 3, lock the plating carrier 4, because of the limit The relationship of position slot 231, which is only capable of one special angle of rotation, but also the operating bar 6 being engaged with can not be detached from.

As shown in fig. 6,6 system of operating bar is drawn out a short distance when unused, i.e., the conducting block 65 is detached from the groove 221.One wafer B can be placed in 4 top surface of plating carrier by operator, by the alignment of position line 54 and the plate body 21 of the upper cover 5 On reference line 211, which from top to bottom covers the plating carrier 4, is located at the positioning groove 51 using the locating piece 41 It is interior, make the upper cover 5 can not be by turn.The operating bar 6 is pushed into the plate body 21 at this time, which is engaged in the rack gear 61 Section 31, which starts turning, and is in contact with the inclined-plane of the lower fixture block 32 with upper fixture block 53 and generates packing effect, utilizes The interlock ring 3 locks the upper cover 5, and then wafer B is fixed wherein.Otherwise it is intended to remove wafer B, must first touch the latch 222 (back side direction on the left of such as Fig. 6) releases clip state, then the operating bar 6 is pulled open, and opens the upper cover 5, can remove the crystalline substance Circle B.It in addition is to be respectively provided with one group of wafer clamp structure in 2 two sides of carrier in this embodiment, the operating bar 6 in left side controls left side The structure in face, and right side operating bar 6 just controls the structure at the back side in drawing.

In summary, the wafer jig for electroplating device of the invention, has following several Xiang Youdian:

1. having no existing inner cover structure in this structure, the auxiliary of automatic machinery can be utilized, reaches automation and takes, puts crystalline substance Round movement；

2. rotating a fixed angle every time with the interlock ring, achieve the purpose that be tightened in upper cover, can maintain to exert a force every time Consistency, avoid occurring as it is existing because exert a force it is excessive caused by wafer damage the shortcomings that；

3. having spring in the operating bar, maintenance is compeled next also with an appropriate tightness, it is ensured that the upper cover clamps wafer Sealing and anti-leakage, avoid plating when electroplate liquid penetrate into internal structure in；

4. the operating bar, interlock ring and fixed ring can all be manufactured by metal material, and be transmitted to wafer as external power The medium at place, thus in structure in have no and existing must have complicated electric wire configuration.

As described above is only to be not intended to do any shape to the present invention accordingly to explain presently preferred embodiments of the present invention Limitation in formula, therefore, it is all have make any modification or change for the present invention under identical spirit, should all wrap It includes the invention is intended to the scopes of protection.

Claims

1. a kind of wafer jig for electroplating device, including a carrier, at least an interlock ring, at least one plating carrier, at least One upper cover and at least an operating bar, the carrier fixed plating carrier and be installed with can in a manner of concentric at one side wall The interlock ring being rotated, which, which is limited, is only capable of one angle of rotation, which has multiple The regional area of locating piece, the interlock ring outer circumferential walls root edge has a gear segment, and outer wall apical margin then has multiple lower fixture blocks, The upper cover is annular cover, and ring inner wall apical margin is dispersed with multiple positioning grooves, and wall inner wall root edge is then equipped with a fixed ring, this is fixed There are multiple upper fixture blocks, the operating bar is longitudinally mounted in the carrier, and partial section has a rack gear, which can be in ring The gear segment is meshed.

2. being used for the wafer jig of electroplating device as described in claim 1, wherein the interlock ring is installed on plating carrier circle All peripheries, and size is less than the plating carrier apical margin size, the plating carrier are fixed motionless, which is only capable of rotation but nothing Method is detached from the plating carrier.

3. being used for the wafer jig of electroplating device as described in claim 1, wherein the carrier is by a plate body and support portion institute It constitutes, forms T font structure body wide at the top and narrow at the bottom, which is the plate body side, which is recessed an accommodation seat, should Plating carrier and the interlock ring are installed on the accommodating groove seat, separately have the deeper limiting slot of depth, the company in the accommodating groove seat The gear segment of rotating ring is then located in the limiting slot, and the limiting slot is arc-shaped, and limit the interlock ring, to be only capable of rotation one predetermined Angle.

4. being used for the wafer jig of electroplating device as claimed in claim 3, wherein the plate body is longitudinal separately has an accommodating space, Accommodating space part is simultaneously connected with the accommodating groove seat, which is installed in the accommodating space, and the rack gear is in the accommodating Space is meshed with the accommodating groove seat place of communicating with the gear area of the interlock ring.

5. the wafer jig of electroplating device as claimed in claim 3 is wherein additionally provided with a conducting block at the top of the operating bar, the branch Support part corresponding section has a groove, which is arranged in the groove wherein.

6. the wafer jig of electroplating device as claimed in claim 3, wherein the operating bar, the interlock ring and the fixed ring are all Metal material, can be as the medium of power transmission.

7. the wafer jig of electroplating device as described in claim 1, wherein the mesh section of the operating bar separately includes an activity Pipe, a spring and an adjustment part, the adjustable pipe can make linear reciprocating movement, which is located at the adjustable pipe side wall, the spring It is restricted between the adjustable pipe and the adjustment part, which can change the distance between the adjustable pipe through rotation, in turn Adjust the tightness of the spring.