201211320 六、發明說明： 【發明所屬之技術領域】 有關於—種垂直懸臂式電鍍夾具，_是—種適 用於垂直式電麟備，魏轉速度及方向，稀於 ,錢種類1與傳統紐設備連結之垂直懸臂式可旋轉電“ 具。 【先前技術】 在水平電錄設備發展中’主要以Novellus Systems、 Sermtool、應用材料等三家電鍍設備廠商為主，國内大多數半 導體電鍍設備廠商亦採用此方式進行電鍍設備製造，其設計為 陽極固定平放於下方，而陰極可旋轉之設計平行於陽極，鍍液 由下方往上方流動而平行於電場電力線之方向，其優點為：陰 極夾具能進行旋轉，增加鍍液之擾動，可增加電鍍沉積之均勻 度；電鍍夾治具自動化機構容易設計；利用旋轉破壞陰極物件 表面之電雙層效應，使金屬離子容易進入陰極。主要缺點為： 由於流體流動與電場之電力線呈同—方向，趙流動容易造成 ，力線混亂，而破壞電鍍沉積之均勻度，使電鍍之微結構產生 沉積變形；由於流體流動方向直接衝擊微結構，造成陰極物件 中間與周圍之沉積速率產生差異，而形成較差之_共平面； 由於鍍液直接衝擊微結構，而使氣泡被帶入微結構深孔中形成 包覆空孔，陰極物件與陽極物件只能形成一對一沉積。水平電 鍍設備之電鍍夾治具不適用於垂直電鍍。 先進技術使用垂直電鍍之電鍍槽體設計，如Nexx Systems 之Stratus System。其設計為陽極垂直於槽體之一方，而陰極垂 直於槽體之另一方。垂直電鍍之設計優點為：流體流動與電場 之電力線呈重直方向，流體流動不會造成電力線混亂，可增加 ，鍍沉積之均勻度與共平面；電鍍夾治具自動化機構容易設 計；陰極物件與陽極物件能形成一對二沉積，減少電鍍設備之 201211320 ，具有旋轉功能，沉積 方式減少，·陰極物件層效應無法藉域拌等 轉與鍍液接觸磨擦而去除。姑^所產生之軋泡無法藉由陰極旋 表面所形成之電雙層效應与塑H=stems為改善陰極物件 下來回快速擺動之陰極以物件前面放置可上、 降低陰極電雙層效應影響 之舰擾動’而 極物件因電鍍所產生之洛治^—ϊ鍍〉儿積之均勻度仍然不佳；陰 效率仍不夠。 Ί⑽存留於填孔中科能填滿；陽極 ίί;此?2轉二能一之稀垂^ 懸臂式電鍍夾具。 袪出種此解決以上缺點之垂直 【發明内容】 圓旋=陰欠極 本發明之另-目的在接供料士日目^徽，儿積之均勻度。 極物件因紐啦㈣式植纽，使陰 而去除。 炙轧/包此错由陰極旋轉與鍍液接觸磨擦 械弋ίί:ΐΐ:=在提供一種垂直懸臂式電鍍夾具，以機 找式同y上盍上鎖機構，降低薄化晶圓於電鍍製程中之破片。 電導iigii 鍍夾具，具有 疮，μμλ制ή _之各導通點具有良好之導通程 度，以心加衣耘之良率與減少製程之不確定性。 為達成上述目的及其他目的，本發明之 垂直懸臂式電鍍爽具，固定架可由輸送工具運送至不同之槽， 201211320 並垂直懸掛於電鍍槽進行電猶業。馬達及 ’晶圓之旋轉速度為每分鐘0至⑼ 觸牛因電鍍所產生之氣泡能藉由陰 液接觸磨擦而去除。包括：—個狀架， S具ΐίί不同之槽具進行電鍍作業;-組‘為^ 由變二”架之上方；—組傳動I置，連接於該馬達，201211320 VI. Description of the invention: [Technical field of invention] For a vertical cantilever type plating fixture, _ is a type suitable for vertical electric lining, Wei turn speed and direction, rare, money type 1 and traditional New Zealand Vertical cantilever type rotatable electric device with equipment connection. [Prior Art] In the development of horizontal electric recording equipment, it mainly consists of three electroplating equipment manufacturers, such as Novellus Systems, Sermtool and Applied Materials. Most domestic semiconductor electroplating equipment manufacturers also In this way, the electroplating equipment is manufactured, and the anode is fixedly laid flat below, and the cathode rotatable design is parallel to the anode, and the plating liquid flows from below to above and parallel to the direction of the electric field power line, and the advantage is that the cathode fixture can Rotating, increasing the disturbance of the plating solution can increase the uniformity of electroplating deposition; the electroplating fixture automation mechanism is easy to design; the electric double layer effect on the surface of the cathode object is destroyed by rotation, so that metal ions can easily enter the cathode. The main disadvantages are: The fluid flow is in the same direction as the electric field of the electric field, and the Zhao flow is easy to cause, the force line Chaos, and the uniformity of electroplating deposition is destroyed, causing deposition deformation of the electroplated microstructure; due to the direct impact of the fluid flow direction on the microstructure, the deposition rate between the middle and the periphery of the cathode object is different, and a poor _ coplanar is formed; The liquid directly impacts the microstructure, so that the bubbles are carried into the deep holes of the microstructure to form the coated pores, and the cathode object and the anode object can only form one-to-one deposition. The plating fixture of the horizontal plating equipment is not suitable for vertical plating. The technology uses a vertically plated plating tank design, such as the Stratus System from Nexx Systems, which is designed with the anode perpendicular to one side of the tank and the cathode perpendicular to the other side of the tank. The design advantages of vertical plating are: fluid flow and electric field The power line is in a straight direction, the fluid flow will not cause the power line to be chaotic, and the uniformity and coplanarity of the plating deposition can be increased; the electroplating fixture automation mechanism is easy to design; the cathode object and the anode object can form a pair of two deposition, reducing the plating equipment 201211320, with rotating function, reduced deposition method, · cathode object layer effect It cannot be removed by contact with the plating bath and the friction between the plating solution. The electric foam generated by the cathode can not be formed by the electric double layer effect formed by the surface of the cathode and the plastic H=stems is used to improve the cathode of the cathode object. The ship's disturbance can be placed in front of the object to reduce the influence of the cathode electric double layer effect. The uniformity of the Luozhi^-ϊ plating of the pole object due to electroplating is still poor; the yin efficiency is still not enough. Ί(10) remains in the fill The hole can be filled; the anode ίί; this? 2 turns two can be one of the thin ^ cantilever type plating fixture. 袪 种 种 种 种 种 种 垂直 垂直 垂直 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 The purpose is to receive the uniformity of the material, the emblem, and the uniformity of the child. The pole object is removed by the New Zealand (four) type of planting, which is removed by the cathode. The rolling/packing error is caused by the rotation of the cathode and the contact of the plating solution. Ϊ́ΐ:= Providing a vertical cantilever type plating fixture to reduce the thinning of the wafer during the electroplating process. Conductive iigii plating fixtures with sores, μμλ ή _ each of the conduction points has a good degree of conduction, to improve the yield of the enamel and reduce the uncertainty of the process. In order to achieve the above and other objects, the vertical cantilever type plating device of the present invention can be transported to different slots by a transport tool, 201211320 and vertically suspended in a plating tank for electricity. The rotation speed of the motor and the wafer is 0 to (9) per minute. The bubbles generated by the electroplating can be removed by contact with the liquid by friction. Including: - a frame, S with ΐ ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί
勸輪使晶圓旋轉，傳練置亦可I 曰Ϊ，’上ίί核ί ’以晶圓座放置晶圓，晶圓導柱導引 ΓΞ卜ϋ柱導上盍盤模組’扣爪模組之扣爪機械式同步 上鎖上盍盤模組，每一扣爪電連接至電導通測量裝置。 【實施方式】 〜4 之以上及其他目的及優點參考以下之參照圖示及 取佳貫施例之說明而更易完全瞭解。 ϋ圖係顯示依據本發明較佳實施例之垂 直，#式電鍍夾具之透視圖。垂直懸臂式電鍍夾具100由一 十字形之固定架102支持，以便由輸送工具運送至不同之 進仃電鍍作業。晶圓固定模、组1〇9用以夾持晶圓114，晶圓& 由扣爪112固定在扣爪模組110上。馬達1〇4為旋轉之動力， ，於該固定架之上方’帶動傳動裝置，本實施例由變速齒輪 05。驅動惰輪1〇6使晶圓114旋轉，傳動裝置亦可為傳動帶。 晶圓旋轉具攪拌功能，並降低陰極物件表面所形成之電雙層效 應影響，降低陰極表面電雙層效應，以增加電鍍沉積之均勻 度，同時使陰極物件因電鍍所產生之氣泡能藉由陰極旋轉盘鍍 液接觸磨擦而去除。上蓋盤模組丨丨6為固定晶圓之装置/由< 爪112固定，電連接至電導通測量線盒1〇8。第2圖係顯示依 ，本發明較佳實施例將馬達及變速齒輪置入馬達箱之垂直懸 ，式電鍍夾具之透視圖。馬達箱107固定於固定架1〇2上以& 護馬達104及減速輪132。第3圖係顯示依據本發明較佳實施 201211320 歹之垂直懸臂，鍍夾具之分解圖。由下至上為扣 110 ’有八個扣爪112，中間為電線蓋128，將每一扣爪連接至 ，轉料極3’、再連接至電導通測量線盒⑽（見第i ^)， ，至電導通度1裝置（未圖示），以量測確保晶圓上之各導 通點具有良好之導通程度’明加製程之良料 。惰輪;0=固定架102之轴上，驅動被動輪m $The wheel is rotated by the wheel, and the transfer can be set to I 曰Ϊ, 'Up ίίίί ' to place the wafer in the wafer holder, and the wafer guide column guides the ϋ ϋ 导 导 ' ' ' ' ' The group of claws mechanically synchronously locks the upper disc module, and each of the claws is electrically connected to the electrical conduction measuring device. [Embodiment] The above and other objects and advantages of the present invention are more fully understood from the following description of the drawings and the description of the preferred embodiments. The figure shows a perspective view of a vertical, #-type plating fixture in accordance with a preferred embodiment of the present invention. The vertical cantilever plating jig 100 is supported by a cruciform holder 102 for transport by the transport tool to different advance plating operations. The wafer fixed mold, the group 1〇9 is used to hold the wafer 114, and the wafer & is fixed by the claw 112 to the claw module 110. The motor 1〇4 is a rotating power that drives the transmission above the holder. This embodiment is composed of a shifting gear 05. The idler pulley 1〇6 is driven to rotate the wafer 114, and the transmission can also be a belt. The wafer rotation has a stirring function, and reduces the influence of the electric double layer effect formed on the surface of the cathode object, and reduces the electric double layer effect on the cathode surface to increase the uniformity of the plating deposition, and at the same time, the bubble generated by the plating of the cathode object can be The cathode rotating disk plating solution is removed by contact with friction. The upper cover disk module 6 is a device for fixing the wafer/fixed by the <claw 112, and is electrically connected to the electrical conduction measuring wire box 1〇8. Fig. 2 is a perspective view showing a vertical suspension type electroplating jig in which a motor and a shifting gear are placed in a motor case according to a preferred embodiment of the present invention. The motor case 107 is fixed to the holder 1〇2 to protect the motor 104 and the reduction wheel 132. Figure 3 is an exploded view of a vertical cantilever, plating fixture according to a preferred embodiment of the present invention 201211320. From bottom to top, the buckle 110' has eight claws 112 with a wire cover 128 in the middle, and each of the claws is connected to the transfer pole 3' and then connected to the electrical conductivity measuring box (10) (see i ^ ). , to the conductivity 1 device (not shown), to ensure that the conduction points on the wafer have a good degree of conduction 'good process'. Idler wheel; 0 = on the shaft of the fixed frame 102, driving the passive wheel m $
電極122，連接導通電流用，上蓋雜12〇用以導引上m 晶圓導柱119用以導引晶圓，上蓋盤模組He上有追 =117 ’以機^式同步以均句之力量上鎖上蓋盤模組 =晶圓於賴製程中之破片。右邊為馬達箱而、馬達1〇4: 減速輪132，傳動齒輪130以驅動惰輪1〇6。 以上較佳之具體實施例之詳述，係敎能更加清楚描 特2精神，而並非以上述所揭露的較佳具體實例 十’土明之靶今加以限制。相反的，其目的是希望能涵蓋各 種改變及具相等性的安排於本發明所欲巾請之專利射内。 【圖式簡單說明】 第1、圖係顯7F依據本發明較佳實施例之垂錢臂式電鑛央具 之透視圖。 第、f圖係顯示雜本發明触實施麟馬達及變速齒輪置入 馬達箱之垂直懸臂式電鍍夾具之透視圖。 第3圖係顯示依據本發_佳實關之垂賴臂式電鑛夹具 之分解圖。 【主要元件符號說明】 102固定架 106驅動惰輪 108電導通測量線盒 110扣爪模組 100垂直懸臂式電鍍夹具 104馬達 八 107 馬達箱 109晶固固定模組 201211320 112 扣爪 114 116 上蓋盤模組 117 118 晶圓座 119 120 上盡導柱 122 124 被動輪 126 128 132 電線蓋 減速輪 130 晶圓 迫緊塊 晶圓導柱 下導電極 旋轉導電極 傳動齒輪The electrode 122 is connected to the conduction current, and the upper cover 12 is used for guiding the m wafer guide pillar 119 for guiding the wafer, and the upper cover disk module He has a tracking 117 'synchronized by the machine type Power on the cover plate module = the fragment of the wafer in the process. On the right is the motor box, the motor 1〇4: the reduction wheel 132, and the transmission gear 130 to drive the idler gear 1〇6. The details of the preferred embodiments above are more clearly understood, and are not intended to limit the scope of the preferred embodiments disclosed herein. On the contrary, the purpose is to accommodate various changes and equal arrangements in the patent shots of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1, Fig. 7F is a perspective view of a dip arm type electric ore apparatus according to a preferred embodiment of the present invention. The first and f-pictures show a perspective view of a vertical cantilever type plating jig in which the present invention is applied to a motor and a shifting gear placed in a motor case. Fig. 3 is an exploded view showing the armature type electric mine fixture according to the present invention. [Main component symbol description] 102 holder 106 drive idler 108 electrical conduction measurement line box 110 claw module 100 vertical cantilever type plating fixture 104 motor eight 107 motor box 109 crystal solid fixed module 201211320 112 claw 114 116 upper cover plate Module 117 118 wafer holder 119 120 up guide post 122 124 passive wheel 126 128 132 wire cover reduction wheel 130 wafer pressing block wafer guide post lower electrode rotating guide electrode transmission gear