JP5981534B2 - Substrate plating jig and plating apparatus using the same - Google Patents

Description

  The present invention provides a plating jig and a plating apparatus used for substrate plating processing, in particular, forming a plating film in a fine wiring groove or hole provided on a surface to be plated such as a semiconductor wafer, or a resist opening. The present invention relates to a plating jig for forming bumps (protruding electrodes) for electrically connecting a semiconductor chip and a substrate on a surface to be plated of a semiconductor wafer, and a plating apparatus using the same.

  In general, the electrolytic plating method is a jet type or cup type in which the surface to be plated of a substrate such as a semiconductor wafer is placed face down and the plating solution is sprayed from below to perform plating, and in a plating tank. The substrate is roughly divided into a dip type in which the substrate is vertically immersed, the plating solution is poured from the bottom of the plating tank, and overflows while the substrate is immersed in the plating solution. Among these, the plating is performed with the substrate standing vertically in the dip-type electrolytic plating method in order to facilitate the removal of bubbles generated on the surface of the substrate to be plated and the surface of the substrate to be plated This is to prevent particles or the like from adhering to the top. Thus, according to the electrolytic plating method in which plating is performed with the substrate standing vertically, bubbles due to a violent reduction reaction when performing high-speed plating can be easily removed, which is suitable for high-speed plating.

  By the way, in the electroplating apparatus adopting the conventional dip method, a substrate holder for holding a substrate such as a semiconductor wafer in a detachable manner by sealing the outer peripheral end surface and the back surface and exposing the surface (surface to be plated). The substrate holder is dipped in the plating solution together with the substrate to plate the surface to be plated of the substrate.

  However, in the electroplating method employing such a conventional dip method, the substrate is immersed in the plating solution in the plating tank while standing vertically, and the plating solution is directed upward from the bottom of the plating tank. Therefore, the injected plating solution is always supplied from the lower part to the upper part of the surface to be plated of the substrate, and unevenness in the flow rate of the plating solution occurs between the upper and lower parts of the substrate to be plated. There is a problem that a subtle difference in the film thickness of the plating occurs depending on the location of the surface to be plated of the substrate. In addition, uneven current density has also caused uneven plating.

  Therefore, in order to solve such problems, the substrate holder such as a semiconductor wafer is rotated in the plating tank by the driving means to eliminate the unevenness of the flow rate of the plating solution and the unevenness of the current density, thereby increasing the uniformity of the plating film thickness. Patent Documents 1 and 2 disclose a plating method and a plating apparatus capable of performing the above.

  However, in the case where the shaft is connected to the substrate holder in such a manner as to penetrate the plating tank side wall from the driving means provided outside the plating tank as in Patent Document 1, the sealing process of the through portion becomes a problem. Therefore, the method disclosed in Patent Document 1 is configured so that the penetrating part is not subjected to a sealing process, the shaft and the plating tank side wall are not in contact with each other, and the plating solution flows out between them. Improvement of the plating tank was necessary. In addition, in Patent Document 2, since the drive shaft is provided at a predetermined angle, it does not penetrate the side wall of the plating tank, but is provided at a predetermined angle so that the anode plate faces the object to be plated. Also, the plating tank itself must be improved, such as forming the bottom of the plating tank along the angle of the shaft.

JP2004-300462 JP 2002-327291 A

  Therefore, the present invention overcomes the above disadvantages of the conventional plating apparatus, has a substrate holder rotation drive means, and can easily attach and detach to the plating tank without any modification to the plating tank. The object is to provide a plating apparatus to be used.

  The present invention solves the above-described problem, and includes a support portion formed so as to be hookable on the side wall of the plating tank, and a substrate holder provided on the support portion so as to be vertically rotatable. A plating jig comprising a rotating means.

  In the present invention, the plating jig is attached to the side wall of the plating tank, and a paddle that reciprocates in the lateral direction is provided between the substrate holder and the anode plate provided to face the substrate holder. The plating apparatus is characterized by the above.

  According to the plating jig of the present invention, it can be easily attached to the plating apparatus simply by hooking on the side wall of the plating tank, and the plating solution flow is used as the rotation drive means of the substrate holder, or the power of the drive unit Is transmitted to the substrate holder via a rotating shaft or a gear member, and any of them does not require improvement of the plating tank.

  In addition, a plating apparatus equipped with the plating jig of the present invention, in which a paddle for stirring is provided between the substrate holder and the anode plate, the substrate is covered by the stirring of the paddle in addition to the rotation of the jig. Since the plating solution flow along the plating surface can be made uniform, a plating film having a more uniform film thickness can be formed.

  Furthermore, the plating apparatus equipped with the plating jig of the present invention, which has a plating solution outlet at the bottom of the plating tank below the substrate holder, provides a difference in the strength of the plating solution flow on the left and right of the substrate holder. Thus, the rotational force can be generated more efficiently.

The disassembled perspective view of the plating jig of this invention. The schematic block diagram of the plating apparatus which attached the plating jig | tool of this invention. (A) The side view of the outer frame member of the plating jig of this invention. (B) The front view of the outer frame member of the plating jig of this invention. (A) The side view of the outer frame member of the plating jig of this invention. (B) The front view of the outer frame member of the plating jig of this invention. (A) The side view of the outer frame member of the plating jig of this invention. (B) The front view of the outer frame member of the plating jig of this invention. (A) The figure which shows the aspect from which the wing | blade part of the outer frame member of the plating jig | tool of this invention differs. (B) The figure which shows the aspect from which the wing | blade part of the outer frame member of the plating jig | tool of this invention differs. The schematic block diagram of the plating apparatus which attached the plating jig | tool of this invention. The schematic block diagram of the plating apparatus which attached the plating jig | tool of this invention. The metal-plating jig | tool of this invention is a partial expanded sectional view of a substrate holder.

  Hereinafter, embodiments of a plating jig and a plating apparatus using the same according to the present invention will be specifically described with reference to the drawings. Note that the present invention is not limited to these embodiments.

  FIG. 1 is an exploded perspective view of a plating jig of the present invention, and FIG. 2 is a schematic configuration diagram of a plating apparatus to which the plating jig of the present invention is attached. In the figure, 1 is a plating apparatus, 2 is a plating jig, 10 is a plating tank, 11 is a side wall, 12 is a spout, 20 is an overflow tank, 30 is a substrate holder, 31 is a holding member, 32 is a sealing member, 33 Is an outer frame member, 34 is a shaft portion, 35 is a fixing bolt, 36 is a fixing bolt, 37 is a fixing bolt, 40 is a support portion, 41 is a hole portion, 50 is an anode plate, 60 is a paddle, 70 is a power source, and 71 is Energization path, 80 is piping, 81 is pump, 82 is filter, 311 is base, 312 is substrate mounting surface, 313 is a hole, 314 is a first energizing member, 321 is an opening, 331 is a connection, 332 is a wing And W denote substrates.

  As shown in the figure, the plating jig 2 of the present invention includes a support portion 40 formed so as to be hookable on the side wall of the plating tank, and a substrate holder 30 provided rotatably on the support portion 40. Details of each part will be described with reference to FIG. The support part 40 is a columnar member having an upper part formed in a bowl shape so that it can be hooked on the upper end of the side wall of the plating tank, and a hole part 41 into which the shaft part 34 can be inserted penetrates the lower part. Has been. The disc-shaped substrate holder 30 is held in the hole 41 via the shaft portion 34 so as to be rotatable in the vertical direction.

  The substrate holder 30 includes a holding member 31, a seal member 32, an outer frame member 33, a shaft portion 34, and fixing bolts 35, 36, and 37. Among these, the holding member 31 has a substrate mounting surface 312 having a diameter smaller than that of the base portion 311 protruding from the upper surface of the base portion 311 formed in a disc shape. The substrate mounting surface 312 is formed in substantially the same shape and size as the substrate W to be plated. A plurality of first current-carrying members 314 are provided on the base 311 around the substrate mounting surface 312. Further, a hole portion 313 through which the shaft portion 34 can be inserted is formed in the center of the substrate mounting surface 312.

  The seal member 32 is formed in an annular shape having substantially the same diameter as the holding member 31, and the opening 321 is formed with an inner diameter slightly smaller than the outer diameter of the substrate W. An annular seal packing 322 and a second energizing member 323 are provided on the surface facing the holding member 31 (not shown in FIG. 1), and the substrate W is held together with the holding member 31 when the substrate holder 30 is assembled. The first energization member 314 on the base 311 is sealed and energized to the substrate W.

  The outer frame member 33 is composed of two left and right members formed in a semi-annular shape. The outer frame member 33 has a substantially U-shaped cross section, and is fitted to the outer peripheral edges of the holding member 31 and the seal member 32 when the substrate holder 30 is assembled. Specifically, two outer frame members 33 are attached to the outer peripheral edges of the holding member 31 and the seal member 32 from the left and right sides, and are coupled and fixed by bolts or the like at the upper and lower connecting portions 331. In FIG. 1, a plurality of wings 332 project from the outer peripheral surface of the outer frame member 33. However, as will be described later, when using other rotating means, the wings 332 are not essential. .

  The substrate holder 30 is attached to the support portion 40 by inserting a shaft portion 34 having a screw portion into the hole portion 313 of the holding member 31 and the hole portion 41 of the support portion 40, and fixing bolts 35, 36, and 37 are respectively connected to the shaft portion. The screw part 34 is screwed and fixed. At this time, it is desirable that the fixing bolt 36 exposed in the plating solution is coated and sealed after fixing. The fixing bolt 37 is also exposed in the plating solution. However, as shown in FIG. 1, a recess having a depth sufficient to embed the fixing bolt 37 is provided on the back surface of the support portion 40, and the opening is masked with a vinyl chloride plate or tape. It is desirable to do. In addition, it is desirable that a part of the shaft portion 34 exposed in the plating solution is coated with Teflon (registered trademark) or an epoxy resin.

  Furthermore, the different attachment methods to the support part 40 of the substrate holder 30 are as follows. First, the support portion 40 is formed so as to be divided into two parts on the left and right sides from the front, and a concave portion in which the shaft portion 34 and the fixing bolt 37 can be embedded is provided therein. Then, the shaft portion 34 to which the fixing bolt 37 is attached in advance is disposed in the concave portion of the left or right member of the divided support portion 40, and the member of the other support portion 40 is fixed together, thereby fixing the substrate holder 30. Is attached to the support portion 40. According to such an attachment method, the entire length of the shaft portion 34 can be further shortened, and it is not necessary to seal the opening on the back side of the support portion 40 as described above.

  Next, a method for energizing the substrate W will be described. An energization path 71 embedded in the support portion 40 from the external power supply 70 or drawn from the back surface is energized to the shaft portion 34 via a power supply brush (not shown) or the like. The shaft portion 34 is made of a conductive material such as titanium material, phosphor bronze material, or pure copper material, and is energized to a fixing bolt 35 that is also formed of the conductive material. The first energization member 314 is energized from the fixing bolts 35 and 36 that fix the holding member 31 through an energization path (not shown) embedded in the holding member 31.

  FIG. 9 is a partially enlarged view showing a state of energization in a state where the substrate holder 30 is assembled with the substrate W held therebetween. As shown in the drawing, an annular seal packing 322 and a second energizing member 323 are provided on the surface of the seal member 32 facing the holding member 31. The seal packing 322 is formed in a substantially U shape with a cross-sectional shape having different upper and lower side lengths, the second energizing member 323 is formed in a flat disk shape, and a plurality of protruding contacts 324 project on the inner peripheral edge thereof. It is installed. When the substrate holder 30 is assembled, the flat plate portion of the second energizing member 323 is in contact with the first energizing member 314 on the base 311 and the protruding contact 324 is in contact with the surface to be plated of the substrate W. Thereby, the substrate W can be energized from the first energization member 314 via the second energization member 323. The above energization method is preferable because the first energization member 314 and the second energization member 323 can be reliably energized to the substrate W without being exposed to the plating solution by the seal packing 322. The method of energizing the plating jig is not limited to this.

  Next, the rotation means of the substrate holder 30 will be described. As the rotating means of the substrate holder 30 in the plating jig 2 of the present invention, a method of using a plating solution flow by providing a blade or a recess on the outer peripheral surface of the outer frame member and a method of rotating by a driving unit are adopted. Can do. 3A and 3B are views in which a wing portion 332 projects from the outer peripheral surface of the outer frame member 33. FIG. As shown in the figure, the present embodiment is provided with wing portions 332 formed in a plurality of rectangular plates on the outer peripheral surface of the outer frame member 33 at equal intervals. The wing portion 332 protrudes so as to rise substantially vertically from the outer peripheral surface, and is provided so that the wing is horizontal in a side view. As described above, the outer frame member 33 provided with the wings generates a rotational force when the plating solution flow collides with the wings 332, whereby the substrate holder 30 can be rotated.

  4 (a) and 4 (b) show the wings 333 having different modes. As shown in the figure, the wing part 333 protrudes so as to rise substantially perpendicularly to the outer peripheral surface of the outer frame member 33, but is provided with an angle so that the wing is not horizontal but tilts downward from the front to the rear. It has been. Thus, the angle of the wing portion 333 makes it possible to capture the plating solution flow from the front more effectively. Moreover, as shown in FIGS. 6A and 6B, a wing portion formed in a substantially U shape or a substantially V shape instead of a rectangular plate shape makes it easier to catch the plating solution flow. it can.

  5A and 5B show a case where a concave portion 334 is provided on the outer peripheral surface of the outer frame member 33. FIG. As shown in the figure, in this embodiment, a plurality of rectangular recesses 334 are provided at equal intervals on the outer peripheral surface of the outer frame member 33. By providing the concave portion 334 on the outer peripheral surface in this manner, the concave portion captures the plating solution flow in the same manner as the wing portion and generates a rotational force, thereby enabling the substrate holder 30 to be rotated.

  FIG. 7 shows a first mode in which the substrate holder 30 is rotated by the drive unit. As shown in the figure, a rotational force is transmitted from a drive unit 90 such as an electric motor to a gear 93 attached to the shaft unit 34 via a shaft 91. The gear 34 converts the rotational force of the shaft 91 into rotation of the shaft portion 34 and transmits it. Thereby, the substrate holder 30 can be rotated. The drive unit 90 may be provided directly on the support unit 40, or may be detachable from the attachment unit 92, and a separate support unit may be provided outside the plating tank. Furthermore, the transmission of the rotational force from the drive unit 90 to the shaft unit 34 may be a combination of a plurality of gear members or a transmission using a belt, in addition to a combination of a shaft and a gear as in the present embodiment.

  FIG. 8 shows a second mode in which the substrate holder 30 is rotated by the drive unit. As shown in the figure, a gear portion 94 is provided on the upper portion of the substrate holder 30, and a gear 95 having the same pitch as the gear of the gear portion 94 is provided on the outer frame member of the substrate holder 30. And the gear part 94 to which the rotational force was transmitted from the drive part 90 transmits a rotational force to the gear 95 of an outer frame member, and it becomes possible to rotate the board | substrate holder 30 by this. Note that the transmission of the rotational force from the drive unit 90 to the gear unit 94 may be a combination of a shaft and a gear as in the first aspect, or may be a combination of a plurality of gear members or transmission by a belt.

  Note that the rotating means of the substrate holder 30 is limited to either a method of using a plating solution flow by providing wings or recesses on the outer peripheral surface of the outer frame member 33 and a method of rotating by a driving unit. Not a thing but the thing which combined them mutually may be used. That is, a wing part or a recessed part may be provided on the outer peripheral surface of the outer frame member 33, and a rotational force may be applied by an external driving part. As described above, the rotation can be further stabilized and the power consumption can be suppressed by the two different types of rotational forces.

  Next, a plating apparatus using the plating jig 2 of the present invention will be described. FIG. 2 is a schematic configuration diagram of the plating apparatus 1 to which the plating jig 2 of the present invention is attached. As shown in the figure, the plating apparatus 1 of the present invention includes a plating tank 10 and an overflow tank 20 provided on the outer periphery of the plating tank 10, and a plating jig 2 is attached to a side wall 11 of the plating tank 10. In the plating tank 10, an anode plate 50 is provided at a position facing the surface to be plated of the substrate W held by the substrate holder 30. Further, a paddle 60 may be installed between the anode plate 50 and the substrate holder 30 as in this embodiment. Since this paddle 60 reciprocates in parallel with the surface of the substrate W to be plated, the plating solution flow along the surface of the substrate to be plated can be made uniform. 30 is preferable because it can form a plating film having a more uniform film thickness.

  In addition, a spout 12 connected to a pipe 80 is provided at the bottom of the plating tank 10, and a plating solution is supplied from the spout 12 into the plating tank 10. 1 and FIG. 3 to FIG. 6, when using a jig that uses a plating solution flow by providing wings or recesses on the outer circumferential surface of the outer frame member, the spout 12 is connected to the plating solution flow. Is preferably provided at a position effective to transmit the rotational force to the wing or recess of the outer frame member 33. Specifically, it is preferably disposed below the substrate holder 30 and in a direction parallel to the substrate holder 30. At this time, by making the jet port 12 one on one side so that the strength of the plating solution flow is different on the left and right of the substrate holder 30, or by providing a difference in the amount of jet from the jet port 12 on the left and right, it is more efficient. Since a rotational force can be generated, it is preferable.

DESCRIPTION OF SYMBOLS 1 ...... Plating apparatus 2 ...... Plating jig 10 ...... Plating tank 11 ...... Side wall 12 ...... Outlet 20 ...... Overflow tank 30 ...... Substrate holder 31 ...... Holding member 32 ...... Seal member 33 ...... Outside Frame member 34 ... Shaft part 35 ... Fixing bolt 36 ... Fixing bolt 37 ... Fixing bolt 40 ... Support part 41 ... ... Hole 50 ... ... Anode plate 60 ... ... Paddle 70 ... ... Power supply 71 ... ... Current path 80 ... ... Piping 81 ... ... Pump 82 ... ... Filter 90 ... ... Drive part 91 ... ... Shaft 92 ... ... Mounting part 93 ... ... Gear 94 ... ... Gear part 95 ... ... Outer frame member 311 ... ... Base part 312 ... ... Board mounting Surface 313 ... ... Hole 314 ... ... First energizing member 321 ... ... Opening 322 ... ... Seal packing 323 ... ... Second energizing member 24 ... protruding contacts 331 ... ... connecting portion 332 ... ... wing 333 ... ... wing 334 ... ... recess W ... ... substrate

Claims (9)

  It consists of a support part detachably attached to the side wall of the plating tank and a substrate holder that is vertically held by the support part, and is rotated by the rotating means of the substrate holder that uses the plating solution flow or by a drive part. A plating jig comprising: a rotating means for rotating the substrate holder; or a rotating means for rotating the substrate holder obtained by combining the rotating means.   The substrate holder includes a holding member having a substrate mounting surface, an annular seal member that sandwiches the substrate together with the holding member, an outer frame member that is fitted to the periphery of the holding member and the seal member, and the holding member The plating jig according to claim 1, comprising: a shaft portion inserted into a hole portion provided at the center of the plating. 3. The plating according to claim 1, wherein the rotating means of the substrate holder using a plating solution flow is a wing portion protruding from an outer peripheral surface of an outer frame member of the substrate holder. jig. 3. The plating treatment according to claim 1, wherein the rotating means of the substrate holder using a plating solution flow is a recess provided in an outer peripheral surface of an outer frame member of the substrate holder. Ingredients. Rotating means of the substrate holder is rotated by the drive unit, according to claim 1 or claim, characterized in that to transmit the rotational force through the rotation shaft of the drive unit which is attached to the support portion in the axial portion of the substrate holder Item 3. A plating jig according to any one of Items 2 to 3. Claims rotation means of said substrate holder is rotated by the drive unit, characterized in that for transmitting the rotational force from the drive unit which is attached to the support portion to the shaft portion or the outer frame member of said substrate holder via a gear member Claim | item 1 or the plating jig in any one of Claim 2. The rotation means of the substrate holder by combining the rotation means of the substrate holder using a plating solution flow and the rotation means of the substrate holder rotated by a driving unit is any one of claims 3 to 6. The plating jig according to claim 1, wherein a plurality of rotating means are combined. The plating jig according to claim 1 is attached to a side wall of the plating tank, and a surface of the substrate to be plated is disposed between the substrate holder and an anode plate provided facing the substrate holder. A plating apparatus comprising a paddle that reciprocally moves in parallel .   A plating apparatus according to claim 3 or 4, wherein a plating jig according to claim 3 or 4 is hooked on a side wall of the plating tank, and a plating solution outlet is provided at the bottom of the plating tank below the substrate holder.

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