CN111705355A - Vertical rotary electroplating jig for wafer and electroplating device - Google Patents
Vertical rotary electroplating jig for wafer and electroplating device Download PDFInfo
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- CN111705355A CN111705355A CN202010634650.7A CN202010634650A CN111705355A CN 111705355 A CN111705355 A CN 111705355A CN 202010634650 A CN202010634650 A CN 202010634650A CN 111705355 A CN111705355 A CN 111705355A
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- electroplating
- vertical rotary
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- plate body
- transmission
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a vertical rotary electroplating jig and an electroplating device for a wafer, wherein the electroplating jig comprises a first plate body, a second plate body, a rotating ring, a pressing plate and a transmission mechanism for driving the rotating ring to rotate, wherein the rotating ring is provided with an annular cathode electrode plate which is electrically connected with a power supply connector through a lead, the lead is wound on a wire coil, and the vertical rotary electroplating jig also comprises a resetting mechanism for promoting the wire coil to take up and rotate; the transmission mechanism comprises a first transmission tooth-shaped part and a first transmission gear, wherein the first transmission tooth-shaped part and the first transmission gear are arranged on the rotating ring. The electroplating jig is vertically arranged, so that the occupied area can be effectively reduced, and the utilization rate of a production field is improved. Through the gear drive mode, drive gear conveniently sets up between first plate body and second plate body, can not cause the stirring to the plating solution, and transmission precision is high, and the rotational speed and the reversal of just reversing of convenient accurate control swivel are with adjusting out best wafer cladding material thickness homogeneity.
Description
Technical Field
The invention relates to the technical field of wafer packaging wet processing, in particular to a vertical rotary electroplating jig for a wafer and an electroplating device.
Background
In the wafer packaging wet process, the electric field intensity of each position of the wafer is slightly different, so that the thickness of the plating layer has certain uniformity difference. In order to improve the uniformity of the thickness of the electroplated coating of the wafer, a rotary electroplating jig is provided, namely, the wafer continuously rotates in the electroplating process, and the method can effectively improve the uniformity of the electroplated coating. In order to enable the rotary driving mechanism to be positioned above the electroplating solution in the electroplating pool so as to prevent the rotary driving mechanism from being corroded by the electroplating solution or stirring the electroplating solution with larger fluctuation, the conventional rotary electroplating jig is generally horizontal, namely, a wafer is in a horizontal state during electroplating, but the horizontal electroplating jig occupies a large area and affects the production efficiency. Taiwan patent document with serial number TWI410531B describes a vertical electroplating apparatus and an electroplating method thereof, which can save floor space by using vertical electroplating, but the driving method thereof adopts electromagnetic actuation, which has two disadvantages: firstly, the adjustment and control of the rotating speed and the rotating angle are not accurate, and the adjustment to the optimal rotating speed is not facilitated; secondly, the electromagnetism can generate certain influence on the electric field of electroplating, and can generate negative effect on the thickness uniformity of the wafer coating.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a vertical rotary electroplating jig for a wafer and an electroplating device.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows: a vertical rotary electroplating jig for wafers comprises a first plate body, a second plate body, a rotating ring, a pressing plate and a transmission mechanism, wherein the first plate body, the second plate body, the rotating ring and the pressing plate are vertically arranged, the transmission mechanism drives the rotating ring to rotate, a power supply connector used for being connected with a power supply cathode is arranged on the first plate body or the second plate body, an annular cathode electrode plate is arranged on the rotating ring, the annular cathode electrode plate is electrically connected with the power supply connector through a wire, the vertical rotary electroplating jig also comprises a wire coil, the wire is wound on the wire coil, and the vertical rotary electroplating jig also comprises a; the transmission mechanism comprises a first transmission tooth-shaped part arranged on the rotating ring and a first transmission gear meshed with the first transmission tooth-shaped part.
Compared with the prior art, the electroplating jig is vertically arranged, so that the occupied area can be effectively reduced, and the utilization rate of a production field is improved. Through the gear drive mode, drive gear conveniently sets up between first plate body and second plate body, can not cause the stirring to the plating solution, and transmission precision is high, and the rotational speed and the reversal of just reversing of convenient accurate control swivel are with adjusting out best wafer cladding material thickness homogeneity. When electroplating, the lead is collected and released along with the rotating ring, thereby effectively avoiding poor conductivity caused by traditional elastic sheet type electric conduction and ensuring the current stability during rotary electroplating.
Furthermore, two ends of the lead are respectively and electrically connected with the annular cathode electrode plate and the power supply connector in a welding or screw fixing type connection mode.
Further, the outer periphery of the wire has an insulating layer.
Furthermore, an annular wire groove for regulating the wire is arranged on the rotating ring.
By adopting the preferable scheme, the electric connection reliability and the use stability of the lead are improved.
Further, the return mechanism is a rewind spring.
By adopting the preferable scheme, the structure is simple, the wire is kept in a tensioning state, and the wire is prevented from loosening.
Further, canceling release mechanical system includes the second drive gear with first drive gear engaged with, the wire casing side direction periphery of drum is equipped with second transmission profile of tooth portion, one-way bearing is installed to second drive gear inner circle, the torque limiter is installed to the inner circle of drum.
By adopting the preferable scheme, when the wire is paid off, the inner ring and the outer ring of the one-way bearing in the second transmission gear are in an asynchronous state, and the rotation of the driving mechanism cannot influence the paying off of the wire coil; when the rotary ring rotates reversely and the wires are taken up, the inner ring and the outer ring of the one-way bearing are in a synchronous state, the wire coil rotates along with the wire coil to take up the wires, the wires exceed the rotating torque of the torque limiter to idle when being tightened, and the stable tension force of the wires is kept.
Furthermore, a first sealing ring is arranged between one side face of the rotating ring and the first plate body, and a second sealing ring is arranged between the other side face of the rotating ring and the second plate body.
With the preferred scheme, the electroplating solution is prevented from invading into the cavity between the first plate body and the second plate body.
The utility model provides an electroplating device, includes electroplating bath, actuating mechanism and the vertical rotatory electroplating tool of foretell wafer, be provided with the positive pole electrode relative with the wafer in the electroplating bath, the power connector of the vertical rotatory electroplating tool of wafer is connected to the negative pole of power, be equipped with the driving tooth in actuating mechanism's the pivot, the vertical rotatory electroplating tool's of wafer first transmission gear with the meshing of driving tooth.
By adopting the preferable scheme, the electroplating jig is vertically arranged, so that the occupied area can be effectively reduced, and the utilization rate of a production field is improved. Through the gear drive mode, drive gear conveniently sets up between first plate body and second plate body, can not cause the stirring to the plating solution, and transmission precision is high, and the rotational speed and the reversal of just reversing of convenient accurate control swivel are with adjusting out best wafer cladding material thickness homogeneity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an electroplating jig according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a hidden first plate according to an embodiment of the electroplating jig of the present invention;
FIG. 3 is a schematic view of a hidden first plate and a hidden pressing plate according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an electroplating jig according to another embodiment of the present invention;
FIG. 5 is a schematic structural view of an electroplating apparatus according to an embodiment of the present invention.
Names of corresponding parts represented by numerals and letters in the drawings:
11-a first plate body; 12-a second plate body; 13-rotating; 131-a first drive tooth form; 14-a platen; 15-a first drive gear; 16-ring cathode electrode slice; 18-wire coil; 19-a plating tank; 20-a drive mechanism; 201-drive teeth; 21-power connection; 22-a second transmission gear; 23-a second transmission tooth form; 24-one-way bearings; 25-torque limiter.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3 and 5, one embodiment of the present invention is: a vertical rotary electroplating jig for wafers comprises a first plate body 11, a second plate body 12, a rotating ring 13, a pressing plate 14 and a transmission mechanism for driving the rotating ring 13 to rotate, wherein the first plate body 11 or the second plate body 12 is provided with a power supply connector 21 for connecting with a power supply cathode, the rotating ring 13 is provided with an annular cathode electrode plate 16, the annular cathode electrode plate 16 is electrically connected with the power supply connector 21 through a lead, the vertical rotary electroplating jig also comprises a wire coil 18, the lead is wound on the wire coil 18, and the vertical rotary electroplating jig also comprises a resetting mechanism for promoting the wire coil to take up and rotate; the transmission mechanism comprises a first transmission tooth-shaped part 131 arranged on the rotating ring and a first transmission gear 15 meshed with the first transmission tooth-shaped part 131.
The beneficial effect of adopting above-mentioned technical scheme is: the electroplating jig is vertically arranged, so that the occupied area can be effectively reduced, and the utilization rate of a production field is improved. Through the gear drive mode, drive gear conveniently sets up between first plate body and second plate body, can not cause the stirring to the plating solution, and transmission precision is high, and the rotational speed and the reversal of just reversing of convenient accurate control swivel are with adjusting out best wafer cladding material thickness homogeneity. When electroplating, the lead is collected and released along with the rotating ring, thereby effectively avoiding poor conductivity caused by traditional elastic sheet type electric conduction and ensuring the current stability during rotary electroplating.
In other embodiments of the present invention, the two ends of the conducting wire are electrically connected to the annular cathode electrode plate 16 and the power connector 21 by welding or screw fixing. The periphery of the lead is provided with an insulating layer. The rotary ring 13 is provided with an annular wire groove for regulating wires. The beneficial effect of adopting above-mentioned technical scheme is: the electric connection reliability and the use stability of the lead are improved.
In other embodiments of the present invention, the return mechanism is a rewind spring. The beneficial effect of adopting above-mentioned technical scheme is: the structure is simple, the conducting wire is kept in a tensioning state, and loosening is prevented.
In other embodiments of the present invention, as shown in fig. 4, the reset mechanism includes a second transmission gear 22 engaged with the first transmission gear 15, a second transmission tooth 23 is provided on the lateral periphery of the wire slot of the wire coil 18, a one-way bearing 24 is installed on the inner ring of the second transmission gear 22, and a torque limiter 25 is installed on the inner ring of the wire coil 18. The beneficial effect of adopting above-mentioned technical scheme is: when the wire is paid off, the inner ring and the outer ring of the one-way bearing 24 in the second transmission gear 22 are in an asynchronous state, the first transmission gear 15 cannot drive the second transmission gear 22 to rotate, namely, the rotation of the driving mechanism cannot influence the paying off of the wire coil; when the rotating ring rotates reversely and the wires are taken up, the inner ring and the outer ring of the one-way bearing 24 are in a synchronous state, the wire coil 18 rotates along with the wire coil to take up the wires, the wires exceed the rotating torque of the torque limiter 25 and idle when being tightened, the constant tension force on the wires is kept, and the rotating speed is stable and uniform.
In other embodiments of the present invention, a first sealing ring is disposed between one side surface of the swivel and the first plate, and a second sealing ring is disposed between the other side surface of the swivel and the second plate. The beneficial effect of adopting above-mentioned technical scheme is: prevent the plating solution from invading into the cavity between the first plate body and the second plate body.
As shown in fig. 5, an electroplating apparatus includes an electroplating tank 19, a driving mechanism 20 and the above-mentioned vertical rotary electroplating jig for wafer, wherein an anode electrode opposite to the wafer is disposed in the electroplating tank 19, a power connector 21 of the vertical rotary electroplating jig for wafer is connected to a cathode of a power supply, a driving gear 201 is disposed on a rotating shaft of the driving mechanism 20, and a first transmission gear 15 of the vertical rotary electroplating jig for wafer is meshed with the driving gear 201. Briefly describing the process of electroplating the wafer, firstly, the wafer is placed on the rotary ring 13 outside the electroplating pool, the surface to be electroplated of the wafer faces the annular cathode electrode plate 16, then the pressure plate 14 is locked, the electroplating jig is placed in the electroplating pool 19 of the battery device through a mechanical arm, the first transmission gear 15 of the electroplating jig is meshed with the driving gear 201 of the driving mechanism 20 on the electroplating device, meanwhile, the power connector 21 of the electroplating jig is connected to the cathode of the power supply, the anode electrode opposite to the wafer is arranged in the electroplating pool, so that the free metal ions in the electroplating solution are transferred to the surface of the wafer under the action of potential, the rotary ring and the wafer are driven to rotate back and forth by the driving mechanism in the electroplating process, the lead on the wire coil is also wound and unwound to overcome the uneven coating caused by the uneven electric field intensity, and the difference of the uniformity of the coating thickness is controlled to, the wafer electroplating quality is improved.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.
Claims (8)
1. A vertical rotary electroplating jig for a wafer is characterized by comprising a first plate body, a second plate body, a rotating ring, a pressing plate and a transmission mechanism, wherein the first plate body, the second plate body, the rotating ring and the pressing plate are vertically arranged, the transmission mechanism drives the rotating ring to rotate, a power supply connector used for being connected with a power supply cathode is arranged on the first plate body or the second plate body, an annular cathode electrode plate is arranged on the rotating ring, the annular cathode electrode plate is electrically connected with the power supply connector through a lead, the vertical rotary electroplating jig further comprises a wire coil, the lead is wound on the wire coil, and the vertical rotary electroplating jig further comprises a; the transmission mechanism comprises a first transmission tooth-shaped part arranged on the rotating ring and a first transmission gear meshed with the first transmission tooth-shaped part.
2. The vertical rotary electroplating jig for wafers as claimed in claim 1, wherein two ends of the conducting wire are electrically connected with the annular cathode electrode plate and the power connector respectively by welding or screw fixation connection.
3. The vertical rotary electroplating jig for wafers as claimed in claim 2, wherein the periphery of the conductive wire has an insulating layer.
4. The vertical rotary wafer electroplating jig of claim 3, wherein the swivel is provided with a ring-shaped wire slot for regulating wires.
5. The vertical rotary wafer electroplating tool of claim 1, wherein the return mechanism is a rewind spring.
6. The vertical rotary wafer electroplating jig of claim 1, wherein the reset mechanism comprises a second transmission gear meshed with the first transmission gear, a second transmission tooth-shaped part is arranged on the lateral periphery of the wire slot of the wire coil, a one-way bearing is mounted on the inner ring of the second transmission gear, and a torque limiter is mounted on the inner ring of the wire coil.
7. The vertical rotary electroplating jig for wafers of claim 1, wherein a first sealing ring is disposed between one side surface of the rotary ring and the first plate, and a second sealing ring is disposed between the other side surface of the rotary ring and the second plate.
8. An electroplating device, which is characterized by comprising an electroplating pool, a driving mechanism and the vertical rotary wafer electroplating jig as claimed in any one of claims 1 to 7, wherein an anode electrode opposite to a wafer is arranged in the electroplating pool, a power supply connector of the vertical rotary wafer electroplating jig is connected to a cathode of a power supply, a rotating shaft of the driving mechanism is provided with driving teeth, and a first transmission gear of the vertical rotary wafer electroplating jig is meshed with the driving teeth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010634650.7A CN111705355A (en) | 2020-07-02 | 2020-07-02 | Vertical rotary electroplating jig for wafer and electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010634650.7A CN111705355A (en) | 2020-07-02 | 2020-07-02 | Vertical rotary electroplating jig for wafer and electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111705355A true CN111705355A (en) | 2020-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010634650.7A Pending CN111705355A (en) | 2020-07-02 | 2020-07-02 | Vertical rotary electroplating jig for wafer and electroplating device |
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| CN (1) | CN111705355A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118147725A (en) * | 2024-05-10 | 2024-06-07 | 苏州智程半导体科技股份有限公司 | Jig for wafer cleaning or electroplating |
| CN118147725B (en) * | 2024-05-10 | 2024-07-09 | 苏州智程半导体科技股份有限公司 | Jig for wafer cleaning or electroplating |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060070883A1 (en) * | 2004-10-04 | 2006-04-06 | Chemical Safety Technology, Inc. | Fixtureless vertical paddle electroplating cell |
| TWI414640B (en) * | 2010-09-06 | 2013-11-11 | Grand Plastic Technology Co Ltd | Wafer clamping apparatus with vertical haning arm for plating |
| CN104220648A (en) * | 2012-04-20 | 2014-12-17 | 株式会社Ｊｃｕ | Substrate plating jig and plating device using same |
| CN107109682A (en) * | 2014-12-19 | 2017-08-29 | 埃托特克德国有限公司 | The substrate holder of metal is electroplated for vertical deposition |
| CN110387571A (en) * | 2018-04-17 | 2019-10-29 | 姜力 | Wafer jig for electroplating device |
-
2020
- 2020-07-02 CN CN202010634650.7A patent/CN111705355A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060070883A1 (en) * | 2004-10-04 | 2006-04-06 | Chemical Safety Technology, Inc. | Fixtureless vertical paddle electroplating cell |
| TWI414640B (en) * | 2010-09-06 | 2013-11-11 | Grand Plastic Technology Co Ltd | Wafer clamping apparatus with vertical haning arm for plating |
| CN104220648A (en) * | 2012-04-20 | 2014-12-17 | 株式会社Ｊｃｕ | Substrate plating jig and plating device using same |
| CN107109682A (en) * | 2014-12-19 | 2017-08-29 | 埃托特克德国有限公司 | The substrate holder of metal is electroplated for vertical deposition |
| CN110387571A (en) * | 2018-04-17 | 2019-10-29 | 姜力 | Wafer jig for electroplating device |
Non-Patent Citations (1)
| Title |
|---|
| 文根保: "《复杂注塑模现代设计》", 31 July 2018 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118147725A (en) * | 2024-05-10 | 2024-06-07 | 苏州智程半导体科技股份有限公司 | Jig for wafer cleaning or electroplating |
| CN118147725B (en) * | 2024-05-10 | 2024-07-09 | 苏州智程半导体科技股份有限公司 | Jig for wafer cleaning or electroplating |
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Application publication date: 20200925 |