JP2938172B2 - Slip ring electroplating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention] (Industrial application field) The present invention provides, for example, silver plating on a power / signal transmission / reception slip ring provided on a solar battery paddle mounted on an artificial satellite. The present invention relates to an electroplating apparatus for a slip ring used in the present invention.

(Prior art) Conventionally, this type of electroplating apparatus immerses a slip ring in a plating solution contained in a plating tank and applies a current obtained by multiplying a surface area of the ring portion by a cathode current density (D _K ). The plating layer is formed by applying the voltage for a time set based on the plating tank and the plating time conversion table.
At the same time, in the plating tank, if the anode (silver plate) contained in the plating solution is not sufficiently stirred, a passivation phenomenon occurs, and after the insolubilization, the bath voltage increases and the current increases. It is reduced and the plating cannot be performed. For this reason, the plating tank improves the dissolution of the anode by stirring and circulating the plating solution using a filter or a separate stirring means,
It is necessary to improve the supply of silver ions to the cathode (that is, the ring portion of the slip ring). In the plating solution of the plating bath, a two-component brightener, for example, a selenite-based inorganic brightener and an organic brightener, exhibits a desired luster within a use range of a cathode current density (D _K ) as a brightener. Only added.

By the way, in such an electroplating apparatus, the rotation of the plating (precipitation state) tends to concentrate on a portion having a small electric resistance, and is thick on a corner, an end, a surface, or the like of a body to be plated. It is characterized in that the plating layer in the shaded area such as the back surface and the inside of the box becomes thin. The plating layer is determined by the current supply range of the cathode current density (D _K ) of the plating solution, the plating operation conditions, and the plating conditions of the physical properties of the plating layer.

On the other hand, a slip ring is formed by arranging a plurality of copper rings in parallel at a predetermined interval and bonding them using a special resin, and a lead wire coated with a resin material is soldered to the copper ring. In addition, it is difficult to immerse the lead wire in the plating solution for a long time because of the adhesion between the lead wire and the special resin and the like, and it is required to perform plating quickly. In addition, in such a slip ring, the plating layer formed on the copper ring is worn down according to its use (operation), and is reduced. In order to form a uniform plating layer, it is required to form a base material on a part of the substrate and cause a problem such as poor contact.

However, in the electroplating apparatus, as described above, the plating conditions are determined, so that the cathode current density (D _K ) is excessively increased and the plating speed is increased. There is a problem in that burning or the like occurs and it is difficult to form a high quality plating layer.

Means for increasing the plating speed can also be realized by increasing the metal concentration in the plating solution and increasing the stirring of the plating solution.

However, since the thickness of the plating layer varies with the above-described means, it is difficult to apply the method to the plating of the slip ring, which requires a uniform plating layer, as described above. This is a serious problem particularly when applied to a space slip ring requiring high reliability.

(Problems to be Solved by the Invention) As described above, the conventional electroplating apparatus has a problem that it takes much time to form a uniform and high-quality plating layer on a slip ring. Was.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a slip ring electroplating apparatus capable of realizing a quick, uniform, and high-quality plating layer.

[Constitution of the Invention] (Means for Solving the Problems) The present invention is a device in which a slip ring for transmitting and receiving power and signals is immersed, and a plating layer containing a plating solution into which electrodes are inserted, A slip ring is attached and detached. When the slip ring is rotatably supported around a rotation axis and immersed in a plating solution in the plating tank at a predetermined inclination angle, a support mechanism is provided. Rotation driving means for rotationally driving the mounted slip ring,
A power supply unit for applying a voltage to a ring portion of the slip ring mounted on the support mechanism constitutes a slip ring electroplating apparatus.

(Operation) According to the above configuration, the slip ring is immersed in the plating solution at a predetermined tilt angle while being rotated, so that the plating solution can be effectively circulated and the current line can be prevented from being concentrated at one point. Therefore, even if a relatively large current is supplied to the slip ring, it is possible to prevent the occurrence of burning, burning, etc.
As the plating speed is increased, high-quality plating can be formed.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an apparatus for electroplating a slip ring according to an embodiment of the present invention. A pair of plates 11a and 11b are provided on both sides of a plating tank 10. And this stand 11
Supporting structures 12a and 12b that can be freely combined are placed between a and 11b.
First to third bearing portions 13, 14, 15 are provided at predetermined intervals on the support structures 12a, 12b, and the first and second bearing portions 13, 14 are provided with cylindrical mounting portions. The member 16 is rotatably supported. As shown in FIG.
Are rotatably accommodated, and a ring clamper mechanism 18 is provided at the tip of the rotating member 17. As shown in FIG. 3, the ring clamper mechanism 18 includes, for example, a clamper section 18a.
And the plunger section 18b, and the clamper section 18a
The plunger 18b and the plunger 18b support the object to be plated such that the power and signal transmission / reception slip ring 19 is sandwiched therebetween. The plunger portion 18b of the ring clamper mechanism 18 is rotatably supported by the third bearing portion 15.

In addition, the base of the rotating member 17 is loosely inserted into the mounting member 16 together with the harness 19a of the slip ring 19 (second embodiment).
See figure). The harness 19a is electrically connected to a plating lead clip 21 provided on the support structure 12a via a slip ring mechanism 20. As shown in FIG. 4, the slip ring mechanism 20 is provided with a slip ring 20b detachably provided on the rotating member 17 via a connector 20a.
And a brush 20c provided on the support structure 12a.

Further, a drive motor 22 is provided on the support structure 12a,
A drive shaft of the drive motor 21 has a slip ring 20b of a slip ring mechanism 20 supported at a base end of the rotary member 17.
Are connected, for example, via a universal joint 23 so as to be able to transmit torque. The support structure 12b is provided with an angle adjuster 24 capable of adjusting the height, corresponding to the mount 11b. The angle adjusting unit 24 is configured such that the first bearing unit 13 of the support structure 12a is mounted on one of the gantry 11a and the other
The slip ring 19 mounted on the first member 1b and supported by the rotating member 17 has a predetermined inclination angle θ as shown in FIG. 12 mm) is adjusted so that it is immersed in the plating solution in the plating tank 10.

The plating tank 10, for example, potassium (K) D _K using the bath 1-2A / dm ² (static bath) 2-component brightener selenite inorganic brightener and an organic brightener that energizable , For example, a driving pump 25 as shown in FIG.
The filter 26 is circulated through a filtration circulating mechanism composed of the filter 26 and always contains a constant amount of plating solution. Then, a silver plate 27 is accommodated in the plating solution of the plating tank 10 as an anode. Further, as shown in FIG. 7, the plating tank 10 is provided with first and second positioning portions 10a and 10b having concave shapes. The first and second positioning portions 10a and 10b are provided with a rotating member 17.
The clamper portion 18a of the ringing clamper mechanism 18 and the mounting member 16 are accommodated in a non-contact state, and the angle of the slip ring 19 can be adjusted by the gap operation in conjunction with the position operation of the angle adjusting portion 24. .

In the above configuration, the slip ring 19
First, the harness 19a is attached to the tip of the rotating member 17 via the ring clamper mechanism 18, and the harness 19a is loosely inserted into the attaching member 16 together with the rotating member 17. Here, the attachment member 16 and the plunger portion 18b of the ring clamper assembly 18 are attached to the first to third bearing portions 13 to 15, and the slip ring 19 is provided.
Are mounted on the support structures 12a, 12b. At this time, the rotating member 1
A slip ring mechanism 20 is attached to the base end of the connector 7 via a connector 20a, and the slip ring mechanism 20 is connected to a drive shaft of a drive motor 22 via a universal joint 23. Next, the plunger portion 18b of the ring clamper mechanism 18 of the rotating member 17 and the mounting member 16 are accommodated in the first and second positioning portions 10a, 10b, and the first bearing portion 13a is provided. And, the angle adjusting unit 24 is placed on the gantry 11a, 11b of the plating tank 10. At this time, the angle adjuster 24 determines that the slip ring 19 has the predetermined inclination angle θ as described above,
The height is adjusted so that 〜8 equal parts are immersed in the plating solution in the plating tank 10. Then, the operation unit 28 provided on the support structure 12a is operated to drive the drive motor 22, and the rotating member 17
Is rotated and the slip ring 19 is rotated while being immersed in the plating solution in a minimum liquid contact state, to form a silver plating layer. At this time, as the rotation speed of the slip ring 19,
While the operator monitors the tachometer 29, the speed is set to a minimum of 70 rotations / minute or more, for example, about 120 rotations / minute.

The silver plating step is performed after the electrolytic cleaning, water washing, copper plating, and water washing steps of the slip ring 19 have been completed. These electrolytic cleaning, water washing, copper plating, and water washing, respectively, are performed. Also in the process, the slip ring 19 is rotated and driven in substantially the same manner as in the silver plating process.

As described above, the slip ring electroplating apparatus is configured so that the slip ring 19 is immersed in the plating solution at a predetermined inclination angle while rotating and driving the slip ring 19 via the rotating member 17, so that the effect of the plating solution can be obtained. The current line is concentrated at one point with the circulating effect, and even if a relatively large current is supplied to the slip ring 19, the occurrence of burns, burns, etc. can be prevented, the plating speed is increased, and high quality plating is achieved. Formation is possible. As a result, in the plating time of about 10 to 15 minutes, the variation in the circumferential direction of the slip ring 19 is ± 1 μm.
It is confirmed that it is possible to form a desired plating layer as uniform as possible. This plating time is 1/4 to 1/5 of the conventional static bath.
It is equivalent to

That is, to increase the efficiency of silver plating, for example, the actual measured value of the amount of silver deposited by the plating is 90.4% of the surface area of the slip ring 19.
And 3 cm ^2, when the average value of the thickness of the plating layer and 15.61 × 10 ^-4 cm, the total deposition amount of silver becomes ^{(90.43cm 2 × 15.61 × 10 -4} cm) × silver specific gravity, (90.43cm ² X 15.61 x 10 ^-4 cm) x 10.5 g / cm ³ = 1.482 g /
It becomes silver.

On the other hand, the theoretical deposition amount of silver is 1F (Faraday) = 96494 coul = 107.88 g / current density of silver slip ring 19 is 0.33 A / cm x 4.8 cm = 1.584
A ≒ 1.6A, and 1coul = A × sec. Therefore, when the total amount of electricity of silver plating is 1.6A × 15 minutes × 60 seconds / min = 1440coul, (107.88g × 1440coul) ÷ 96494coul = 1.6099g Becomes

Therefore, the silver deposition efficiency expressed by the formula (measured value / theoretical value) × 100 is (1.482 g ÷ 1.6099 g) × 100 = 92.0%, which realizes highly efficient silver plating of 92.0%.

The slip ring 19, which is the object to be plated, can be applied, for example, to a slip ring used for a solar cell paddle mounted in a sanitation or a slip ring for transmitting and receiving electric power and signals to and from various rotating bodies on the ground.

Further, in the above embodiment, the case where the present invention is applied to silver plating is described. However, the present invention is not limited to this, and can also be applied to plating such as copper plating.

Therefore, it is needless to say that the present invention is not limited to the above-described embodiment, and that various modifications can be made without departing from the scope of the present invention.

[Effects of the Invention] As described above in detail, according to the present invention, it is possible to provide a slip ring electroplating apparatus capable of realizing formation of a uniform plating layer of high quality quickly. it can.

[Brief description of the drawings]

FIG. 1 is a structural view showing an electroplating apparatus for a slip ring according to an embodiment of the present invention, and FIGS. 2 to 7 are detailed views each showing a part of FIG. 10 Plating tank, 11a, 11b Stand, 12a, 12b Support structure, 13 to 15 First to third bearing portions, 16 Mounting member, 17 Rotating member, 18 Ring clip mechanism, 18a
…… Clamper part, 18b …… Plunger part, 19 …… Slip ring, 19a …… Harness, 20 …… Slip ring mechanism, 20a …… Connector, 20b …… Slip ring, 20
c: Brush, 21: Lead clip, 22: Drive motor, 23: Universal joint, 24: Angle adjuster, 25: Pump, 26: Filter, 27: Silver plate, 28 ...
... operation unit, 29 ... tachometer.

Claims (1)

(57) [Claims] A slip ring for transmitting and receiving electric power and a signal is immersed therein. A plating bath containing a plating solution into which an electrode is inserted, and the slip ring is attached and detached. A support mechanism for rotatably supporting the slip ring around a rotation axis and dipping the plating solution in the plating tank at a predetermined inclination angle, and a rotation drive for rotating the slip ring mounted on the support mechanism. Means, and a power supply means for applying a voltage to a ring portion of the slip ring mounted on the support mechanism.