CN212476933U - Vertical rotary electroplating jig for wafer and transmission mechanism thereof - Google Patents
Vertical rotary electroplating jig for wafer and transmission mechanism thereof Download PDFInfo
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- CN212476933U CN212476933U CN202021281501.9U CN202021281501U CN212476933U CN 212476933 U CN212476933 U CN 212476933U CN 202021281501 U CN202021281501 U CN 202021281501U CN 212476933 U CN212476933 U CN 212476933U
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Abstract
The utility model provides a vertical rotatory electroplating jig of wafer and drive mechanism thereof, the vertical rotatory electroplating jig of wafer include the first plate body, second plate body, swivel, clamp plate of vertical setting and drive mechanism, drive mechanism is including setting up transmission profile of tooth portion and at least one on the swivel are engaged with transmission profile of tooth portion mutually. The electroplating jig is vertically arranged, so that the occupied area can be effectively reduced, and the utilization rate of a production field is improved. Through the gear drive mode, drive gear conveniently sets up between first plate body and second plate body, can not cause the stirring to the plating solution. The driving mechanism with the driving teeth is arranged on the electroplating pool of the electroplating device, and is meshed with the outermost transmission gear through the driving teeth, so that the transmission is more stable, and the rotating speed of the wafer can be controlled more accurately.
Description
Technical Field
The utility model relates to a wet processing procedure technical field of wafer encapsulation specifically is a vertical rotatory electroplating jig of wafer and drive mechanism thereof.
Background
In the wafer packaging wet process, the electric field intensity of each position of the wafer is slightly different, so that the thickness of the plating layer has certain uniformity difference. In order to improve the uniformity of the thickness of the electroplated coating of the wafer, a rotary electroplating jig is provided, namely, the wafer continuously rotates in the electroplating process, and the method can effectively improve the uniformity of the electroplated coating. In order to enable the rotary driving mechanism to be positioned above the electroplating solution in the electroplating pool so as to prevent the rotary driving mechanism from being corroded by the electroplating solution or stirring the electroplating solution with larger fluctuation, the conventional rotary electroplating jig is generally horizontal, namely, a wafer is in a horizontal state during electroplating, but the horizontal electroplating jig occupies a large area and affects the production efficiency.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a vertical rotary electroplating jig for wafers and a transmission mechanism thereof.
In order to achieve the above object, the technical solution of the present invention is: the utility model provides a vertical rotatory drive mechanism who electroplates tool of wafer, the vertical rotatory tool of electroplating of wafer include vertical first plate body, second plate body, swivel, clamp plate that sets up and drive mechanism, drive mechanism is including setting up transmission profile of tooth portion and at least one drive gear who meshes with transmission profile of tooth portion on the swivel.
The utility model discloses compare in prior art, electroplate the tool and become vertical setting, can effectively reduce area, improve the production place utilization ratio. Through the gear drive mode, drive gear conveniently sets up between first plate body and second plate body, can not cause the stirring to the plating solution. The driving mechanism with the driving teeth is arranged on the electroplating pool of the electroplating device, and is meshed with the outermost transmission gear through the driving teeth, so that the transmission is more stable, and the rotating speed of the wafer can be controlled more accurately.
Further, the transmission gear is located obliquely above the swivel.
By adopting the preferable scheme, the lower part of the transmission gear is meshed with the transmission tooth form of the rotating ring, and the inclined upper part of the transmission gear is exposed and meshed with the driving tooth of the driving mechanism on the electroplating device, so that the occupied space of the electroplating jig is reduced.
Further, the transmission ratio of the transmission mechanism is larger than 2.
By adopting the preferable scheme, the speed reduction effect is achieved, and the driving force is improved.
The utility model provides a vertical rotatory electroplating jig of wafer, includes the first plate body, the second plate body, swivel and the clamp plate of vertical setting, the swivel rotationally set up in between first plate body and the second plate body, the clamp plate passes through the connecting piece to be installed on the swivel, treat that electroplating wafer sets up between clamp plate and the swivel, the swivel adopts foretell drive mechanism to drive.
Furthermore, the rotating ring is provided with an annular electrode, and the annular electrode is connected with the power supply connector through a lead.
Further, the wire is wound on a wire coil.
Further, the wire coiling device also comprises a coil spring for promoting the coil to rotate, so that the drawn-out wires are wound on the coil in a recovery mode.
By adopting the preferred scheme, the wire is controlled to be correspondingly wound and unwound along with the rotation of the rotary ring in a wire coil mode, so that the wire is prevented from being loosened, and the connecting point of the wire and the annular electrode is fixedly and electrically connected by welding and the like, so that good conductive performance is ensured.
Furthermore, a first sealing ring is arranged between one side face of the rotating ring and the first plate body, and a second sealing ring is arranged between the other side face of the rotating ring and the second plate body.
With the preferred scheme, the electroplating solution is prevented from invading into the cavity between the first plate body and the second plate body.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a hidden first plate according to an embodiment of the present invention;
fig. 3 is a schematic structural view of an embodiment of the present invention, which conceals the first plate and the pressing plate;
FIG. 4 is a schematic structural view of an electroplating apparatus.
Names of corresponding parts represented by numerals and letters in the drawings:
11-a first plate body; 12-a second plate body; 13-rotating; 131-a transmission tooth-shaped part; 14-a platen; 15-a transmission gear; 16-a ring electrode; 18-wire coil; 19-a plating tank; 20-a drive mechanism; 201-drive teeth; 21-power connection.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1 to 3, an embodiment of the present invention is: a transmission mechanism of a vertical rotary electroplating jig for wafers comprises a first plate body 11, a second plate body 12, a rotating ring 13, a pressing plate 14 and the transmission mechanism, wherein the first plate body and the second plate body are vertically arranged, and the transmission mechanism comprises a transmission tooth-shaped portion 131 and at least one transmission gear 15, the transmission tooth-shaped portion 131 is arranged on the rotating ring 13, and the transmission gear is meshed with the transmission tooth-shaped portion 131.
The beneficial effect of adopting above-mentioned technical scheme is: the electroplating jig is vertically arranged, so that the occupied area can be effectively reduced, and the utilization rate of a production field is improved. Through the gear drive mode, drive gear conveniently sets up between first plate body and second plate body, can not cause the stirring to the plating solution. The driving mechanism with the driving teeth is arranged on the electroplating pool of the electroplating device, and is meshed with the outermost transmission gear through the driving teeth, so that the transmission is more stable, and the rotating speed of the wafer can be controlled more accurately.
In other embodiments of the invention, as shown in fig. 2, the transmission gear 15 is located obliquely above the swivel 13. The beneficial effect of adopting above-mentioned technical scheme is: the lower part of the transmission gear is meshed with the transmission tooth shape of the rotating ring, and the inclined upper part of the transmission gear is exposed and meshed with the driving tooth of the driving mechanism on the electroplating device, so that the occupied space of the electroplating jig is reduced.
In other embodiments of the present invention, the transmission ratio of the transmission mechanism is greater than 2. The beneficial effect of adopting above-mentioned technical scheme is: the speed reduction effect is achieved, and the driving force is improved.
As shown in fig. 1-3, a vertical rotary electroplating jig for wafers comprises a first plate 11, a second plate 12, a swivel 13 and a pressing plate 14, wherein the first plate 11, the second plate 12, the swivel 13 and the pressing plate 14 are vertically arranged, the swivel 13 is rotatably arranged between the first plate 11 and the second plate 12, the pressing plate 14 is mounted on the swivel 13 through a connecting piece, a wafer to be electroplated is arranged between the pressing plate 14 and the swivel 13, and the swivel 13 is driven by the transmission mechanism.
As shown in fig. 3 and 4, in another embodiment of the present invention, a ring electrode 16 is disposed on the swivel 13, and the ring electrode 16 is connected to a power connector 21 through a wire. The conducting wire is wound on a wire coil 18, and two ends of the conducting wire are respectively fixedly connected to the annular electrode 16 and the power supply connector 21 so as to realize the electric conduction between the annular electrode 16 and the power supply cathode. And the wire coil is used for promoting the wire coil to rotate, so that loose wires can be timely recovered and wound on the wire coil when the rotating ring rotates reversely. The beneficial effect of adopting above-mentioned technical scheme is: the wire coil is adopted to control the wire to be correspondingly wound and unwound along with the rotation of the rotating ring, so that good conductive performance is ensured.
In other embodiments of the present invention, a first sealing ring is disposed between one side surface of the swivel and the first plate, and a second sealing ring is disposed between the other side surface of the swivel and the second plate. The beneficial effect of adopting above-mentioned technical scheme is: prevent the plating solution from invading into the cavity between the first plate body and the second plate body.
Referring to fig. 4, briefly described below, a wafer plating process is performed by first placing the wafer on the turntable outside of the plating cell, with the side of the wafer to be plated facing the ring electrode 16, in the locking pressing plate 14, the electroplating jig is placed into an electroplating pool of the battery device through a mechanical arm, a transmission gear 15 of the electroplating jig is meshed with a driving gear of a driving mechanism 20 on the electroplating device, a power supply connector 21 of the electroplating jig is connected to a cathode of a power supply, an anode electrode is arranged in the electroplating pool and is opposite to the wafer, so that free metal ions in the electroplating solution are transferred to the surface of the wafer under the action of potential, the driving mechanism drives the rotating ring and the wafer to rotate back and forth in the electroplating process so as to overcome the non-uniformity of the coating caused by the non-uniformity of the electric field intensity, the thickness uniformity difference of the plating layer is controlled to be 5-10%, and the wafer electroplating quality is improved.
The above embodiments are only for illustrating the technical conception and the features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and the protection scope of the present invention can not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (8)
1. The utility model provides a vertical rotatory drive mechanism who electroplates tool of wafer, its characterized in that, the vertical rotatory tool of electroplating of wafer include vertical first plate body, second plate body, swivel, clamp plate that sets up and drive mechanism, drive mechanism is including setting up transmission profile of tooth portion and at least one and transmission gear that transmission profile of tooth portion meshed on the swivel.
2. The transmission mechanism of a vertical rotary electroplating tool for wafers as claimed in claim 1, wherein the transmission gear is located obliquely above the rotary ring.
3. The transmission mechanism of the vertical rotary electroplating tool for wafers as claimed in claim 2, wherein the transmission ratio of the transmission mechanism is greater than 2.
4. A vertical rotary electroplating jig for wafers is characterized by comprising a first plate body, a second plate body, a rotating ring and a pressing plate which are vertically arranged, wherein the rotating ring is rotatably arranged between the first plate body and the second plate body, the pressing plate is arranged on the rotating ring through a connecting piece, a wafer to be electroplated is arranged between the pressing plate and the rotating ring, and the rotating ring is driven by the transmission mechanism of the vertical rotary electroplating jig for wafers according to any one of claims 1 to 3.
5. The vertical rotary wafer electroplating jig of claim 4, wherein the rotary ring is provided with a ring electrode, and the ring electrode is connected with a power supply connector through a wire.
6. The vertical rotary electroplating jig for wafers of claim 5, wherein the wires are wound on a wire coil.
7. The vertical rotary wafer electroplating jig of claim 6, further comprising a coil spring for urging the wire coil to rotate so that the drawn wire is wound around the wire coil.
8. The vertical rotary electroplating jig for wafers as claimed in claim 7, wherein a first sealing ring is disposed between one side surface of the rotary ring and the first plate, and a second sealing ring is disposed between the other side surface of the rotary ring and the second plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021281501.9U CN212476933U (en) | 2020-07-02 | 2020-07-02 | Vertical rotary electroplating jig for wafer and transmission mechanism thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021281501.9U CN212476933U (en) | 2020-07-02 | 2020-07-02 | Vertical rotary electroplating jig for wafer and transmission mechanism thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212476933U true CN212476933U (en) | 2021-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021281501.9U Active CN212476933U (en) | 2020-07-02 | 2020-07-02 | Vertical rotary electroplating jig for wafer and transmission mechanism thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212476933U (en) |
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2020
- 2020-07-02 CN CN202021281501.9U patent/CN212476933U/en active Active
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