CN207845817U - A kind of electroplating bath cathode moving device rotated and move back and forth - Google Patents
A kind of electroplating bath cathode moving device rotated and move back and forth Download PDFInfo
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- CN207845817U CN207845817U CN201721744794.8U CN201721744794U CN207845817U CN 207845817 U CN207845817 U CN 207845817U CN 201721744794 U CN201721744794 U CN 201721744794U CN 207845817 U CN207845817 U CN 207845817U
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- Prior art keywords
- electroplating bath
- cathode
- plating piece
- crossbeam
- motor
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Abstract
A kind of electroplating bath cathode moving device rotated and move back and forth, including supporting rack, cathode parallel moving mechanism, cathode rotating mechanism, electroplating bath, plating piece and anode, cathode parallel moving mechanism includes lifting motor, linear motor, hanger and crossbeam, crossbeam is fixed on the guide rail of supporting rack, crossbeam is controlled by lifting motor to move up and down, hanger connection is suspended on crossbeam, and it is connected with cathode rotating mechanism below hanger, cathode rotating mechanism includes revoluting motor, spinning motor, gear and plating piece fixture, plating piece fixture is evenly distributed on one week of gear, and it is rotated with gear, plating piece one end is held in plating piece fixture, the other end is immersed in the electroplating bath for filling plating solution, anode is arranged in the side and bottom surface of electroplating bath.The device keeps electric field line distribution uniform, enhances flow of the electrolyte mass transfer, eliminates the bubble of plating piece adsorption, to solve the problems, such as to move back and forth the quality of coating of generation of the cathode moving device in microscale workpieces electroplating process, improves the uniformity of coating.
Description
Technical field
The utility model belongs to technical field of plating equipment, and in particular to arrives a kind of cathode moving device, is especially used for
The rotation of accurate thickness coating part plating and the cathode moving device of reciprocating motion.
Background technology
Plating be exactly using electrolysis principle using electroplating mechanism that plated on certain metal surfaces the other metals of a thin layer or
The process of alloy is so that the surface of metal or other materials product is adhered to the technique of layer of metal film to rise using electrolysis
To the effects that preventing from corroding, improve wearability, electric conductivity, reflective and having improved aesthetic appearance.
Currently, metal works, in electroplating process, the bubble in electroplate liquid can be attached to workpiece to be plated surface so that metal
Coating is unable to uniform fold workpiece surface, sand holes is formed, to leverage quality of coating;Or pass through up-and-down reciprocating the moon
Pole mobile device uniform motion drives the bubble of workpiece surface away, increases the mobility of liquid on workpiece, but due to up-and-down reciprocating
Cathode moving device is only capable of making up and down reciprocatingly uniform motion, in cylindrical work electroplating process, it may appear that and the thin both sides in both sides are thick,
Seriously affect the uniformity of coating.
Utility model content
The technical problem to be solved by the present invention is to provide the electroplating baths of a kind of rotation and reciprocating motion to be moved with cathode
Dynamic device, the device keep electric field line distribution uniform, enhance flow of the electrolyte mass transfer, eliminate the bubble of plating piece adsorption, to solve
The quality of coating problem of generation of the cathode moving device in microscale workpieces thickness coating (>=50 microns) electroplating process is moved back and forth,
Improve the uniformity of coating.
In order to solve the above-mentioned technical problem, the utility model is accomplished by the following way:
A kind of electroplating bath cathode moving device rotated and move back and forth, including supporting rack, cathode parallel moving mechanism, cathode
Rotating mechanism, electroplating bath, plating piece and anode, the cathode parallel moving mechanism include lifting motor, linear motor, hanger and crossbeam,
Supporting rack both sides are provided with guide rail, and crossbeam is fixed on the guide rail of supporting rack, pass through the lifting being arranged above supporting rack
Motor control crossbeam moves up and down, and the hanger connection is suspended on crossbeam, and is connected with cathode rotating mechanism, institute below hanger
It includes revoluting motor, spinning motor, gear and plating piece fixture to state cathode rotating mechanism, and plating piece fixture is evenly distributed on the one of gear
Week, and follow the rotation of gear and rotate, described plating piece one end is individually held in plating piece fixture, and the other end, which is immersed in, fills plating
In the electroplating bath of liquid, the anode is arranged on the side and bottom surface of electroplating bath.
Further, this patent is additionally provided with heating stirrer, and the heating stirrer is magnetic force heating stirrer, and is set
Set the trench bottom in electroplating bath.
Compared with prior art, the utility model has the advantage that:
Each plating piece is individually clamped in the device, rotates under rotating mechanism drive, is driven by spinning motor
Plating piece rotation makes the cylinder various pieces of plating piece be in equivalent state, keeps the electric field line distribution on plating piece surface uniform, to make plating
Part electroplating surface layer is uniform;It drives all plating pieces to revolve round the sun by revoluting motor, not only improves the uniformity of electric field line, also reach and stir
The effect for mixing plating solution increases the convective mass transfer of plating solution, removes the bubble on plating piece surface, avoids bubble from being adsorbed on plating piece surface, carries
The uniformity and surface quality of high electroplated layer.This patent also has the function of to move back and forth, by replacing coating bath, it can be achieved that plane is plated
The plating of part produces.
Description of the drawings
Fig. 1 is the structural schematic diagram of electroplating bath cathode moving device;
Fig. 2 is the structural schematic diagram of plating piece fixture;
Fig. 3 is the schematic top plan view of electroplating bath.
Each label is respectively in figure:1, lifting motor, 2, supporting rack, 3, linear motor, 4, hanger, 5, crossbeam, 6, public
Rotating motor, 7, autobiography motor, 8, gear, 9, plating piece fixture, 10, electroplating bath, 11, plating piece, 12, anode, 13, magnetic force heating stirring
Device.
Specific implementation mode
Specific embodiment of the present utility model is described in further detail in the following with reference to the drawings and specific embodiments.
As shown in Figures 1 to 3, the electroplating bath cathode moving device of a kind of rotation and reciprocating motion, including supporting rack 2, the moon
Pole parallel moving mechanism, cathode rotating mechanism, electroplating bath 10, plating piece 11 and anode 12, supporting rack are the load-carrying construction of whole device, institute
It includes lifting motor 1, linear motor 3, hanger 4 and crossbeam 5 to state cathode parallel moving mechanism, and supporting rack both sides are provided with guide rail, crossbeam
It is fixed on the guide rail of supporting rack, controlling crossbeam by the lifting motor being arranged above supporting rack moves up and down, described
Hanger connection is suspended on crossbeam, and is connected with cathode rotating mechanism below hanger, under the driving of linear motor 3, hanger band
It is reciprocating in crossbeam 5 cathode rotating mechanism.The cathode rotating mechanism includes revoluting motor 6, spinning motor 7, gear 8
With plating piece fixture 9, plating piece fixture is evenly distributed on one week of gear, and follows the rotation of gear and rotate, described plating piece one end
It is individually held in plating piece fixture, the other end is immersed in the electroplating bath for filling plating solution, and the anode is arranged in the side of electroplating bath
On face and bottom surface.
The utility model is additionally provided with heating stirrer, and the heating stirrer is magnetic force heating stirrer 13, and is arranged
In the trench bottom of electroplating bath.Electroplating bath uses circular configuration, size to be matched with the circular diameter residing for plating piece fixture, and anode is opposite to be set
Set in electroplating bath side, and anode away from bottom surface apart from identical.
Plating piece in electroplating bath makees revolution motion under the driving of revoluting motor, around the center of circle, while in spinning motor
Under driving, fixture is driven by gear, to make all plating pieces make spinning motion, by the speed for adjusting revolution and spinning motor
To control revolution and the respective rotating speed of rotation.Hanger is suspended on crossbeam, is moved reciprocatingly under the drive of linear motor, is being done
When reciprocating motion, rotary motion stops, and plating piece stretches under the drive of lifting motor in electroplating bath, plating piece enter after electroplating bath with sun
The relative position of pole is consistent.
When plating spherical shape or cylindricality plating piece, plating piece clamping starts revoluting motor and spinning motor on plating piece fixture, adjusts
To corresponding rotating speed, electroplating power supply is connected, starts lifting motor, drops in electroplating bath, proceed by plating.The moon of the present apparatus
Pole rotating mechanism is designed as integrally detachable, and when plane plating piece is electroplated, it is special that electroplating clamp could alternatively be plane plating piece
Fixture.The weight of fixture can be mitigated in this way, reduce the inertia that device moves back and forth, improve the stability of device.
The above is only the embodiment of the utility model, is stated again, for the ordinary skill people of the art
For member, without departing from the principle of this utility model, several improvement can also be carried out to the utility model, these improvement
Also it is included in the protection domain of the utility model claims.
Claims (4)
1. the electroplating bath cathode moving device of a kind of rotation and reciprocating motion, it is characterised in that:It is translatable including supporting rack, cathode
Mechanism, cathode rotating mechanism, electroplating bath, plating piece and anode, the cathode parallel moving mechanism include lifting motor, linear motor, extension
Frame and crossbeam, supporting rack both sides are provided with guide rail, and crossbeam is fixed on the guide rail of supporting rack, by being arranged on supporting rack
The lifting motor control crossbeam of side moves up and down, and the hanger connection is suspended on crossbeam, and cathode rotation is connected with below hanger
Rotation mechanism, the cathode rotating mechanism include revoluting motor, spinning motor, gear and plating piece fixture, and plating piece fixture is uniformly distributed
It at one week of gear, and follows the rotation of gear and rotates, described plating piece one end is individually held in plating piece fixture, other end leaching
Not in the electroplating bath for filling plating solution, the anode is arranged on the side and bottom surface of electroplating bath.
2. the electroplating bath cathode moving device of a kind of rotation according to claim 1 and reciprocating motion, it is characterised in that:
Further include heating stirrer, the heating stirrer is magnetic force heating stirrer, and the trench bottom in electroplating bath is arranged.
3. the electroplating bath cathode moving device of a kind of rotation according to claim 1 and reciprocating motion, it is characterised in that:
The electroplating bath uses circular configuration.
4. the electroplating bath cathode moving device of a kind of rotation according to claim 1 and reciprocating motion, it is characterised in that:
The anode is oppositely arranged on electroplating bath side, and anode away from bottom surface apart from identical.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201721744794.8U CN207845817U (en) | 2017-12-14 | 2017-12-14 | A kind of electroplating bath cathode moving device rotated and move back and forth |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201721744794.8U CN207845817U (en) | 2017-12-14 | 2017-12-14 | A kind of electroplating bath cathode moving device rotated and move back and forth |
Publications (1)
Publication Number | Publication Date |
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CN207845817U true CN207845817U (en) | 2018-09-11 |
Family
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CN201721744794.8U Expired - Fee Related CN207845817U (en) | 2017-12-14 | 2017-12-14 | A kind of electroplating bath cathode moving device rotated and move back and forth |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107974704A (en) * | 2017-12-14 | 2018-05-01 | 中国工程物理研究院激光聚变研究中心 | A kind of electroplating bath cathode moving device rotated and move back and forth |
CN110565157A (en) * | 2019-10-29 | 2019-12-13 | 山东泰开高压开关有限公司 | Hanging tool swinging device |
CN111364078A (en) * | 2020-04-27 | 2020-07-03 | 侯光微 | Omnibearing suspension electroplating method and electroplating equipment |
CN112899760A (en) * | 2021-01-25 | 2021-06-04 | 张旨玉 | Electroplating device for copper plating |
CN113106511A (en) * | 2021-03-20 | 2021-07-13 | 上海太同电镀有限公司 | Plated item belt cleaning device |
CN114341405A (en) * | 2021-12-07 | 2022-04-12 | 无锡星亿智能环保装备股份有限公司 | Mobile device and plating bath |
CN117587487A (en) * | 2024-01-18 | 2024-02-23 | 南京海创表面处理技术有限公司 | High-precision magnesium alloy workpiece surface electroplating equipment and control method |
-
2017
- 2017-12-14 CN CN201721744794.8U patent/CN207845817U/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107974704A (en) * | 2017-12-14 | 2018-05-01 | 中国工程物理研究院激光聚变研究中心 | A kind of electroplating bath cathode moving device rotated and move back and forth |
CN110565157A (en) * | 2019-10-29 | 2019-12-13 | 山东泰开高压开关有限公司 | Hanging tool swinging device |
CN111364078A (en) * | 2020-04-27 | 2020-07-03 | 侯光微 | Omnibearing suspension electroplating method and electroplating equipment |
CN112899760A (en) * | 2021-01-25 | 2021-06-04 | 张旨玉 | Electroplating device for copper plating |
CN113106511A (en) * | 2021-03-20 | 2021-07-13 | 上海太同电镀有限公司 | Plated item belt cleaning device |
CN113106511B (en) * | 2021-03-20 | 2022-07-01 | 上海太同电镀有限公司 | Plated item belt cleaning device |
CN114341405A (en) * | 2021-12-07 | 2022-04-12 | 无锡星亿智能环保装备股份有限公司 | Mobile device and plating bath |
CN114341405B (en) * | 2021-12-07 | 2023-12-19 | 无锡星亿智能环保装备股份有限公司 | Mobile device and electroplating bath |
CN117587487A (en) * | 2024-01-18 | 2024-02-23 | 南京海创表面处理技术有限公司 | High-precision magnesium alloy workpiece surface electroplating equipment and control method |
CN117587487B (en) * | 2024-01-18 | 2024-04-02 | 南京海创表面处理技术有限公司 | High-precision magnesium alloy workpiece surface electroplating equipment and control method |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180911 Termination date: 20181214 |
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CF01 | Termination of patent right due to non-payment of annual fee |