CN107974704A - A kind of electroplating bath cathode moving device rotated and move back and forth - Google Patents

A kind of electroplating bath cathode moving device rotated and move back and forth Download PDF

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Publication number
CN107974704A
CN107974704A CN201711338593.2A CN201711338593A CN107974704A CN 107974704 A CN107974704 A CN 107974704A CN 201711338593 A CN201711338593 A CN 201711338593A CN 107974704 A CN107974704 A CN 107974704A
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CN
China
Prior art keywords
electroplating bath
cathode
plating piece
crossbeam
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711338593.2A
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Chinese (zh)
Inventor
卢春林
张云望
尹强
张超
李娃
肖江
汤楷
李翠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laser Fusion Research Center China Academy of Engineering Physics
Original Assignee
Laser Fusion Research Center China Academy of Engineering Physics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laser Fusion Research Center China Academy of Engineering Physics filed Critical Laser Fusion Research Center China Academy of Engineering Physics
Priority to CN201711338593.2A priority Critical patent/CN107974704A/en
Publication of CN107974704A publication Critical patent/CN107974704A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks

Abstract

A kind of electroplating bath cathode moving device rotated and move back and forth, including supporting rack, cathode parallel moving mechanism, cathode rotating mechanism, electroplating bath, plating piece and anode, cathode parallel moving mechanism includes lifting motor, linear motor, hanger and crossbeam, crossbeam is fixed on the guide rail of supporting rack, crossbeam is controlled to move up and down by lifting motor, hanger connection is suspended on crossbeam, and it is connected with cathode rotating mechanism below hanger, cathode rotating mechanism includes revoluting motor, spinning motor, gear and plating piece fixture, plating piece fixture is evenly distributed on one week of gear, and rotated with gear, plating piece one end is held in plating piece fixture, the other end is immersed in the electroplating bath for filling plating solution, anode is arranged on the side and bottom surface of electroplating bath.The device makes electric field line distribution uniform, strengthens flow of the electrolyte mass transfer, eliminates the bubble of plating piece adsorption, to solve the problems, such as to move back and forth the quality of coating of generation of the cathode moving device in microscale workpieces electroplating process, improves the uniformity of coating.

Description

A kind of electroplating bath cathode moving device rotated and move back and forth
Technical field
The invention belongs to technical field of plating equipment, and in particular to a kind of cathode moving device, particularly be used for precision The rotation of thickness coating plating piece plating and the cathode moving device of reciprocating motion.
Background technology
Plating be exactly using electrolysis principle using electroplating mechanism that plated on some metal surfaces the other metals of a thin layer or The process of alloy, be using electrolysis make metal or other materials product surface attachment layer of metal film technique so as to rise To preventing from corroding, the effect such as wearability, electric conductivity, reflective and having improved aesthetic appearance is improved.
At present, metal works are in electroplating process, and the bubble in electroplate liquid can be attached to workpiece to be plated surface so that metal Coating is unable to uniform fold workpiece surface, sand holes is formed, so as to leverage quality of coating;It is or cloudy by up-and-down reciprocating Pole mobile device uniform motion, drives the bubble of workpiece surface away, increases the mobility of liquid on workpiece, but due to up-and-down reciprocating Cathode moving device is only capable of making up and down reciprocatingly uniform motion, in cylindrical work electroplating process, it may appear that and the thin both sides in both sides are thick, Seriously affect the uniformity of coating.
The content of the invention
The technical problem to be solved in the present invention is that provide a kind of electroplating bath for rotating and moving back and forth is filled with movable cathode Put, which makes electric field line distribution uniform, strengthens flow of the electrolyte mass transfer, eliminates the bubble of plating piece adsorption, reciprocal to solve The quality of coating problem of generation of the cathode moving device in microscale workpieces thickness coating (>=50 microns) electroplating process is moved, is improved The uniformity of coating.
In order to solve the above-mentioned technical problem, the present invention is accomplished by the following way:
A kind of electroplating bath cathode moving device rotated and move back and forth, including supporting rack, cathode parallel moving mechanism, cathode Rotating mechanism, electroplating bath, plating piece and anode, the cathode parallel moving mechanism include lifting motor, linear motor, hanger and crossbeam, Supporting rack both sides are provided with guide rail, and crossbeam is fixed on the guide rail of supporting rack, pass through the lifting being arranged on above supporting rack Motor control crossbeam moves up and down, and the hanger connection is suspended on crossbeam, and is connected with cathode rotating mechanism, institute below hanger Stating cathode rotating mechanism includes revoluting motor, spinning motor, gear and plating piece fixture, and plating piece fixture is evenly distributed on the one of gear Week, and follow the rotation of gear and rotate, described plating piece one end is individually held in plating piece fixture, and the other end, which is immersed in, fills plating In the electroplating bath of liquid, the anode is arranged on the side and bottom surface of electroplating bath.
Further, the present invention is additionally provided with heating stirrer, and the heating stirrer is magnetic force heating stirrer, and is set Put the trench bottom in electroplating bath.
Compared with prior art, the device have the advantages that:
Each plating piece of the invention individually clamps, and rotates under rotating mechanism drive, is driven and plated by spinning motor Part rotation, makes the cylinder various pieces of plating piece be in equivalent state, makes the electric field line distribution on plating piece surface uniform, so that plating piece Electroplating surface layer is uniform;Drive all plating pieces to revolve round the sun by revoluting motor, not only improve the uniformity of electric field line, also reach stirring The effect of plating solution, increases the convective mass transfer of plating solution, removes the bubble on plating piece surface, avoids bubble absorption in plating piece surface, raising The uniformity and surface quality of electrodeposited coating.The present invention also has the function of to move back and forth, by replacing coating bath, it can be achieved that plane plating piece Plating production.
Brief description of the drawings
Fig. 1 is the structure diagram of electroplating bath cathode moving device of the present invention;
Fig. 2 is the structure diagram of plating piece fixture;
Fig. 3 is the schematic top plan view of electroplating bath.
Each mark is respectively in figure:1st, lifting motor, 2, supporting rack, 3, linear motor, 4, hanger, 5, crossbeam, 6, public Rotating motor, 7, autobiography motor, 8, gear, 9, plating piece fixture, 10, electroplating bath, 11, plating piece, 12, anode, 13, magnetic force heating stirring Device.
Embodiment
The embodiment of the present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings.
As shown in Figures 1 to 3, a kind of electroplating bath cathode moving device rotated and move back and forth, including supporting rack 2, the moon Pole parallel moving mechanism, cathode rotating mechanism, electroplating bath 10, plating piece 11 and anode 12, supporting rack are the load-carrying construction of whole device, institute Stating cathode parallel moving mechanism includes lifting motor 1, linear motor 3, hanger 4 and crossbeam 5, and supporting rack both sides are provided with guide rail, crossbeam It is fixed on the guide rail of supporting rack, controls crossbeam to move up and down by being arranged on the lifting motor above supporting rack, it is described Hanger connection is suspended on crossbeam, and is connected with cathode rotating mechanism below hanger, under the driving of linear motor 3, hanger band It is reciprocating in crossbeam 5 cathode rotating mechanism.The cathode rotating mechanism includes revoluting motor 6, spinning motor 7, gear 8 With plating piece fixture 9, plating piece fixture is evenly distributed on one week of gear, and follows the rotation of gear and rotate, described plating piece one end Individually it is held in plating piece fixture, the other end is immersed in the electroplating bath for filling plating solution, and the anode is arranged on the side of electroplating bath On face and bottom surface.
The present invention is additionally provided with heating stirrer, and the heating stirrer is magnetic force heating stirrer 13, and is arranged on electricity The trench bottom of coating bath.Electroplating bath uses circular configuration, and size is matched with the circular diameter residing for plating piece fixture, and anode is oppositely arranged on Electroplating bath side, and anode away from bottom surface apart from identical.
Plating piece in electroplating bath makees revolution motion under the driving of revoluting motor, around the center of circle, while in spinning motor Under driving, fixture is driven by gear, so that all plating pieces make spinning motion, by the speed for adjusting revolution and spinning motor To control revolution and the respective rotating speed of rotation.Hanger is suspended on crossbeam, is moved reciprocatingly under the drive of linear motor, is being done During reciprocating motion, rotary motion stops, and plating piece stretched into electroplating bath under the drive of lifting motor, plating piece enter after electroplating bath with sun The relative position of pole is consistent.
When electroplating spherical or cylindricality plating piece, plating piece clamping starts revoluting motor and spinning motor on plating piece fixture, adjusts To corresponding rotating speed, electroplating power supply is connected, starts lifting motor, drops in electroplating bath, proceed by plating.The moon of the present apparatus Pole rotating mechanism is designed as integrally detachable, and when electroplating plane plating piece, it is special that electroplating clamp could alternatively be plane plating piece Fixture.The weight of fixture can so be mitigated, reduce the inertia that device moves back and forth, improve the stability of device.
The above is only embodiments of the present invention, is stated again, is come for those skilled in the art Say, without departing from the principle of the present invention, some improvement can also be carried out to the present invention, these improvement are also included in the present invention In scope of the claims.

Claims (4)

  1. A kind of 1. electroplating bath cathode moving device rotated and move back and forth, it is characterised in that:It is translatable including supporting rack, cathode Mechanism, cathode rotating mechanism, electroplating bath, plating piece and anode, the cathode parallel moving mechanism include lifting motor, linear motor, extension Frame and crossbeam, supporting rack both sides are provided with guide rail, and crossbeam is fixed on the guide rail of supporting rack, by being arranged on supporting rack The lifting motor control crossbeam of side moves up and down, and the hanger connection is suspended on crossbeam, and cathode rotation is connected with below hanger Rotation mechanism, the cathode rotating mechanism include revoluting motor, spinning motor, gear and plating piece fixture, and plating piece fixture is uniformly distributed At one week of gear, and follow the rotation of gear and rotate, described plating piece one end is individually held in plating piece fixture, other end leaching Not in the electroplating bath of plating solution is filled, the anode is arranged on the side and bottom surface of electroplating bath.
  2. A kind of 2. electroplating bath cathode moving device rotated and move back and forth according to claim 1, it is characterised in that: Heating stirrer is further included, the heating stirrer is magnetic force heating stirrer, and is arranged on the trench bottom of electroplating bath.
  3. A kind of 3. electroplating bath cathode moving device rotated and move back and forth according to claim 1, it is characterised in that: The electroplating bath uses circular configuration.
  4. A kind of 4. electroplating bath cathode moving device rotated and move back and forth according to claim 1, it is characterised in that: The anode is oppositely arranged on electroplating bath side, and anode away from bottom surface apart from identical.
CN201711338593.2A 2017-12-14 2017-12-14 A kind of electroplating bath cathode moving device rotated and move back and forth Pending CN107974704A (en)

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CN201711338593.2A CN107974704A (en) 2017-12-14 2017-12-14 A kind of electroplating bath cathode moving device rotated and move back and forth

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CN201711338593.2A CN107974704A (en) 2017-12-14 2017-12-14 A kind of electroplating bath cathode moving device rotated and move back and forth

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109023489A (en) * 2018-08-28 2018-12-18 杨胜 A kind of metallic cover type composite granule preparation facilities
CN110129867A (en) * 2019-06-26 2019-08-16 王宏斌 A kind of electroplating device
CN110257882A (en) * 2019-06-26 2019-09-20 高国有 Overcritical composite plating drill bit for machining and application method based on swap cathode
CN110389257A (en) * 2019-08-29 2019-10-29 电子科技大学 A kind of production method for the integrating device and embedded resistors that embedded resistors are monitored online
CN110438538A (en) * 2018-08-22 2019-11-12 盛青永致半导体设备(苏州)有限公司 A kind of electroplanting device and electro-plating method
CN111074211A (en) * 2020-01-15 2020-04-28 苏州东福来机电科技有限公司 Electrosilvering equipment
CN111206274A (en) * 2018-11-22 2020-05-29 成都飞机工业(集团)有限责任公司 Electroplating system for revolving body workpiece
CN111455435A (en) * 2020-05-20 2020-07-28 韦耀峰 Iron metal batch plating device capable of realizing complete plating function
CN112226806A (en) * 2020-09-29 2021-01-15 西安微电子技术研究所 Plating device capable of moving back and forth and rotating horizontally synchronously
CN112725867A (en) * 2020-12-23 2021-04-30 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Working method of rotary shearing mechanism for stirring plating solution in horizontal film-coating spray cup of wafer
CN114182326A (en) * 2021-12-28 2022-03-15 太仓德丰五金制品有限公司 Electroplating equipment and process for pearl-color composite coating of automobile part
CN114481272A (en) * 2022-02-21 2022-05-13 无锡星亿智能环保装备股份有限公司 Rotary electroplating device
CN115044955A (en) * 2022-05-06 2022-09-13 马鞍山恒诺机械有限公司 Electroplating coloring mechanism for producing pneumatic knife rest of splitting machine

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CN2288189Y (en) * 1996-12-03 1998-08-19 张友富 Supporter creeping lift mechanism for ring partition plating bath
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CN2288189Y (en) * 1996-12-03 1998-08-19 张友富 Supporter creeping lift mechanism for ring partition plating bath
CN101358375A (en) * 2008-09-05 2009-02-04 深圳市宇阳科技发展有限公司 Handling arrangement of end head of micro chip component
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CN204151446U (en) * 2014-10-13 2015-02-11 广州市百达信工贸有限公司 Line mechanism is turned without the reciprocating hanger of hanger
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110438538A (en) * 2018-08-22 2019-11-12 盛青永致半导体设备(苏州)有限公司 A kind of electroplanting device and electro-plating method
CN110438538B (en) * 2018-08-22 2024-02-20 盛青永致半导体设备(苏州)有限公司 Electroplating device and electroplating method
CN109023489A (en) * 2018-08-28 2018-12-18 杨胜 A kind of metallic cover type composite granule preparation facilities
CN111206274A (en) * 2018-11-22 2020-05-29 成都飞机工业(集团)有限责任公司 Electroplating system for revolving body workpiece
CN110129867A (en) * 2019-06-26 2019-08-16 王宏斌 A kind of electroplating device
CN110257882A (en) * 2019-06-26 2019-09-20 高国有 Overcritical composite plating drill bit for machining and application method based on swap cathode
CN110389257A (en) * 2019-08-29 2019-10-29 电子科技大学 A kind of production method for the integrating device and embedded resistors that embedded resistors are monitored online
CN111074211A (en) * 2020-01-15 2020-04-28 苏州东福来机电科技有限公司 Electrosilvering equipment
CN111455435A (en) * 2020-05-20 2020-07-28 韦耀峰 Iron metal batch plating device capable of realizing complete plating function
CN112226806A (en) * 2020-09-29 2021-01-15 西安微电子技术研究所 Plating device capable of moving back and forth and rotating horizontally synchronously
CN112725867A (en) * 2020-12-23 2021-04-30 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Working method of rotary shearing mechanism for stirring plating solution in horizontal film-coating spray cup of wafer
CN114182326A (en) * 2021-12-28 2022-03-15 太仓德丰五金制品有限公司 Electroplating equipment and process for pearl-color composite coating of automobile part
CN114481272A (en) * 2022-02-21 2022-05-13 无锡星亿智能环保装备股份有限公司 Rotary electroplating device
CN115044955A (en) * 2022-05-06 2022-09-13 马鞍山恒诺机械有限公司 Electroplating coloring mechanism for producing pneumatic knife rest of splitting machine

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