CN210560862U

CN210560862U - Device for electroplating electronic element

Info

Publication number: CN210560862U
Application number: CN201920987400.4U
Authority: CN
Inventors: 王晓军
Original assignee: Fuhang Intelligent Technology Tianjin Co Ltd
Current assignee: Fuhang Intelligent Technology Tianjin Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-05-19
Anticipated expiration: 2029-06-28

Abstract

The utility model discloses a device for electroplating electronic elements, which relates to the technical field of electronic element electroplating, and comprises an electroplating pool, wherein the upper surface of the electroplating pool is fixedly provided with a motor support, the lower part of a bevel gear is fixedly connected with a first rotating shaft, two sides of the first rotating shaft are fixedly provided with a stirring device, the surface of the stirring device is fixedly provided with electronic elements, the upper surface of the electroplating pool is fixedly provided with a power supply, the electroplating pool is internally and fixedly provided with a fixing device, the electroplating pool is internally provided with a clamping groove, the fixing device is internally embedded with an anode plate, the anode plate can be effectively replaced by arranging the fixing device, the number of the fixing device is symmetrically provided with 2, the anode sleeve can be fixed by the expansion and contraction of a spring between a first clamping plate and a second clamping plate, and the distance between the anode plate and the cathode plate is far, prevent the collision of the anode plate and the cathode plate, which causes implosion and damages to electronic elements.

Description

Device for electroplating electronic element

Technical Field

The utility model relates to an electronic component electroplates technical field, specifically is an electronic component electroplates and uses device.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.

However, when electronic components are plated, a plurality of electronic components cannot be plated, plating solution is also lost during plating, metal ions in the plating solution cannot be replenished by a general stirring method, an anode made of a plating metal cannot be fixed, and the rotating electronic components may collide with the anode to cause damage to the electronic components. Accordingly, one skilled in the art provides an apparatus for electroplating electronic components to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic component electroplates and uses device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides an electronic component electroplates and uses device, includes the electroplating bath, the last fixed surface of electroplating bath installs the motor support, and the below welding of electroplating bath has the universal wheel, the inside fixed mounting of motor support has the motor, the one end fixedly connected with second rotation axis of motor, conical gear has been cup jointed to the outside of second rotation axis, the first rotation axis of below fixedly connected with of conical gear, the both sides fixed mounting of first rotation axis has agitating unit, agitating unit's fixed surface installs electronic component, the last fixed surface of electroplating bath is provided with the power, and the inside fixed mounting of electroplating bath has fixing device, the draw-in groove has been seted up to the inside of electroplating bath, fixing device's inside embedding installs the anode plate.

As a further aspect of the present invention: fixing device includes card sheath, fixed plate, spring, positive pole cover, first splint, head rod, slider, spout and second splint, the welding of one side of fixed plate has the card sheath, and the surface of fixed plate has seted up the spout, the inside movable mounting of spout has the slider, the welding of one end of slider has the head rod, the one end fixed mounting of head rod has first splint, one side of first splint is fixed and is provided with the spring, and one side of first splint is close to the one end fixed mounting of spring has the second splint, one side of spring is fixed and is provided with positive pole cover.

As a further aspect of the present invention: the second clamping plate and the first clamping plate are arranged in parallel.

As a further aspect of the present invention: the sliding groove slides with the sliding block and the first connecting rod respectively, and the sliding groove is of a T-shaped structure.

As a further aspect of the present invention: agitating unit includes stirring leaf, electroplating hanger, second connecting rod and third connecting rod, the welding of the top of second connecting rod has the stirring leaf, and the one end welding of second connecting rod has the third connecting rod, the welding has electroplating hanger around the stirring leaf.

As a further aspect of the present invention: the third connecting rod is perpendicular to the second connecting rod, and the stirring leaf is of a structure shaped like a Chinese character 'tian'.

As a further aspect of the present invention: the electroplating hanger is provided with 8, and the electroplating hanger evenly distributed is around the stirring leaf.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through setting up fixing device, can effectually change the anode plate, and the fixing device symmetry is provided with 2, can fix the positive pole cover through the spring is flexible between first splint and the second splint, and the anode plate is far away with electronic component's distance, prevents that anode plate and electronic component from colliding, causes the implosion, causes the damage to electronic component.

2. Through setting up agitating unit, can effectually carry out abundant stirring with the plating solution, make near metal ion that the negative pole consumed obtain in time supply and reduce the concentration polarization of negative pole, and stir the leaf and set up to field font, the electroplating hanger can hang on stirring the leaf, can electroplate a plurality of electronic component.

Drawings

FIG. 1 is a schematic structural view of an apparatus for electroplating electronic components;

FIG. 2 is a schematic view of a fixing device of an apparatus for electroplating electronic components;

FIG. 3 is a schematic view showing a stirring apparatus in an apparatus for electroplating an electronic component.

In the figure: 1. a power source; 2. a first rotating shaft; 3. a motor support; 4. a motor; 5. a second rotation shaft; 6. a bevel gear; 7. an anode plate; 8. a fixing device; 9. an electroplating pool; 10. a universal wheel; 11. a stirring device; 12. an electronic component; 13. a card slot; 81. sheathing; 82. a fixing plate; 83. a spring; 84. an anode sleeve; 85. a first splint; 86. a first connecting rod; 87. a slider; 88. a chute; 89. a second splint; 111. stirring blades; 112. electroplating a hanger; 113. a second connecting rod; 114. and a third connecting rod.

Detailed Description

Referring to fig. 1 to 3, in an embodiment of the present invention, an apparatus for electroplating an electronic component includes an electroplating bath 9, a motor support 3 is fixedly installed on an upper surface of the electroplating bath 9, a universal wheel 10 is welded below the electroplating bath 9, a motor 4 is fixedly installed inside the motor support 3, one end of the motor 4 is fixedly connected to a second rotating shaft 5, a bevel gear 6 is sleeved outside the second rotating shaft 5, a first rotating shaft 2 is fixedly connected below the bevel gear 6, stirring devices 11 are fixedly installed on two sides of the first rotating shaft 2, each stirring device 11 includes a stirring blade 111, an electroplating hanger 112, a second connecting rod 113 and a third connecting rod 114, the stirring blade 111 is welded above the second connecting rod 113, a third connecting rod 114 is welded at one end of the second connecting rod 113, an electroplating hanger 112 is welded around the stirring blade 111, the third connecting rod 114 is perpendicular to the second connecting rod 113, stirring leaf 111 is field font structure, it is provided with 8 to electroplate hanger 112, and electroplate hanger 112 evenly distributed is around stirring leaf 111, open when motor 4 and drive first rotation axis 2 and rotate, first rotation axis 2 drives second connecting rod 113 and third connecting rod 114 and rotates, be provided with stirring leaf 111 on the second connecting rod 113, thereby it rotates to drive stirring leaf 111, it can regard electronic component 12 as the negative plate to set up electroplating hanger 112 on stirring leaf 111, agitating unit 11 can effectually carry out abundant stirring with the plating solution, the metal ion that makes near negative pole consumption obtains in time to supply and reduces the concentration polarization of negative pole.

In fig. 2: the surface of the stirring device 11 is fixedly provided with an electronic element 12, the upper surface of the electroplating pool 9 is fixedly provided with a power supply 1, the interior of the electroplating pool 9 is fixedly provided with a fixing device 8, the interior of the electroplating pool 9 is provided with a clamping groove 13, the interior of the fixing device 8 is embedded with an anode plate 7, the fixing device 8 comprises a clamping sheath 81, a fixing plate 82, a spring 83, an anode sleeve 84, a first clamping plate 85, a first connecting rod 86, a sliding block 87, a sliding groove 88 and a second clamping plate 89, one side of the fixing plate 82 is welded with the clamping sheath 81, the surface of the fixing plate 82 is provided with the sliding groove 88, the sliding block 87 is movably arranged in the sliding groove 88, one end of the sliding block 87 is welded with the first connecting rod 86, one end of the first connecting rod 86 is fixedly provided with the first clamping plate 85, one side of the first clamping plate 85 is fixedly provided with the spring 83, the fixed positive pole cover 84 that is provided with in one side of spring 83, second splint 89 and first splint 85 parallel arrangement, spout 88 slides with slider 87 and head rod 86 respectively, and spout 88 is T font structure, install the embedding of card sheath 81 in draw-in groove 13, slide in spout 88 first splint 85 and second splint 89 through the slider 87 that the bottom set up, and the spring 83 in first splint 85 and the second splint 89 takes place to deform, make first splint 85 and the expansion of second splint 89, place positive pole cover 84 the middle part of first splint 85 and second splint 89 and press from both sides tightly fixedly, effectual positive plate 7 separates with electronic component 12, prevent that positive plate 7 and electronic component 12 from colliding, cause the implosion, cause the damage to electronic component 12.

The utility model discloses a theory of operation is: when an electronic element 12 is electroplated, the electronic element 12 is used as a cathode and placed on an electroplating hanger 112, the anode of a power supply 1 is connected with an anode plate 7, the cathode of the power supply 1 is connected with the electronic element 12, electroplating solution is placed in an electroplating pool 9, when a motor 4 on a motor support 3 starts to work, the output end of the motor 4 drives a second rotating shaft 5 to rotate, a bevel gear 6 is installed on the second rotating shaft 5 and can drive a first rotating shaft 2 to rotate when the second rotating shaft 5 rotates, a stirring device 11 is arranged on one side of the first rotating shaft 2, the first rotating shaft 2 drives a second connecting rod 113 and a third connecting rod 114 in the stirring device 11 to rotate, a stirring blade 111 is arranged on the second connecting rod 113 so as to drive the stirring blade 111 to rotate, the electroplating hanger 112 is arranged on the stirring blade 111 and can use the electronic element 12 as a cathode plate, the stirring device 11 can effectively and fully stir the electroplating solution, so that the metal ions consumed near the cathode can be timely supplemented and the concentration polarization effect of the cathode can be reduced, the electronic element 12 can be fully electroplated, a fixing device 8 is arranged in the electroplating pool 9, a clamping sheath 81 in the fixing device 8 is embedded in the clamping groove 13, a first clamping plate 85 and a second clamping plate 89 slide in a sliding groove 88 through a sliding block 87 arranged at the bottom, and the springs 83 in the first clamping plate 85 and the second clamping plate 89 deform to expand the first clamping plate 85 and the second clamping plate 89, and the anode sleeve 84 is placed in the middle parts of the first clamping plate 85 and the second clamping plate 89 to clamp and fix, so as to effectively separate the anode plate 7 from the electronic element 12, prevent the anode plate 7 from colliding with the electronic element 12 to cause implosion, causing damage to the electronic components 12 and thus completing the plating of the plurality of electronic components 12.

The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The device for electroplating the electronic element comprises an electroplating pool (9) and is characterized in that a motor support (3) is fixedly arranged on the upper surface of the electroplating pool (9), universal wheels (10) are welded below the electroplating pool (9), a motor (4) is fixedly arranged inside the motor support (3), a second rotating shaft (5) is fixedly connected to one end of the motor (4), a bevel gear (6) is sleeved outside the second rotating shaft (5), a first rotating shaft (2) is fixedly connected below the bevel gear (6), stirring devices (11) are fixedly arranged on two sides of the first rotating shaft (2), the electronic element (12) is fixedly arranged on the surface of the stirring devices (11), a power supply (1) is fixedly arranged on the upper surface of the electroplating pool (9), and a fixing device (8) is fixedly arranged inside the electroplating pool (9), a clamping groove (13) is formed in the electroplating pool (9), and an anode plate (7) is embedded in the fixing device (8).

2. The device for electroplating the electronic component according to claim 1, wherein the fixing device (8) comprises a clamping sheath (81), a fixing plate (82), a spring (83), an anode sleeve (84), a first clamping plate (85), a first connecting rod (86), a sliding block (87), a sliding groove (88) and a second clamping plate (89), the clamping sheath (81) is welded on one side of the fixing plate (82), the sliding groove (88) is formed in the surface of the fixing plate (82), the sliding block (87) is movably installed inside the sliding groove (88), the first connecting rod (86) is welded on one end of the sliding block (87), the first clamping plate (85) is fixedly installed on one end of the first connecting rod (86), the spring (83) is fixedly arranged on one side of the first clamping plate (85), and the second clamping plate (89) is fixedly installed on one end, close to the spring (83), of one side of the first clamping plate (85), and an anode sleeve (84) is fixedly arranged on one side of the spring (83).

3. An apparatus for plating electronic components according to claim 2, wherein said second holding plate (89) is disposed in parallel with said first holding plate (85).

4. An apparatus as claimed in claim 2, wherein the slide groove (88) slides with the slide block (87) and the first connecting rod (86), and the slide groove (88) has a T-shaped structure.

5. The device for electroplating the electronic component as claimed in claim 1, wherein the stirring device (11) comprises a stirring blade (111), an electroplating hanger (112), a second connecting rod (113) and a third connecting rod (114), the stirring blade (111) is welded above the second connecting rod (113), the third connecting rod (114) is welded at one end of the second connecting rod (113), and the electroplating hanger (112) is welded around the stirring blade (111).

6. The apparatus as claimed in claim 5, wherein said third connecting bar (114) is perpendicular to said second connecting bar (113), and said stirring blade (111) has a rectangular structure.

7. The device for electroplating an electronic component according to claim 5, wherein the number of the electroplating hangers (112) is 8, and the electroplating hangers (112) are uniformly distributed around the stirring blade (111).