CN114561683A

CN114561683A - Side-push covering type wafer semiconductor electroplating clamp

Info

Publication number: CN114561683A
Application number: CN202210254642.9A
Authority: CN
Inventors: 汪翼凡
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-03-15
Filing date: 2022-03-15
Publication date: 2022-05-31

Abstract

The invention relates to the technical field of electroplating clamping of a wafer semiconductor, in particular to a side-push covering type wafer semiconductor electroplating clamp. The clamping device comprises a positioning device and a plurality of clamping devices arranged on the positioning device, wherein a plurality of pressing devices are arranged on the lower side of the positioning device. The bottom bearing pad is contacted with the surface of the wafer, so that the bottom bearing pad bears the wafer, the round balls on the bottom bearing pad are in circuit connection with the wafer, the wafer is convenient to electroplate, the lower pressing pad presses the upper surface of the wafer, the position of the wafer is fixed, the situation that the wafer surface is scratched when the wafer is positioned by using a pressing pin is avoided, the edge of the wafer is positioned by pressing the bottom bearing pad and the lower pressing pad, and the electroplating effect on the surface of the wafer cannot be influenced when the wafer is clamped by the arranged net-shaped structure.

Description

Side-push covering type wafer semiconductor electroplating clamp

Technical Field

The invention relates to the technical field of wafer semiconductor electroplating clamping, in particular to a side-push covering type wafer semiconductor electroplating clamp.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, is called a wafer because the shape of the wafer is circular, various circuit element structures can be manufactured on the silicon wafer to form an IC product with a specific electric property function, electroplating treatment is usually needed in the production process of the wafer to form various metal layers on the surface of the wafer, namely, the wafer is connected with an electric element, during electroplating, an electroplating clamp is used for clamping the wafer to ensure the electric conduction of the wafer, the wafer is placed in electroplating solution, a voltage cathode is applied to a thin metal layer which is manufactured on the wafer in advance, a voltage anode is applied to a soluble or insoluble anode, and metal ions in the electroplating solution are deposited on the surface of the wafer through the action of an electric field.

At present when electroplating and pressing from both sides centre gripping wafer, in order to make the wafer circular telegram, can use the tucking to carry out repressing the wafer and circular telegram, but the tip of tucking is comparatively sharp, when repressing the wafer, very easy to wafer surface fish tail, make the wafer after the electroplating unable normal use, simultaneously for once only electroplate a plurality of wafers, the device of a plurality of wafers of disposable shell electroplating has appeared, but when electroplating, the confined shell can influence the electroplating effect of wafer, make the edge of wafer unable by electroplating, make the later stage when using the wafer, the edge of wafer need carry out solitary getting rid of, and when solitary getting rid of, damage the wafer easily, extravagant material, reduce the output of wafer.

Disclosure of Invention

The present invention is directed to a side-push cover type wafer semiconductor electroplating fixture to solve the above-mentioned problems.

In order to achieve the purpose, the side-push covering type wafer semiconductor electroplating clamp comprises a position adjusting device and a plurality of clamping devices arranged on the position adjusting device, wherein the lower side of the position adjusting device is provided with a plurality of pressing devices, the position adjusting device comprises a hanging device used for hanging and a rotating device arranged on the hanging device and close to the upper end and the lower end of the hanging device, the hanging device comprises a hanging plate used for positioning, the lower side of the hanging plate is in threaded connection with a connecting rod, the upper end and the lower end of the connecting rod are in threaded connection with a connecting head, the rotating device comprises an upper rotating plate, a middle rotating plate and a lower rotating plate which are sequentially arranged from top to bottom, the upper rotating plate, the middle rotating plate and the lower rotating plate are rotatably sleeved on the connecting head, fixing rods are fixed on the side walls of the upper rotating plate, the middle rotating plate and the lower rotating plate, and the clamping devices comprise driving rods arranged between the fixing rods, the wafer pressing device comprises a pressing device and is characterized in that a plurality of bearing plates are fixedly connected to one side of the driving rod, every two adjacent bearing plates are in a group, a bottom bearing pad is fixed on one group of the bearing plates and located on the lower side, the pressing device comprises a bottom plate arranged on the upper side of the bearing plates, a plurality of pressing pads are fixed on the lower side of the bottom plate in an annular arrangement mode, and the bottoms of the pressing pads and the upper sides of the bearing plates are in surface contact with wafers.

As a further improvement of the technical scheme, two pin columns are symmetrically fixed at the bottoms of the upper rotating plate and the middle rotating plate, two arc grooves are symmetrically formed in the middle rotating plate and the lower rotating plate, and one ends of the pin columns are inserted in the arc grooves in a sliding mode.

As a further improvement of the technical scheme, a sliding plate is fixed on the upper side of the bottom plate, and a spring is sleeved on the sliding plate between the bottom plate and the bearing plate.

As a further improvement of the technical scheme, the upper side of the bottom bearing pad is horn-shaped, a round ball is arranged at the center of the bottom bearing pad, the bottom of the lower pressing pad is a hollow ball body, and the bottom bearing pad and the lower pressing pad are both of a reticular metal wire structure.

As a further improvement of the technical scheme, a rotating frame is arranged on the bearing plate in a sliding mode and rotates on the bearing plate, the upper end of the sliding plate is fixedly inserted into the rotating frame, one end of the rotating frame is hinged with a connecting plate, and a plurality of circular middle rings are arranged between the connecting plates.

As a further improvement of the technical solution, a side slot for the connection plate to rotate is formed in the side wall of the middle ring, and one end of the connection plate penetrates through the side slot and extends into the middle ring.

As a further improvement of the technical scheme, a plurality of baffle rings are fixed on the connecting rod along the length direction of the connecting rod, one end of the connecting rod penetrates through the middle ring, and the top of each baffle ring is contacted with the bottom of the middle ring.

As a further improvement of the technical scheme, a position adjusting sliding groove is formed in the side wall, far away from one end of the rotating frame, of the connecting plate, a pin is connected to the side slot in a threaded mode, and one end of the pin penetrates through the position adjusting sliding groove and is connected to the side wall of the middle ring in a threaded mode.

As a further improvement of the technical scheme, the sliding grooves are formed in the two ends of the driving rod, the limiting grooves matched with the sliding grooves are formed in one ends of the fixing rods, and one ends of the fixing rods are inserted into the sliding grooves in an inserting mode.

As a further improvement of the technical scheme, a sliding attaching block is arranged on the upper side of the sliding groove, a pressing nail in threaded connection with the driving rod is arranged on the attaching block, and one side of the attaching block is in contact with the side wall of the fixing rod.

Compared with the prior art, the invention has the beneficial effects that:

1. in the side-push covering type wafer semiconductor electroplating clamp, the bottom bearing pad is contacted with the surface of the wafer through the arranged bottom bearing pad, so that the bottom bearing pad bears the wafer, the round ball on the bottom bearing pad is connected with the wafer through a circuit, the wafer is conveniently electroplated, the pressing pad presses the upper surface of the wafer, the position of the wafer is fixed, the situation that the wafer is scratched by using a pressing pin to position the wafer when the wafer is positioned is avoided, and the wafer which is electroplated can be normally used.

2. In the side-push covering type wafer semiconductor electroplating clamp, the bottom bearing pad and the lower pressing pad are arranged to press the edge of the wafer, so that the edge of the wafer is positioned, and the bottom bearing pad and the lower pressing pad can not influence the electroplating effect on the surface of the wafer when clamping the wafer through the arranged net structure, so that the wafer can not influence the division of the wafer after the electroplating is finished, the normal use of the edge of the wafer is ensured, and the waste of materials is reduced.

3. In this side pushes away overlay type wafer semiconductor electroplating fixture, it makes the lower pressure pad that carries out the centre gripping to same wafer to move up simultaneously to drive the connecting plate through the zhonghuan that sets up, so that placing and taking off of wafer, it rotates to drive clamping device through the rotary device who sets up simultaneously, make when placing the wafer, the device can not cause the influence to placing of wafer, and by the connecting plate respectively with the swivel mount, the zhonghuan is connected, carry out spacing fixed to the position that the clamping device removed, in order to guarantee the device when centre gripping wafer, the condition that the wafer dropped can not appear, guarantee the stability that the wafer was electroplated.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural diagram of a positioning device according to the present invention;

FIG. 3 is a schematic view of the suspension of the present invention;

FIG. 4 is a schematic diagram of an exploded structure of a rotary device of the present invention;

FIG. 5 is a schematic view of a partially assembled structure of the clamping device and the hold-down device of the present invention;

FIG. 6 is a schematic view of a clamping device according to the present invention;

FIG. 7 is an enlarged view of the structure at A in FIG. 5;

FIG. 8 is an enlarged view of the structure at B of FIG. 6;

FIG. 9 is a schematic view of the pressing device of the present invention;

FIG. 10 is a schematic view of a portion of the hold-down device of the present invention;

fig. 11 is an exploded view of a portion of the hold-down device of the present invention.

The various reference numbers in the figures mean:

1. a position adjusting device; 11. a suspension device; 111. hanging plates; 112. a connecting rod; 113. a connector; 114. a baffle ring; 12. a rotating device; 121. an upper rotating plate; 122. a middle rotary plate; 123. a lower rotary plate; 124. a pin; 125. fixing the rod; 126. a limiting groove; 127. an arc groove;

2. a clamping device; 21. driving the rod; 22. a carrier plate; 23. a bottom support pad; 24. a chute; 25. fitting blocks; 26. pressing the nail downwards;

3. a pressing device; 31. a middle ring; 311. a side slot; 32. a connecting plate; 321. a positioning chute; 33. a rotating frame; 34. a slide plate; 35. a base plate; 36. a lower pressure pad; 37. a spring; 38. a pin.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Example 1

Referring to fig. 1 to 11, the present embodiment provides a side-push covering type wafer semiconductor electroplating jig, which includes a positioning device 1 and a plurality of clamping devices 2 disposed on the positioning device 1, wherein a plurality of pressing devices 3 are disposed on a lower side of the positioning device 1, the positioning device 1 includes a suspension device 11 for suspending and a rotation device 12 disposed on the suspension device 11 near an upper end and a lower end, the suspension device 11 includes a hanging plate 111 for positioning, a connecting rod 112 is screwed on a lower side of the hanging plate 111, a connector 113 is screwed on an upper end and a lower end of the connecting rod 112, the rotation device 12 includes an upper rotation plate 121, a middle rotation plate 122 and a lower rotation plate 123 sequentially disposed from top to bottom, the upper rotation plate 121, the middle rotation plate 122 and the lower rotation plate 123 are rotatably sleeved on the connector 113, fixing rods 125 are fixed on sidewalls of the upper rotation plate 121, the middle rotation plate 122 and the lower rotation plate 123, the clamping device 2 comprises a driving rod 21 arranged between fixed rods 125, one side of the driving rod 21 is fixedly connected with a plurality of bearing plates 22, every two adjacent bearing plates 22 form a group, a bottom bearing pad 23 is fixed on the group of bearing plates 22 positioned on the lower side, the pressing device 3 comprises a bottom plate 35 arranged on the upper side of the bearing plates 22, a plurality of pressing pads 36 are annularly arranged and fixed on the lower side of the bottom plate 35, the bottoms of the pressing pads 36 and the upper sides of the bearing plates 22 are in contact with the surface of a wafer, the upper side of the bottom bearing pad 23 is horn-shaped, a ball is arranged at the center, the bottom of the pressing pad 36 is a hollow ball, and the bottom bearing pad 23 and the pressing pad 36 are both of a mesh metal wire structure;

go up the equal centrosymmetry in bottom of spiral plate 121 and well spiral plate 122 and be fixed with two round pin posts 124, well spiral plate 122 and spiral plate 123 down on equal centrosymmetry seted up two arc grooves 127, the one end of round pin post 124 slides and pegs graft in the inside of arc groove 127, the both ends of drive pole 21 have all seted up spout 24, the spacing groove 126 with 24 looks adaptations of spout is seted up to the one end of dead lever 125, the one end of dead lever 125 is pegged graft in spout 24.

In this embodiment, when the clamping device 2 and the pressing device 3 are used, the upper rotating plate 121, the middle rotating plate 122 and the lower rotating plate 123 are rotated, so that the clamping device 2 is driven by the upper rotating plate 121, the middle rotating plate 122 and the lower rotating plate 123 to rotate, the pins 124 rotate in the arc grooves 127, when the upper rotating plate 121 rotates 240 ° and the middle rotating plate 122 rotates 120 °, the pins 124 all move to the other end of the arc grooves 127, the three fixing rods 125 are uniformly spread, the uniformly spread fixing rods 125 drive the clamping devices 2 to be uniformly arranged around the suspension device 11, a wafer to be electroplated is placed among the three clamping devices 2, so that the lower surface of the wafer contacts with the upper side of the bottom bearing pad 23, the metal mesh bottom bearing pad 23 is electrically connected with the wafer, thereby avoiding damage to the wafer surface by pressing, ensuring normal electroplating of the wafer, and the pressing pad 36 presses the upper side of the wafer, so that the wafer is clamped between the bottom bearing pad 23 and the pressing pad 36, the position of the wafer is fixed, so that the wafer is prevented from falling in the electroplating process, and the electroplating effect of the wafer is ensured.

In order to make the pressing pad 36 and the wafer surface fit compactly, the upper side of the bottom plate 35 is fixed with a sliding plate 34, the sliding plate 34 between the bottom plate 35 and the bearing plate 22 is sleeved with a spring 37, the bottom plate 35 drives the pressing pad 36 to be in close contact with the wafer through the pushing of the spring 37 to the bottom plate 35, the stability of clamping the wafer is improved, and the stability of wafer electroplating is ensured.

In order to move up a plurality of lower pressure pads 36 holding the same wafer at the same time so as to facilitate the installation and removal of the wafer, a rotating frame 33 is slidably disposed on the support plate 22, and the rotating frame 33 rotates on the support plate 22, the upper end of the sliding plate 34 is fixedly inserted inside the rotating frame 33, one end of the rotating frame 33 is hinged with a connecting plate 32, and a circular middle ring 31 is disposed between the connecting plates 32, the connecting plate 32 is driven to move up by the middle ring 31, the connecting plate 32 moves up by pulling the rotating frame 33, the lower pressure pads 36 are driven to be away from the bottom support pads 23, so that the side edges of the wafer are placed between the bottom support pads 23 and the lower pressure pads 36, and after the wafer is placed, the lower pressure pads 36 are matched with the bottom support pads 23 to hold and position the wafer by the springs 37 pushing the bottom support pads 23.

In order to make the fixing rod 125 move to drive the clamping device 2, the side wall of the middle ring 31 is provided with a side slot 311 for the connecting plate 32 to rotate, one end of the connecting plate 32 penetrates through the side slot 311 and extends to the inside of the middle ring 31, the side wall of the connecting plate 32 far away from one end of the rotating frame 33 is provided with a positioning sliding slot 321, a pin 38 is connected to the side slot 311 in a threaded manner, one end of the pin 38 penetrates through the positioning sliding slot 321 and is connected to the side wall of the middle ring 31 in a threaded manner, when the fixing rod 125 rotates, the connecting plate 32 slides in the side slot 311, the pin 38 slides in the positioning sliding slot 321, and when in sliding, one end of the connecting plate 32 rotates in the side slot 311, so that the plurality of clamping devices 2 are close to each other, thereby facilitating the carrying and moving of the device, and when the clamping devices 2 are unfolded to clamp the wafer, the middle ring 31 drives the connecting plate 32 to limit the positions of the plurality of clamping devices 2, when the device clamps the wafer, the clamping device 2 can not move, and the stability of clamping the wafer by the device is ensured.

In order to prevent the middle ring 31 from sinking when the connecting plate 32 is driven, a plurality of baffle rings 114 are fixed on the connecting rod 112 along the length direction of the connecting rod 112, one end of the connecting rod 112 penetrates through the middle ring 31, the top of the baffle ring 114 is contacted with the bottom of the middle ring 31, the middle ring 31 is stably slid on the connecting rod 112 by limiting the position of the middle ring 31 by the baffle rings 114, the situation that the connecting plate 32 is bent due to the fact that the middle ring 31 pulls the connecting plate 32 due to gravity is avoided, and the use stability of the pushing device 3 is ensured.

In order to enable the clamping device 2 to move on the fixing rod 125, a plurality of clamping devices 2 are used for clamping and electroplating wafers with different sizes, a sliding attaching block 25 is arranged on the upper side of the sliding groove 24, a pressing nail 26 in threaded connection with the driving rod 21 is arranged on the attaching block 25, one side of the attaching block 25 is in contact with the side wall of the fixing rod 125, the driving rod 21 is enabled to stably move on the fixing rod 125 through the matching of the sliding groove 24 and the limiting groove 126, meanwhile, the attaching block 25 is driven by the pressing nail 26 to be attached to the side wall of the fixing rod 125, and the position of the clamping device 2 is enabled to be fixed, so that the clamping device 2 and the pressing device 3 can stably clamp the wafers.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a side pushes away overlay type wafer semiconductor electroplating jig, includes positioning device (1) and sets up a plurality of clamping device (2) on positioning device (1), the downside of positioning device (1) is provided with a plurality of and pushes down device (3), its characterized in that: the positioning device (1) comprises a hanging device (11) used for hanging and a rotating device (12) arranged on the hanging device (11) and close to the upper end and the lower end, the hanging device (11) comprises a hanging plate (111) used for positioning, a connecting rod (112) is in threaded connection with the lower side of the hanging plate (111), a connector (113) is in threaded connection with the upper end and the lower end of the connecting rod (112), the rotating device (12) comprises an upper rotating plate (121), a middle rotating plate (122) and a lower rotating plate (123) which are sequentially arranged from top to bottom, the upper rotating plate (121), the middle rotating plate (122) and the lower rotating plate (123) are rotatably sleeved on the connector (113), fixing rods (125) are fixed on the side walls of the upper rotating plate (121), the middle rotating plate (122) and the lower rotating plate (123), and the clamping device (2) comprises driving rods (21) arranged between the fixing rods (125), one side fixedly connected with a plurality of carrier plate (22) of drive pole (21), and per two adjacent carrier plate (22) be a set of, be located the downside a set of be fixed with bottom and hold pad (23) on carrier plate (22), push down device (3) including setting up bottom plate (35) at carrier plate (22) upside, the downside ring arrangement of bottom plate (35) is fixed with a plurality of and pushes down pad (36), the upside of the bottom of pushing down pad (36) and carrier plate (22) all with the surface contact of wafer.

2. The side-push cover wafer semiconductor plating jig of claim 1, wherein: two pin columns (124) are symmetrically fixed at the bottoms of the upper rotating plate (121) and the middle rotating plate (122), two arc grooves (127) are symmetrically formed in the centers of the middle rotating plate (122) and the lower rotating plate (123), and one ends of the pin columns (124) are inserted into the arc grooves (127) in a sliding mode.

3. The side-push cover wafer semiconductor plating jig of claim 1, wherein: the upper side of bottom plate (35) is fixed with slide (34), the cover is equipped with spring (37) on slide (34) between bottom plate (35) and carrier plate (22).

4. The side-push cover wafer semiconductor plating jig of claim 1, wherein: the upside of bottom bearing pad (23) is the loudspeaker form, and is provided with the ball in the position at center, the bottom of pressing pad (36) is hollow spheroid down, bottom bearing pad (23) and pressing pad (36) are netted wire structure down.

5. The side-push cover wafer semiconductor plating jig of claim 3, wherein: the bearing plate (22) is provided with a rotating frame (33) in a sliding mode, the rotating frame (33) rotates on the bearing plate (22), the upper end of the sliding plate (34) is fixedly inserted into the rotating frame (33), one end of the rotating frame (33) is hinged to a connecting plate (32), and a circular middle ring (31) is arranged between the connecting plates (32).

6. The side-push cover wafer semiconductor plating jig of claim 5, wherein: the side wall of the middle ring (31) is provided with a side slot (311) for the connecting plate (32) to rotate, and one end of the connecting plate (32) penetrates through the side slot (311) and extends into the middle ring (31).

7. The side-push cover wafer semiconductor plating jig of claim 6, wherein: a plurality of baffle rings (114) are fixed on the connecting rod (112) along the length direction of the connecting rod (112), one end of the connecting rod (112) penetrates through the middle ring (31), and the top of the baffle ring (114) is contacted with the bottom of the middle ring (31).

8. The side-push cover wafer semiconductor plating jig of claim 6, wherein: position adjusting sliding grooves (321) are formed in the side wall, far away from one end of the rotating frame (33), of the connecting plate (32), pins (38) are connected to the side inserting grooves (311) in a threaded mode, and one ends of the pins (38) penetrate through the position adjusting sliding grooves (321) and are connected to the side wall of the middle ring (31) in a threaded mode.

9. The side-push cover wafer semiconductor plating jig of claim 1, wherein: the two ends of the driving rod (21) are provided with sliding grooves (24), one end of the fixing rod (125) is provided with a limiting groove (126) matched with the sliding grooves (24), and one end of the fixing rod (125) is inserted into the sliding grooves (24).

10. The side-push cover wafer semiconductor plating jig of claim 9, wherein: the upper side of the sliding groove (24) is provided with a sliding attaching block (25), the attaching block (25) is provided with a pressing nail (26) which is connected with the driving rod (21) through threads, and one side of the attaching block (25) is in contact with the side wall of the fixing rod (125).