CN220503250U

CN220503250U - Horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp

Info

Publication number: CN220503250U
Application number: CN202321878825.4U
Authority: CN
Inventors: 匡飞传
Original assignee: Suzhou Haojingte Technology Co ltd
Current assignee: Suzhou Haojingte Technology Co ltd
Priority date: 2023-07-18
Filing date: 2023-07-18
Publication date: 2024-02-20
Anticipated expiration: 2033-07-18

Abstract

A horizontally electroplated soft contact double-sided conductive solar silicon wafer fixture, comprising: the device comprises a lower frame and an upper frame symmetrically arranged at the top of the lower frame, wherein a plurality of placing grooves are formed between the upper frame and the lower frame, a plurality of pairs of grooves are symmetrically formed between opposite side walls of the placing grooves, a pair of positioning pins are symmetrically and fixedly arranged at the top and the bottom of the grooves, a pair of springs are movably arranged on outer side walls of the positioning pins, a first end of each pair of springs is fixedly connected with each groove, and a second end of each pair of springs is connected with a pair of clamping plates; according to the horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp, the spring and the clamping plate are arranged, so that soft contact with the surface of the silicon wafer can be kept when the clamping plate fixes the silicon wafer, and the silicon wafer is prevented from being damaged under the action of external force; and the convex strips and the conductive contacts are further arranged, so that the conductive contacts of the convex strips are contacted with the surface of the silicon wafer during electroplating, and the electroplating quality is effectively improved.

Description

Horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp

Technical Field

The utility model relates to the technical field of clamps, in particular to a horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp.

Background

The solar silicon wafer is electroplated by HJT electroplating equipment during production, and the clamp and the silicon wafer are required to be kept in good contact during electroplating, so that good electroplating quality is ensured. The existing clamp is a fixed metal contact point, and the contact point is in hard contact with the silicon wafer, so that the silicon wafer is easily damaged by the clamping point, and the silicon wafer is broken. And each silicon chip is provided with a plurality of contact points, so that good contact of all the contact points cannot be ensured.

Therefore, the utility model provides a horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp which can effectively solve the problems.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art and provides a horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

a horizontally electroplated soft contact double-sided conductive solar silicon wafer fixture, comprising: the lower frame and set up symmetrically in the last frame at lower frame top, go up the frame with a plurality of standing grooves have been seted up between the lower frame, a plurality of pairs of recesses have been seted up symmetrically between the opposite lateral wall of standing groove, the top and the bottom symmetry of recess are provided with a pair of locating pin fixedly, a pair of the lateral wall of locating pin all movably is provided with a pair of spring, a pair of the first end of spring with recess fixed connection, a pair of the second end of spring is connected with a pair of splint, the splint is located through the through-hole cover the outside of locating pin, a pair of splint keep away from the one end symmetry and the fixed a pair of sand grip that is provided with of recess.

Further, the bottom of the lower frame and the top of the upper frame are symmetrically provided with conductive strips.

Further, the lower frame and the upper frame are in grid rectangular structures, and the plurality of placing grooves are uniformly formed between the lower frame and the upper frame.

Further, the conductive strips are sized and shaped to match the lower frame and the upper frame.

Further, the clamping plate is arranged in parallel with the lower frame and the upper frame.

Further, the protruding parts of the protruding strips are abutted, and the protruding parts of the protruding strips are provided with conductive contacts.

Further, a silicon wafer is arranged between the opposite convex strips, and the shape and the size of the silicon wafer are matched with those of the placing groove.

Compared with the prior art, the utility model has the following technical effects:

according to the horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp, the spring and the clamping plate are arranged, so that soft contact with the surface of the silicon wafer can be kept when the clamping plate fixes the silicon wafer, and the silicon wafer is prevented from being damaged under the action of external force; and the convex strips and the conductive contacts are further arranged, so that the conductive contacts of the convex strips are contacted with the surface of the silicon wafer during electroplating, and the electroplating quality is effectively improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp of the utility model;

FIG. 2 is an enlarged schematic view of the structure at A of the present utility model;

FIG. 3 is a schematic view of a splint according to the present utility model;

wherein the first end is disposed opposite the second end, and reference numerals include:

a lower frame 1; an upper frame 2; a conductive strip 3; a groove 4; a placement groove 5; a clamping plate 6; a spring 7; a convex strip 8; a positioning pin 9; a conductive contact 10; a through hole 11.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

The utility model is further described below with reference to the drawings and specific examples, which are not intended to be limiting.

Examples

Referring to fig. 1-3, the horizontal plating soft contact double-sided conductive solar silicon wafer clamp of the present embodiment includes: the lower frame 1 and the upper frame 2 symmetrically arranged at the top of the lower frame 1, a plurality of placing grooves 5 are formed between the upper frame 2 and the lower frame 1, a plurality of pairs of grooves 4 are symmetrically formed between opposite side walls of the placing grooves 5, a pair of positioning pins 9 are symmetrically and fixedly arranged at the top and the bottom of the grooves 4, a pair of springs 7 are movably arranged on the outer side walls of the positioning pins 9, first ends of the springs 7 are fixedly connected with the grooves 4, second ends of the springs 7 are connected with a pair of clamping plates 6, the clamping plates 6 are sleeved outside the positioning pins 9 through holes 11, and a pair of raised strips 8 are symmetrically and fixedly arranged at one ends of the clamping plates 6 far away from the grooves 4; the spring 7 contracts when the clamping plate 6 expands, and the clamping plate 6 slides along the positioning pin 9 at the moment;

the bottom of the lower frame 1 and the top of the upper frame 2 are symmetrically provided with conductive strips 3; the lower frame 1 and the upper frame 2 are in grid-shaped rectangular structures, and the plurality of placing grooves 5 are uniformly formed between the lower frame 1 and the upper frame 2; the conductive strips 3 are matched with the size and shape of the lower frame 1 and the upper frame 2; the clamping plate 6 is arranged in parallel with the lower frame 1 and the upper frame 2; the convex parts of the convex strips 8 are abutted, and conductive contacts 10 are arranged at the convex parts of the convex strips 8; a silicon wafer is arranged between the opposite convex strips 8, and the shape and the size of the silicon wafer are matched with those of the placing groove 5; the silicon chip is placed in the placing groove 5, the clamping plate 6 is pushed to be closed under the elastic force of the spring 7, and the silicon chip is fixed through the convex strips 8.

As a preferred embodiment, the conductive strip 3 is electrically connected to a power source.

When the silicon wafer clamping device is used, firstly, the clamping plates 6 oppositely arranged in the grooves 4 are separated, the springs 7 are contracted when the clamping plates 6 are opened, at this time, the clamping plates 6 slide along the positioning pins 9, then, the silicon wafer is placed in the placing grooves 5, so that the silicon wafer is positioned between the opposite clamping plates 6, the clamping plates 6 are pushed to be closed under the action of the elasticity of the springs 7, and the silicon wafer can be fixed through the opposite convex strips 8; at the moment, the raised strips 8 are in soft contact with the surface of the silicon wafer under the action of the elastic force of the springs 7, so that the silicon wafer is prevented from being damaged under the action of external force, and meanwhile, the conductive contacts 10 of the raised strips 8 are in contact with the surface of the silicon wafer, so that the electroplating quality is effectively improved; finally, a power supply is started, and the surface of the silicon wafer is subjected to electroplating treatment through the conducting strip 3 and the conducting contact 10.

In summary, according to the horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp disclosed by the utility model, the spring 7 and the clamping plate 6 are arranged, so that soft contact with the surface of the silicon wafer can be ensured when the clamping plate 6 is used for fixing the silicon wafer, and the silicon wafer is prevented from being damaged under the action of external force; and the raised strips 8 and the conductive contacts 10 are also arranged, so that the conductive contacts 10 of the raised strips 8 are contacted with the surface of the silicon wafer during electroplating, and the electroplating quality is effectively improved.

The foregoing description is only illustrative of the preferred embodiments of the present utility model and is not to be construed as limiting the scope of the utility model, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the description and illustrations of the present utility model, and are intended to be included within the scope of the present utility model.

Claims

1. A horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp is characterized by comprising: the lower frame (1) and set up symmetrically in last frame (2) at lower frame (1) top, go up frame (2) and offer a plurality of standing grooves (5) between lower frame (1), a plurality of pairs of recess (4) have been offered symmetrically between the opposite side wall of standing groove (5), the top and the bottom symmetry of recess (4) and fixedly are provided with a pair of locating pin (9), a pair of locating pin (9)'s lateral wall all movably is provided with a pair of spring (7), a pair of spring (7) first end with recess (4) fixed connection, a pair of spring (7) second end is connected with a pair of splint (6), splint (6) are located through-hole (11) cover the outside of locating pin (9), a pair of splint (6) keep away from the one end symmetry and the fixed of recess (4) are provided with a pair of sand grip (8).

2. The horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp according to claim 1, wherein the bottom of the lower frame (1) and the top of the upper frame (2) are symmetrically provided with conductive strips (3).

3. The horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp according to claim 1, wherein the lower frame (1) and the upper frame (2) are of grid-shaped rectangular structures, and a plurality of placing grooves (5) are uniformly formed between the lower frame (1) and the upper frame (2).

4. The horizontally electroplated soft contact double-sided conductive solar silicon wafer fixture according to claim 2, characterized in that the conductive strips (3) are matched to the size and shape of the lower frame (1) and the upper frame (2).

5. The horizontal plating soft contact double-sided conductive solar silicon wafer clamp according to claim 1, wherein the clamping plate (6) is arranged in parallel with the lower frame (1) and the upper frame (2).

6. The horizontal plating soft contact double-sided conductive solar silicon wafer clamp according to claim 1, wherein the protruding parts of a pair of protruding strips (8) are abutted, and the protruding parts of the protruding strips (8) are provided with conductive contacts (10).

7. The horizontal electroplating soft contact double-sided conductive solar silicon wafer clamp according to claim 1, wherein silicon wafers are arranged between the opposite convex strips (8), and the shapes and the sizes of the silicon wafers and the placing grooves (5) are matched.