CN110359079A - Electroplating clamp - Google Patents
Electroplating clamp Download PDFInfo
- Publication number
- CN110359079A CN110359079A CN201810319112.1A CN201810319112A CN110359079A CN 110359079 A CN110359079 A CN 110359079A CN 201810319112 A CN201810319112 A CN 201810319112A CN 110359079 A CN110359079 A CN 110359079A
- Authority
- CN
- China
- Prior art keywords
- fixed groove
- front cover
- hole
- geometry
- rear cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Present disclose provides a kind of electroplating clamps, comprising: front cover and rear cover；Wherein, the front cover includes: top side, side, bottom side and pass through openings；The first fixed groove and the second fixed groove are successively arranged along the front cover thickness direction on the side of the front cover, first fixed groove, the second fixed groove and pass through openings extend to bottom side from the front cover top side, first fixed groove is used to accommodate the clamping object of the fixture, and second fixed groove is for accommodating metal electrode.Disclosure electroplating clamp can support the wafer of sizes and shape, solve the consistency problem of semiconductor crystal wafer clamping, ensure that the uniformity of coated metal, improve the assembly efficiency of semiconductor crystal wafer plating.
Description
Technical field
This disclosure relates to semiconductor chip manufacturing technology field, in particular to a kind of electroplating clamp.
Background technique
Plating is exactly to go out to adhere to well in deposited on materials to be plated using electrolytic cell principle, but performance is different with material to be plated
Metal coating technology.Semiconductor devices needs to improve by plating one layer of single metallic film or alloy firm on the surface
Electric conductivity, thermal conductivity, corrosion resistance and the oxidation resistance of semiconductor material itself.When semiconductor crystal wafer is electroplated,
Since wafer itself is frangible and is not fixed easily, so need to fix material to be plated using electroplating clamp in the plating process, from
And complete the electroplating process to wafer.Often structure is complicated for existing electroplating clamp, or need according to the shape of wafer,
Quality of coating requires to select different electroplating clamps with electroplating device size.In semiconductor chip manufacturing field, generally for
The plating of different shape, different size wafers needs replacing different electroplating clamps, causes greatly loaded down with trivial details and waste.
Summary of the invention
(1) technical problems to be solved
In view of above-mentioned technical problem, the disclosure provides a kind of electroplating clamp, can support the wafer of sizes and shape,
It solves the consistency of semiconductor crystal wafer clamping, ensure that the uniformity of coated metal, improve the dress of semiconductor crystal wafer plating
With efficiency.
(2) technical solution
According to one aspect of the disclosure, a kind of electroplating clamp is provided, comprising: front cover and rear cover；Wherein, the front cover
It include: top side, side, bottom side and pass through openings；Is successively arranged along the front cover thickness direction on the side of the front cover
One fixed groove and the second fixed groove, first fixed groove, the second fixed groove and pass through openings are from the preceding caping
Side extends to bottom side, and first fixed groove is used to accommodate the clamping object of the fixture, and second fixed groove is used for
Accommodate metal electrode.
In some embodiments, the electroplating clamp further includes rear Cover Gasket；Wherein, it is covered after described and is additionally provided with third
Fixed groove, for accommodating the rear Cover Gasket.
In some embodiments, the frame structure shape of the front cover be regular geometric shapes, first fixed groove,
Second fixed groove and the pass through openings respectively surround frame structure, and the depth of first fixed groove adds second
The depth of fixed groove and the depth of pass through openings are equal to the thickness of the fixture front cover.
In some embodiments, the geometry one of the frame geometry of first fixed groove and the front cover
It causes；The size of first fixed groove is less than the frame size of the front cover, and the area of second fixed groove is less than institute
The area of the first fixed groove is stated, the area of the pass through openings is less than the area of second fixed groove.
In some embodiments, the frame structure shape of the fixture rear cover is consistent with the frame structure shape of front cover,
Outside Dimensions are identical as the frame peripheral size of the fixture front cover；The third fixed groove surrounds frame structure, with
The geometry of one fixed groove is consistent；The third fixed groove depth is less than the thickness of the fixture rear cover.
In some embodiments, the electroplating clamp further includes cushion, and shape is regular geometric shapes, center tool
There is a geometry through-hole, the shape of the geometry through-hole and the geometry of second fixed groove are consistent.
In some embodiments, the clamping object is chip, is set between the cushion and rear Cover Gasket；Before described
Lid, cushion, rear Cover Gasket and rear cover corner be provided with one or more first through hole, the perforation direction of the first through hole with
The thickness direction of the front cover is parallel, by screw sequentially pass through the front cover, cushion, rear Cover Gasket and after cover described
One through-hole is to which the chip to be fixed between the cushion and rear Cover Gasket.
In some embodiments, the electroplating clamp further includes metal electrode, an external round metal bars, the metal
Pole is integrated with metal electrode, and the diameter of pole is identical as the depth of the second fixed groove；It is also set on the side of the front cover
There is the second through-hole, the extending direction of the second through-hole is vertical with the thickness direction of the front cover, so that being embedded in the metal electrode
When second fixed groove, the pole passes through second through-hole and stretches out second through-hole.
In some embodiments, the metal electrode be three-dimensional circular, the geometry and size of metal electrode inner ring with
The geometry and size of the pass through openings are consistent, and the geometry and size of metal electrode outer ring are solid with described second
The geometry and size for determining groove are consistent.
In some embodiments, the electroplating clamp further include: stretch out block, wherein the stretching block includes: one cube
Body or cylinder body；And the cylindrical main body with the cube or cylinder body integrally connected；In the stretching block
Equipped with conducting wire via hole, the cylindrical main body for stretching out block is connected by conducting wire with the round metal bars.
(3) beneficial effect
It can be seen from the above technical proposal that disclosure electroplating clamp at least has the advantages that one of them:
(1) the electroplating clamp structure that the disclosure provides is simple, easy to assembly, improves the assembly effect of semiconductor crystal wafer plating
Rate.
(2) electroplating clamp that the disclosure provides supports the wafer of sizes and shape, solves semiconductor crystal wafer clamping
Consistency problem, ensure that the uniformity of coated metal, further improve semiconductor crystal wafer plating assembly efficiency.
Detailed description of the invention
By the way that shown in attached drawing, above and other purpose, the feature and advantage of the disclosure will be more clear.In all the attached drawings
Identical appended drawing reference indicates identical part, does not deliberately draw attached drawing by actual size equal proportion scaling, it is preferred that emphasis is show
The purport of the disclosure out.
Fig. 1 is the structural schematic diagram according to embodiment of the present disclosure fixture front cover.
Fig. 2 is the structural schematic diagram according to embodiment of the present disclosure fixture rear cover.
Fig. 3 is the structural schematic diagram according to Cover Gasket after embodiment of the present disclosure fixture.
Fig. 4 is the structural schematic diagram according to embodiment of the present disclosure furniture cushions.
Fig. 5 is the structural schematic diagram according to embodiment of the present disclosure fixture metal electrode.
Fig. 6 is the structural schematic diagram that block is stretched out according to embodiment of the present disclosure fixture.
<symbol description>
1- front cover；The first fixed groove of 101-；The second fixed groove of 102-；103- pass through openings；2- rear cover；201- third
Fixed groove；Cover Gasket after 3-；4- cushion；5- metal electrode；501- round metal bars；6- stretches out block；601- rectangular body；602-
Circular ring shape master；603- conducting wire via hole；Opening -604；104,105,202,301,401,402- through-hole.
Specific embodiment
For the purposes, technical schemes and advantages of the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
It should be noted that similar or identical part all uses identical figure number in attached drawing or specification description.It is attached
The implementation for not being painted or describing in figure is form known to a person of ordinary skill in the art in technical field.In addition, though this
Text can provide the demonstration of the parameter comprising particular value, it is to be understood that parameter is equal to corresponding value without definite, but can connect
It is similar to be worth accordingly in the error margin or design constraint received.The direction term mentioned in embodiment, for example, "upper", "lower",
"front", "rear", "left", "right" etc. are only the directions with reference to attached drawing.Therefore, the direction term used is for illustrating not to use
To limit the protection scope of the disclosure.
To realize aforementioned open purpose, present disclose provides a kind of electroplating clamps, comprising: front cover and rear cover；Wherein, described
Front cover includes: top side, side, bottom side and pass through openings；It is successively set on the side of the front cover along the front cover thickness direction
There are the first fixed groove and the second fixed groove, first fixed groove, the second fixed groove and pass through openings are before described
Caping side extends to bottom side, and first fixed groove is used to accommodate the clamping object of the fixture, second fixed groove
For accommodating metal electrode.Wherein, the clamping object can be chip (wafer).
Disclosure electroplating clamp, structure is simple, easy to use, can support that (wafer can for sizes and the wafer of shape
It is contained in the first fixed groove, can be supported and fix), solve the consistency problem of semiconductor crystal wafer clamping,
The uniformity that ensure that coated metal improves the assembly efficiency of semiconductor crystal wafer plating.
In one embodiment, the electroplating clamp includes front cover, rear cover, rear Cover Gasket, cushion, stretches out block and metal electricity
Pole.Further, the frame structure shape of the fixture front cover is regular geometric shapes, and inside includes the first fixed groove, the
Two fixed grooves and pass through openings, first fixed groove, second fixed groove and the pass through openings respectively surround
Frame structure, the preferably frame geometry of the first fixed groove and the geometry of front cover are consistent, pass through openings
Frame structure shape is regular geometric shapes.
Further, the size of first fixed groove is less than the frame size of fixture front cover, second anchor
For the area of plane of slot less than the area of plane of the first fixed groove, the area of plane of the pass through openings is slightly less than the second anchor
The depth of the area of plane of slot, first fixed groove and second fixed groove is respectively less than the thickness of the fixture front cover
Degree.
Further, the depth of first fixed groove adds the pass through openings plus the depth of the second fixed groove
Depth be exactly equal to the thickness of the fixture front cover.
Further, there is a through-hole in fixture front cover side, and the through-hole diameter is less than the thickness of the fixture front cover.
Further, the frame structure shape of the fixture rear cover and the frame structure shape of front cover are consistent, internal
Including third fixed groove, the third fixed groove surrounds frame structure, preferably the frame geometric form of third fixed groove
The geometry of shape and the first fixed groove is consistent, and the third fixed groove depth is less than the thickness of the fixture rear cover
Degree.
Further, the frame peripheral size of the fixture rear cover is identical as the frame peripheral size of the fixture front cover.
Further, the rear frame geometry of Cover Gasket and the geometry of third fixed groove are consistent,
Size is corresponding with third fixed groove, and the thickness of the rear Cover Gasket is slightly less than the depth of the third fixed groove.
Further, the frame shape of the cushion is regular geometric shapes, and center has a geometry through-hole, institute
The geometry of the shape and second fixed groove of stating geometry through-hole is consistent.
Further, the frame of the metal electrode be three-dimensional circular, the geometry and size of metal electrode inner ring with
The geometry and size of the pass through openings are consistent, the geometry and size and the second anchor of metal electrode outer ring
The geometry and size of slot are consistent.
Further, the external round metal bars of the metal electrode, the pole and metal electrode can be considered as one, circle
The diameter of stick is identical as the depth of the second fixed groove, the length of pole with when metal electrode be embedded in second fixed groove,
Pole passes through above-mentioned fixture front cover side through-hole and has a little leak out to be advisable.
Further, the metal electrode and round metal bars are preferably same metal material, preferably copper material.
Further, described to stretch out the connection knot that block is cube or cylinder body and cylindrical main body is linked together
Structure is equipped with conducting wire via hole in the stretching block, and cylindrical main body can be with fixture front cover side through-hole in the stretching block
Tightly it is connected.
Further, there are through-hole, and the number of the through-hole in the edge of the gentle punching pad of the front cover, rear cover, rear Cover Gasket
Be it is multiple, in being arranged in a one-to-one correspondence.
Further, the cushion and rear Cover Gasket are corrosion-resistant, insulation and flexible material, such as silica gel etc..
In one embodiment, as shown in figures 1 to 6, the frame of the fixture front cover 1 is rectangle, and inside includes first solid
Determine groove 101, the second fixed groove 102 and pass through openings 103, first fixed groove 101, second fixed groove
102 and the pass through openings 103 respectively surround frame structure, preferably the first fixed groove 101 is rectangle, the second fixed groove
102 and pass through openings 103 be circle.
The size of first fixed groove 101 is less than the frame size of fixture front cover 1, second fixed groove 102
Diameter less than the size on any one side of the first fixed groove 101, the diameter of the pass through openings 103 is slightly less than the second anchor
The depth of the diameter of slot 102, first fixed groove 101 and second fixed groove 102 is respectively less than the fixture front cover 1
Thickness；
The depth of first fixed groove 101 adds the pass through openings 103 plus the depth of the second fixed groove 102
Depth be exactly equal to the thickness of the fixture front cover.
There is a through-hole 104 in fixture front cover side, and 104 diameter of through-hole is less than the thickness of the fixture front cover 1.
The frame of the fixture rear cover 2 is rectangle, and inside includes third fixed groove 201, the third fixed groove 201
Frame structure is surrounded, preferably third fixed groove 201 is rectangle, and 201 depth of third fixed groove is less than the fixture
The thickness of rear cover 2.
The frame peripheral size of the fixture rear cover 2 is identical as the frame peripheral size of the fixture front cover 1.
The frame of Cover Gasket 3 is rectangle after described, and size is corresponding with third fixed groove 201, the thickness of the rear Cover Gasket 3
Degree is slightly less than the depth of the third fixed groove 201.
The frame of the cushion 4 be rectangle, center have a circular through hole 401, the diameter of the circular through hole 401 with
Second fixed groove, 102 diameter is identical.
The frame of the metal electrode 5 is circular ring shape, the diameter phase of diameter of a circle and pass through openings 103 in metal electrode 5
Together, the outer diameter of a circle of metal electrode is identical as the diameter of the second fixed groove 102.
The external round metal bars 501 of the metal electrode 5, the pole 501 can be considered as one with metal electrode 5, circle
The diameter of stick 501 is identical as the depth of the second fixed groove 102, and the length of pole 501 is to be embedded in described second when metal electrode 5
Fixed groove 102, pole 501 pass through above-mentioned fixture front cover side through-hole 104 and have a little leak out to be advisable.
The metal electrode 5 and round metal bars 501 are preferably same metal material, preferably copper material.
It is described to stretch out the connection structure that block 6 is rectangular body 601 and cylindrical main body 602 is linked together, the stretching block 6
In be equipped with conducting wire via hole 603, cylindrical main body 602 can be with fixture front cover side through-hole 104 tightly in the stretching block
It is connected, conducting wire is connected via the conducting wire via hole stretches out block and the metal electrode.Two openings are additionally provided on the stretching block 6
604, opening 604 can be used for accommodating support rod, the stretching block can be fixed on the electrolyte for being used for being electroplated by support rod
On container.
The front cover 1, rear cover 2, rear Cover Gasket 3 and cushion 4 edge have through-hole 105,202,301,402, and it is described
The number of through-hole be it is multiple, in being arranged in a one-to-one correspondence；Specifically, multiple corners of the front cover 1 are respectively equipped with through-hole
105, the middle part of the cushion is equipped with through-hole 401, and multiple corners are respectively equipped with through-hole 402, multiple corners of the rear Cover Gasket 3
It is respectively equipped with through-hole 301, multiple corners of the rear cover 2 are respectively equipped with through-hole 202；Through-hole 105, through-hole 402, through-hole 301 and
The position of through-hole 202 is corresponding, can be sequentially connected by screw, thus the fixed front cover 1, cushion 4, rear Cover Gasket 3 and rear cover
2, in plating, wafer wears above-mentioned through-hole 105,402,301,202 between rear Cover Gasket 3 and cushion 4, through screw,
And then the wafer is clamped between the cushion and rear Cover Gasket, metal can be attached to the crystalline substance by the through-hole 401
Circular surfaces.
After assembling, the metal electrode is located in the second fixed groove 102 of the front cover disclosure electroplating clamp,
The pole of metal electrode is stretched out from through-hole 104, external stretching block 6；Cushion 4 is located in the first fixed groove 101, rear Cover Gasket 3
In the third fixed groove 201 of rear cover, wafer is between rear Cover Gasket 3 and cushion 4 and is located at the first fixed groove
In 101, according to above-mentioned positional relationship place after, by screw cooperate through-hole be fixedly connected front cover, cushion, rear Cover Gasket and after
Lid.
The cushion and rear Cover Gasket are corrosion-resistant, insulation and flexible material, such as silica gel etc..
The electroplating clamp that the disclosure provides supports the wafer of sizes and shape, solves the one of semiconductor crystal wafer clamping
Cause property, ensure that the uniformity of coated metal, improve the assembly efficiency of semiconductor crystal wafer plating.
So far, attached drawing is had been combined the embodiment of the present disclosure is described in detail.According to above description, art technology
Personnel should have clear understanding to the disclosure.
It should be noted that in attached drawing or specification text, the implementation for not being painted or describing is affiliated technology
Form known to a person of ordinary skill in the art, is not described in detail in field.In addition, the above-mentioned definition to each element and method is simultaneously
It is not limited only to various specific structures, shape or the mode mentioned in embodiment, those of ordinary skill in the art can carry out letter to it
It singly changes or replaces.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the disclosed method should not be interpreted as reflecting the following intention: i.e. required to protect
The disclosure of shield requires features more more than feature expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out further in detail the purpose of the disclosure, technical scheme and beneficial effects
Describe in detail it is bright, it is all it should be understood that be not limited to the disclosure the foregoing is merely the specific embodiment of the disclosure
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (10)
1. a kind of electroplating clamp, comprising: front cover and rear cover；Wherein, the front cover includes: that top side, side, bottom side and perforation are opened
Mouthful；The first fixed groove and the second fixed groove, institute are successively arranged along the front cover thickness direction on the side of the front cover
It states the first fixed groove, the second fixed groove and pass through openings and extends to bottom side, first anchor from the front cover top side
Slot is used to accommodate the clamping object of the fixture, and second fixed groove is for accommodating metal electrode.
2. electroplating clamp according to claim 1 further includes rear Cover Gasket；Wherein, cover that be additionally provided with third solid after described
Groove is determined, for accommodating the rear Cover Gasket.
3. electroplating clamp according to claim 2, wherein the frame structure shape of the front cover is regular geometric shapes,
First fixed groove, second fixed groove and the pass through openings respectively surround frame structure, and described first is fixed
The depth of groove is equal to the thickness of the fixture front cover plus the depth of the second fixed groove and the depth of pass through openings.
4. electroplating clamp according to claim 3, wherein the frame geometry of first fixed groove and it is described before
The geometry of lid is consistent；The size of first fixed groove is less than the frame size of the front cover, second anchor
The area of slot is less than the area of first fixed groove, and the area of the pass through openings is less than the face of second fixed groove
Product.
5. electroplating clamp according to claim 4, wherein the frame structure shape of the fixture rear cover and the frame of front cover
Planform is consistent, and Outside Dimensions are identical as the frame peripheral size of the fixture front cover；The third fixed groove surrounds
Frame structure is consistent with the geometry of the first fixed groove；The third fixed groove depth is less than the fixture
The thickness of rear cover.
6. electroplating clamp according to claim 5 further includes cushion, shape is regular geometric shapes, and center has
One geometry through-hole, the shape of the geometry through-hole and the geometry of second fixed groove are consistent.
7. electroplating clamp according to claim 6, wherein the clamping object is chip, is set to the cushion with after
Between Cover Gasket；One or more first through hole are provided in the corner of the front cover, cushion, rear Cover Gasket and rear cover, this
The perforation direction of one through-hole is parallel with the thickness direction of the front cover, sequentially passes through the front cover, cushion, rear cover by screw
Pad and after the first through hole that covers to which the chip is fixed between the cushion and rear Cover Gasket.
8. electroplating clamp according to claim 7 further includes metal electrode, an external round metal bars, the round metal
Stick is integrated with metal electrode, and the diameter of pole is identical as the depth of the second fixed groove；It is additionally provided on the side of the front cover
Second through-hole, the extending direction of the second through-hole is vertical with the thickness direction of the front cover, so that being embedded in institute in the metal electrode
When stating the second fixed groove, the pole passes through second through-hole and stretches out second through-hole.
9. electroplating clamp according to claim 8, wherein the metal electrode is three-dimensional circular, metal electrode inner ring
The geometry and size of geometry and size and the pass through openings are consistent, the geometry of metal electrode outer ring and
Size and the geometry and size of second fixed groove are consistent.
10. electroplating clamp according to claim 9, further includes: stretch out block, wherein the stretching block includes:
One cube or cylinder body；And
With the cylindrical main body of the cube or cylinder body integrally connected；Conducting wire via hole, institute are equipped in the stretching block
The cylindrical main body for stating stretching block is connected by conducting wire with the round metal bars.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810319112.1A CN110359079A (en) | 2018-04-10 | 2018-04-10 | Electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810319112.1A CN110359079A (en) | 2018-04-10 | 2018-04-10 | Electroplating clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110359079A true CN110359079A (en) | 2019-10-22 |
Family
ID=68214258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810319112.1A Pending CN110359079A (en) | 2018-04-10 | 2018-04-10 | Electroplating clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110359079A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419649A (en) * | 1977-07-15 | 1979-02-14 | Hitachi Ltd | Wafer holding jig for electrtolytic plating |
| CN1908247A (en) * | 2005-06-20 | 2007-02-07 | 株式会社山本镀金试验器 | Electroplating jig |
| WO2009085337A2 (en) * | 2007-07-16 | 2009-07-09 | Advanced Research Corporation | Wafer fixture for wet process applications |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| JP2017137523A (en) * | 2016-02-01 | 2017-08-10 | アスカコーポレーション株式会社 | Semiconductor wafer |
-
2018
- 2018-04-10 CN CN201810319112.1A patent/CN110359079A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419649A (en) * | 1977-07-15 | 1979-02-14 | Hitachi Ltd | Wafer holding jig for electrtolytic plating |
| CN1908247A (en) * | 2005-06-20 | 2007-02-07 | 株式会社山本镀金试验器 | Electroplating jig |
| WO2009085337A2 (en) * | 2007-07-16 | 2009-07-09 | Advanced Research Corporation | Wafer fixture for wet process applications |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| JP2017137523A (en) * | 2016-02-01 | 2017-08-10 | アスカコーポレーション株式会社 | Semiconductor wafer |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
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Application publication date: 20191022 |