CN113235151A - 8 very little quick detach formula plating jig - Google Patents
8 very little quick detach formula plating jig Download PDFInfo
- Publication number
- CN113235151A CN113235151A CN202110521483.XA CN202110521483A CN113235151A CN 113235151 A CN113235151 A CN 113235151A CN 202110521483 A CN202110521483 A CN 202110521483A CN 113235151 A CN113235151 A CN 113235151A
- Authority
- CN
- China
- Prior art keywords
- handle
- cover plate
- main body
- quick
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- 239000010703 silicon Substances 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an 8-inch quick-release electroplating clamp which comprises a main body, wherein a conductive ring, a silicon wafer, a clamping ring, a middle cover plate and a cover plate main body are sequentially overlapped, a handle is arranged at the other end of the cover plate main body, which is far away from the middle cover plate, and a handle base connected with the handle is arranged at one end of the handle. The invention has the beneficial effects that: the quick-release handle drives the carrier sealing cover to rotate to press the placed wafer to seal the wafer, then the wafer is tightly attached together by the card selecting mechanism, and the multi-electrode design and the multi-point contact of the conducting plate are more uniform in current flow field density.
Description
Technical Field
The invention relates to the technical field of wafer electroplating, in particular to an 8-inch quick-release electroplating clamp.
Background
In the electroplating process, a wafer is often placed on a wafer electroplating fixture, a wafer conductive contact is designed on a conductive ring of the wafer electroplating fixture, the wafer conductive contact of the conductive ring is in contact with the wafer on the wafer electroplating jig, and the conductive ring is in contact with an external power supply to form a cathode. Cations in the plating solution are adsorbed onto the wafer during plating to form a plating layer.
The existing electroplating clamp is mainly designed by fixing screws as a main part, and is low in speed and low in efficiency because the screws are installed, so that fragments are extremely easy to be caused due to unbalanced stress in the disassembly process, and the sealing property is also greatly influenced.
Disclosure of Invention
The invention aims to provide an 8-inch quick-release electroplating clamp to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an 8 cun quick detach formula plating jig, includes the main part, be equipped with conductive loop, silicon wafer, snap ring, middle apron and the apron main part that superpose in proper order and set up in the main part, the apron main part is kept away from the other end of middle apron is equipped with the handle, handle one end is equipped with the handle base of being connected with it.
Preferably, the other end of the main body, which is far away from the conductive ring, is provided with a wire cover plate.
Preferably, a first sealing fluorine rubber pad is arranged between the conductive ring and the main body.
Preferably, a second sealing fluorine rubber pad, a first sealing ring and a second sealing ring are sequentially arranged between the silicon wafer and the clamping ring.
Preferably, the periphery of the conductive ring is also provided with an O-shaped terminal fixedly connected with the conductive ring.
Preferably, a wrench boss is fixedly arranged at one end, close to the handle, of the handle base, and a metal pin connected with the handle is arranged on the wrench boss.
Preferably, the upper end of the main body is provided with a hook cover plate connected with the main body, and a conductive hook fixedly connected with the main body is arranged on the hook cover plate.
Preferably, a plurality of contacts are arranged on the conductive ring, so that the current of the conductive ring flows to the silicon wafer more stably and uniformly.
Advantageous effects
According to the 8-inch quick-release electroplating clamp, the carrier sealing cover is driven by the quick-release handle to rotate and press the placed wafer to seal the wafer, then the wafer is tightly attached together by the card selecting mechanism, and the current flow field density of the wafer is more uniform due to the multi-electrode design and multi-point contact of the conducting plate.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an exploded view of the overall structure of the present invention.
Reference numerals
1-main body, 2-conductive ring, 3-first sealing fluorine rubber pad, 4-snap ring, 5-second sealing fluorine rubber pad, 6-O type terminal, 7-wire cover plate, 8-middle cover plate, 9-conductive hook, 10-hook cover plate, 11-silicon wafer, 12-cover plate main body, 15-handle, 17-first sealing ring, 18-handle base, 19-handle boss, 20-metal pin and 21-second sealing ring.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Examples
As shown in the figure 1-2, an 8-inch quick-release electroplating clamp comprises a main body 1, wherein a conductive ring 2, a silicon wafer 11, a snap ring 4, a middle cover plate 8 and a cover plate main body 12 are sequentially arranged on the main body 1 in a stacked manner, a handle 15 is arranged at the other end of the cover plate main body 12 far away from the middle cover plate 8, and a handle base 18 connected with the handle 15 is arranged at one end of the handle 15.
Preferably, the other end of the main body 1 away from the conductive ring 2 is provided with a wire cover plate 7.
Preferably, a first sealing fluorine rubber pad 3 is arranged between the conductive ring 2 and the main body 1.
Preferably, a second sealing fluorine rubber pad 5, a first sealing ring 17 and a second sealing ring 21 are sequentially arranged between the silicon wafer 11 and the retainer ring 4.
Preferably, the periphery of the conductive ring 2 is further provided with an O-shaped terminal 6 fixedly connected with the conductive ring.
Preferably, a wrench boss 19 is fixedly arranged at one end of the handle base 18 close to the handle 15, and a metal pin 20 connected with the handle 15 is arranged on the wrench boss 19.
Preferably, the upper end of the main body 1 is provided with a hook cover plate 10 connected with the main body, and a conductive hook 9 fixedly connected with the main body is arranged on the hook cover plate.
Preferably, the conductive ring 2 is provided with a plurality of contacts for making the current flow to the silicon wafer 11 more stably and uniformly.
Put anchor clamps in spacing desktop, open rotatory back lid with quick detach handle, the handle of covering after portable rotation takes down the lid, inhales the wafer with the vacuum suction pen and puts into the anchor clamps body, then takes up rotatory back lid and presses on the anchor clamps body and lock the lid with quick detach handle is rotatory, then puts into the plating bath and electroplates.
| Time to change disc | Electroplating effect | With or without internal leakage | Probability of fragmentation | |
| Common electroplating clamp | 300S | Thick in the middle and thin at the edge | Is provided with | 5% |
| 8 very little quick detach formula plating jig | 20S | Uniform thickness | Is free of | Is free of |
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the scope of the protection of the present invention.
Claims (8)
1. The utility model provides an 8 cun quick detach formula plating jig, includes main part (1), its characterized in that: the silicon wafer cover plate is characterized in that a conductive ring (2), a silicon wafer (11), a clamping ring (4), a middle cover plate (8) and a cover plate body (12) which are sequentially overlapped are arranged on the body (1), the cover plate body (12) is far away from the other end of the middle cover plate (8) and is provided with a handle (15), and one end of the handle (15) is provided with a handle base (18) connected with the handle.
2. The 8 inch quick-release electroplating clamp according to claim 1, characterized in that: the other end of the main body (1) far away from the conductive ring (2) is provided with a wire cover plate (7).
3. The 8 inch quick-release electroplating clamp according to claim 1, characterized in that: a first sealing fluorine rubber pad (3) is arranged between the conductive ring (2) and the main body (1).
4. The 8 inch quick-release electroplating clamp according to claim 1, characterized in that: and a second sealing fluorine rubber pad (5), a first sealing ring (17) and a second sealing ring (21) are sequentially arranged between the silicon wafer (11) and the clamping ring (4).
5. The 8 inch quick-release electroplating clamp according to claim 1, characterized in that: and O-shaped terminals (6) fixedly connected with the conductive ring (2) are arranged around the conductive ring.
6. The 8 inch quick-release electroplating clamp according to claim 1, characterized in that: the handle base (18) is close to one end of the handle (15) and is fixedly provided with a wrench boss (19), and the wrench boss (19) is provided with a metal pin (20) connected with the handle (15).
7. The 8 inch quick-release electroplating clamp according to claim 1, characterized in that: the upper end of the main body (1) is provided with a hook cover plate (10) connected with the main body, and a conductive hook (9) fixedly connected with the main body is arranged on the main body.
8. The 8 inch quick-release electroplating clamp according to claim 1, characterized in that: the conductive ring (2) is provided with a plurality of contacts for enabling the current to flow to the silicon wafer (11) more stably and uniformly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110521483.XA CN113235151A (en) | 2021-05-13 | 2021-05-13 | 8 very little quick detach formula plating jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110521483.XA CN113235151A (en) | 2021-05-13 | 2021-05-13 | 8 very little quick detach formula plating jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113235151A true CN113235151A (en) | 2021-08-10 |
Family
ID=77134061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110521483.XA Pending CN113235151A (en) | 2021-05-13 | 2021-05-13 | 8 very little quick detach formula plating jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113235151A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233400A (en) * | 1997-02-18 | 1998-09-02 | Casio Comput Co Ltd | Plated parts fixing jig and plating method using it |
| US20060283704A1 (en) * | 2005-06-20 | 2006-12-21 | Wataru Yamamoto | Electroplating jig |
| JP2008133526A (en) * | 2006-11-29 | 2008-06-12 | Fujikura Ltd | Plating tool |
| JP2009287093A (en) * | 2008-05-30 | 2009-12-10 | Yamamoto Mekki Shikenki:Kk | Cathode cartridge for electroplating |
| US20100240222A1 (en) * | 2007-07-16 | 2010-09-23 | Steve Fyten | Wafer fixture for wet process applications |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| CN211497836U (en) * | 2019-12-19 | 2020-09-15 | 安徽宏实自动化装备有限公司 | Press fixed wafer and electroplate and use two-sided hanger |
-
2021
- 2021-05-13 CN CN202110521483.XA patent/CN113235151A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233400A (en) * | 1997-02-18 | 1998-09-02 | Casio Comput Co Ltd | Plated parts fixing jig and plating method using it |
| US20060283704A1 (en) * | 2005-06-20 | 2006-12-21 | Wataru Yamamoto | Electroplating jig |
| JP2008133526A (en) * | 2006-11-29 | 2008-06-12 | Fujikura Ltd | Plating tool |
| US20100240222A1 (en) * | 2007-07-16 | 2010-09-23 | Steve Fyten | Wafer fixture for wet process applications |
| JP2009287093A (en) * | 2008-05-30 | 2009-12-10 | Yamamoto Mekki Shikenki:Kk | Cathode cartridge for electroplating |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| CN211497836U (en) * | 2019-12-19 | 2020-09-15 | 安徽宏实自动化装备有限公司 | Press fixed wafer and electroplate and use two-sided hanger |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210810 |