CN212476920U - Wafer double-side electroplating jig - Google Patents
Wafer double-side electroplating jig Download PDFInfo
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- CN212476920U CN212476920U CN202021281492.3U CN202021281492U CN212476920U CN 212476920 U CN212476920 U CN 212476920U CN 202021281492 U CN202021281492 U CN 202021281492U CN 212476920 U CN212476920 U CN 212476920U
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Abstract
The utility model provides a wafer double-sided electroplating jig, which comprises a main plate body and a pressing plate, wherein the pressing plate is detachably connected on the main plate body through a connecting piece, a first sealing ring and a first electrode plate which are contacted with the edge part of one surface of a wafer are arranged on the main plate body, a power supply connector is arranged on the main plate body, and the first electrode plate is electrically connected to the power supply connector through a wire; and the pressing plate is provided with a second sealing ring and a second electrode plate which are contacted with the edge part of the other surface of the wafer, and when the pressing plate is connected to the main plate body, the second electrode plate is electrically connected with the lead through a conductive piece. The utility model discloses compare in prior art, be connected to the negative pole of power through power connector, first electrode piece and second electrode piece are connected with the two surface electricity of wafer respectively, make the two-sided negative potential of taking simultaneously of wafer, electroplate the two-sided synchronization of wafer, have promoted electroplating efficiency.
Description
Technical Field
The utility model relates to a wet processing procedure technical field of wafer encapsulation specifically is a two-sided electroplating tool of wafer.
Background
During the wet process of wafer packaging, only the front side of the wafer is generally required to be processed. However, with the rapid development of IC manufacturing technology, people have made lighter, thinner and smaller requirements for the size of electronic products, and a scheme for making patterns on both sides of a wafer has appeared, which greatly improves the integration level of ICs and contributes to further reduction of the volume of electronic products. However, if the existing single-sided electroplating jig is adopted, the two sides of the wafer need to be electroplated separately in a plurality of times, which affects the electroplating efficiency, so the development of the jig for electroplating the two sides of the wafer simultaneously is needed.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a wafer double-sided electroplating jig.
In order to achieve the above object, the technical solution of the present invention is: a wafer double-sided electroplating jig comprises a main plate body and a pressing plate, wherein the pressing plate is detachably connected to the main plate body through a connecting piece, a first sealing ring and a first electrode plate which are in contact with the edge of one surface of a wafer are arranged on the main plate body, a power supply connector is arranged on the main plate body, and the first electrode plate is electrically connected to the power supply connector through a lead; and the pressing plate is provided with a second sealing ring and a second electrode plate which are contacted with the edge part of the other surface of the wafer, and when the pressing plate is connected to the main plate body, the second electrode plate is electrically connected with the lead through a conductive piece.
The utility model discloses compare in prior art, be connected to the negative pole of power through power connector, first electrode piece and second electrode piece are connected with the two surface electricity of wafer respectively, make the two-sided negative potential of taking simultaneously of wafer, electroplate the two-sided synchronization of wafer, have promoted electroplating efficiency.
Further, the conductive member is a spring contact.
Further, the spring contact comprises an ejector pin, a sleeve and a pressure spring, the pressure spring is arranged between the ejector pin and the sleeve in a propping mode, the ejector pin is electrically connected with the lead or the first electrode plate, and when the pressing plate is installed on the main plate body, the top end of the ejector pin is in contact with the second electrode plate.
By adopting the preferable scheme, the conductive piece can still keep good electric conductivity after the pressing plate is disassembled and assembled for many times.
Further, the first electrode plate is annular, and the first sealing ring is also annular.
Furthermore, the first electrode plate is embedded in the first sealing ring, and a conductive contact surface of the first electrode plate, which is in contact with the wafer, is exposed out of the first sealing ring.
By adopting the preferable scheme, the first sealing ring is in contact sealing with one surface of the wafer, so that the first electrode plate is prevented from contacting the electroplating solution.
Furthermore, the first electrode plate is formed by combining a plurality of first arc-shaped electrode single sheets, the adjacent first arc-shaped electrode single sheets are not conducted, and each first arc-shaped electrode single sheet is connected to the power supply connector through an independent wire.
By adopting the preferable scheme, the uniform potential is provided for one surface of the wafer, and the thickness uniformity of the electroplated layer is improved.
Further, the second electrode plate is annular, and the second sealing ring is also annular.
Furthermore, the second electrode plate is embedded in the second sealing ring, and a conductive contact surface of the second electrode plate, which is in contact with the wafer, is exposed out of the second sealing ring.
By adopting the preferable scheme, the second sealing ring is in contact sealing with the other surface of the wafer, so that the second electrode plate is prevented from contacting the electroplating solution.
Furthermore, the second electrode plate is formed by combining a plurality of second arc-shaped electrode single sheets, the adjacent second arc-shaped electrode single sheets are not conducted, and each second arc-shaped electrode single sheet is provided with a conductive piece.
By adopting the preferable scheme, the equal potential is provided for the other surface of the wafer, and the thickness uniformity of the electroplated layer is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a cross-sectional view of an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a schematic structural diagram of another embodiment of the present invention;
FIG. 5 is a schematic view of the wafer double-sided plating jig placed in a plating apparatus.
Names of corresponding parts represented by numerals and letters in the drawings:
1-wafer double-side electroplating jig; 11-a main board body; 111-a first seal ring; 112-a first electrode sheet; 1121-first arc-shaped electrode monolith; 113-a wire; 114-power connection; 115-a conductive member; 12-a platen; 121-a second seal ring; 122-a second electrode sheet; 13-wafer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1 to 5, an embodiment of the present invention is: a wafer double-sided electroplating jig comprises a main plate body 11 and a pressing plate 12, wherein the pressing plate 12 is detachably connected to the main plate body 11 through a connecting piece, a wafer 13 is arranged between the main plate body 11 and the pressing plate 12, corresponding through holes are formed in the main plate body 11 and the pressing plate 12, the diameter of each through hole is slightly smaller than the outer diameter of the wafer, a first sealing ring 111 and a first electrode plate 112 which are in contact with the edge of one surface of the wafer 13 are arranged on the main plate body 11, a power supply connector 114 is arranged on the main plate body 11, and the first electrode plate 112 is electrically connected to the; the pressure plate 12 is provided with a second packing 121 and a second electrode pad 122 which are in contact with an edge portion of the other surface of the wafer 13, and the second electrode pad 122 is in contact with the conductive member 115 to be electrically connected to the conductive wire when the pressure plate 12 is coupled to the main plate body 11.
The beneficial effect of adopting above-mentioned technical scheme is: as shown in fig. 5, the power connector is connected to the cathode of the power supply, the first electrode plate and the second electrode plate are respectively electrically connected to two surfaces of the wafer, so that the two sides of the wafer are simultaneously provided with negative potentials, electrodes electrically connected to the anode of the power supply are respectively arranged on two sides of the wafer in the electroplating pool, and the two sides of the wafer are synchronously electroplated, thereby improving the electroplating efficiency.
In other embodiments of the present invention, the conductive member 115 is a spring contact. The spring contact comprises an ejector pin, a sleeve and a pressure spring, the pressure spring is arranged between the ejector pin and the sleeve in a propping mode, the ejector pin is electrically connected with the lead or the first electrode plate, and when the pressure plate is installed on the main plate body, the top end of the ejector pin is in contact with the second electrode plate. The beneficial effect of adopting above-mentioned technical scheme is: after the pressing plate is disassembled and assembled for many times, the conductive piece can still keep good electric conduction performance.
As shown in fig. 2, 3 and 4, in another embodiment of the present invention, the first electrode sheet 112 has a ring shape, and the first seal ring 111 also has a ring shape. The first electrode tab 112 is embedded in the first seal ring 111, and a conductive contact surface of the first electrode tab 112, which is in contact with the wafer 13, is exposed out of the first seal ring 111. The beneficial effect of adopting above-mentioned technical scheme is: the first sealing ring is in contact sealing with one surface of the wafer, so that the first electrode plate is prevented from contacting the electroplating solution.
As shown in fig. 4, in other embodiments of the present invention, the first electrode sheet 112 is formed by combining a plurality of first arc-shaped electrode single sheets 1121, adjacent first arc-shaped electrode single sheets 1121 are not conducted, and each first arc-shaped electrode single sheet 1121 is connected to a power supply connector through an independent wire 113. The beneficial effect of adopting above-mentioned technical scheme is: it is helpful to provide a uniform potential to a surface of the wafer and improve the thickness uniformity of the electroplated layer.
As shown in fig. 2 and 3, in other embodiments of the present invention, the second electrode sheet 122 is formed in a ring shape, and the second sealing ring 121 is also formed in a ring shape. The second electrode piece 122 is embedded in the second seal ring 121, and a conductive contact surface of the second electrode piece 122, which is in contact with the wafer, is exposed out of the second seal ring 121. The beneficial effect of adopting above-mentioned technical scheme is: the second sealing ring is in contact sealing with the other surface of the wafer, so that the second electrode plate is prevented from contacting electroplating solution.
In other embodiments of the present invention, the second electrode sheet is formed by combining a plurality of second arc electrode single sheets, and the adjacent second arc electrode single sheets are not connected to each other, and a conductive member is correspondingly disposed on the main board body for each second arc electrode single sheet. The beneficial effect of adopting above-mentioned technical scheme is: it is helpful to provide equal potential to the other surface of the wafer, and improve the thickness uniformity of the electroplated layer.
The above embodiments are only for illustrating the technical conception and the features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and the protection scope of the present invention can not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (9)
1. A wafer double-sided electroplating jig is characterized by comprising a main plate body and a pressing plate, wherein the pressing plate is detachably connected to the main plate body through a connecting piece, a first sealing ring and a first electrode plate which are in contact with the edge of one surface of a wafer are arranged on the main plate body, a power supply connector is arranged on the main plate body, and the first electrode plate is electrically connected to the power supply connector through a wire; and the pressing plate is provided with a second sealing ring and a second electrode plate which are contacted with the edge part of the other surface of the wafer, and when the pressing plate is connected to the main plate body, the second electrode plate is electrically connected with the lead through a conductive piece.
2. The wafer double-sided plating jig of claim 1, wherein the conductive member is a spring contact.
3. The wafer double-sided electroplating jig according to claim 2, wherein the spring contact comprises an ejector pin, a sleeve and a pressure spring, the pressure spring is arranged between the ejector pin and the sleeve in an abutting mode, the ejector pin is electrically connected with the lead or the first electrode plate, and when the pressure plate is mounted on the main plate body, the top end of the ejector pin is in contact with the second electrode plate.
4. The wafer double-sided plating jig of claim 1, wherein the first electrode sheet is annular, and the first sealing ring is also annular.
5. The wafer double-sided electroplating jig as claimed in claim 4, wherein the first electrode plate is embedded in the first sealing ring, and a conductive contact surface of the first electrode plate, which is in contact with the wafer, is exposed out of the first sealing ring.
6. The wafer double-sided electroplating jig as claimed in claim 5, wherein the first electrode plate is formed by combining a plurality of first arc-shaped electrode single pieces, adjacent first arc-shaped electrode single pieces are not conducted, and each first arc-shaped electrode single piece is connected to the power supply connector through an independent wire.
7. The wafer double-sided plating jig of claim 6, wherein the second electrode sheet is annular, and the second sealing ring is also annular.
8. The wafer double-sided plating jig of claim 7, wherein the second electrode plate is embedded in the second sealing ring, and a conductive contact surface of the second electrode plate, which is in contact with the wafer, is exposed out of the second sealing ring.
9. The wafer double-sided plating jig of claim 8, wherein the second electrode plate is formed by combining a plurality of second arc-shaped electrode single sheets, the adjacent second arc-shaped electrode single sheets are not conducted, and each second arc-shaped electrode single sheet is provided with a conductive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021281492.3U CN212476920U (en) | 2020-07-02 | 2020-07-02 | Wafer double-side electroplating jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021281492.3U CN212476920U (en) | 2020-07-02 | 2020-07-02 | Wafer double-side electroplating jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212476920U true CN212476920U (en) | 2021-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021281492.3U Active CN212476920U (en) | 2020-07-02 | 2020-07-02 | Wafer double-side electroplating jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212476920U (en) |
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2020
- 2020-07-02 CN CN202021281492.3U patent/CN212476920U/en active Active
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